JPH0227576Y2 - - Google Patents

Description

[Detailed description of the invention] (1) Technical field of the invention This invention relates to a connection structure for printed circuit boards used in electronic devices, etc., and specifically relates to a printed board connection structure that has high connection reliability and enables high-density terminal connections. Regarding the connection structure of plates.

(2) Prior art and problems As shown in Figure 1, the conventional connection between printed boards is to provide pins 2 on one printed board 1 of the printed boards 1 and 1' facing each other vertically, and There was one in which a connector 3 having spring contacts was provided on a printed board 1', and the pin 2 was inserted into the hollow hole 4 of the connector 3 so that the connection could be made by its elastic pressure. However, in this case, a force for inserting and removing the pins 2 is required, and the more pins 2 are installed, the more difficult the insertion and removal operation becomes. Furthermore, the area occupied by the connector 3 is large, resulting in a disadvantage that the mounting density of the terminals is reduced. On the other hand, if the printed circuit boards 1 and 1' are not connected to each other often, connection by soldering is preferable to connection by mechanical spring contacts as described above because the reliability of the connection is improved. Become. Conventionally, as shown in FIG. 2, a pin 6 is provided on one of the printed boards 5 and 5' facing each other vertically, and a pad 7 is provided on the other printed board 5'. Solder 8 on the top surface of
There was one in which the pins 6 and the pads 7 were brought into contact with each other and the contact portion was heated to melt the solder 8 and connect the printed boards 5 and 5'. . However, in this case, as shown in FIG. 3, if the printed boards 5, 5' are warped, some pins 6 will not be connected, resulting in a reduction in connection reliability.
Furthermore, it is difficult to control the amount of solder 8 plated on the top surface of the pads 7; if it is too little, the connection will be insufficient, and if it is too much, the solder 8 will flow down to the surface of the printed board 5', causing a short circuit between the pads 7. There was also the drawback of doing so.

(3) Purpose of the invention The present invention was made to solve the above problems, and its purpose is to provide a connection structure for printed circuit boards that has high connection reliability and enables high-density terminal connections. purpose.

(4) Structure of the invention According to the invention, the above object is to apply solder plating to at least the outer surface of the tip of the connecting portion of each printed board in a printed board formed by mounting at least two printed boards in stages. A connection terminal is provided by planting a plurality of thin wires at appropriate intervals, and the thin wires of the connection terminals of one printed board and the other printed board are made by vertically facing these printed boards. To provide a connection structure for printed boards, characterized in that both printed boards are connected by connecting the thin wires to each other by bringing them into contact so as to partially overlap each other and heating the contact portions. achieved by.

(5) Embodiments of the invention Hereinafter, embodiments of the invention will be described in detail based on the attached drawings.

FIG. 4 is an external perspective view showing a printed board connection structure according to the present invention. Large scale integrated circuit 9 on the surface
Two printed sheets 10 and 10', on which are mounted, are vertically opposed to each other. These printed boards 1
Connection terminal 11 provided at the connection part of 0, 10',
By connecting 11', both printed boards 10, 10' are electrically connected. Here, as shown in FIG. 5, a connecting terminal 11 is provided at the connecting portion of one printed board 10 by soldering, brazing, or the like. This connection terminal 1
1, as shown in FIG. 6, consists of a base 12 and a plurality of thin wires 13, 13, . . . planted on the base 12 at appropriate intervals. These thin wires 13, 13, . Solder 14 is plated. This solder 14 is heated and melted to enable interconnection of the connection terminals 11 and 11'.
Note that the solder 14 is plated with thin wires 13,1.
3... may be applied over the entire length. The other printed board 10' connected to the one printed board 10 facing the other is also provided with a connecting terminal 11' having similar thin wires 13', 13', . . . .

In order to connect these printed boards 10, 10' facing each other vertically, connect the thin wires 13, 13' of the connection terminals 11, 11' of one printed board 10 and the other printed board 10' as shown in FIG. As shown in FIG. 3, the central axes are brought into contact with each other so as to partially overlap each other. And both of the above printed boards 10,
10' into a heating furnace, etc., and the contact portion 15 is
If heated to a temperature near the melting point of solder, thin wire 1
The solder 14 applied to 3, 13' is melted to connect the connecting terminals 11, 11', and as a result, the printed boards 10, 10' are connected to each other. When disconnecting the printed boards 10, 10', the entire board may be placed in a heating furnace to melt the solder 14.

(6) Effect of the invention Since the invention is constructed as described above, the thin wires 13, 13' of the connecting terminals 11, 11' of both printed boards 10, 10' are brought into contact so as to partially overlap each other. By heating the printed board 1
Even if there is a warp of 0.10', the thin wire 13,1
Since the warp can be absorbed by the length 3', all the connection terminals 11, 11' can be reliably connected. Therefore, the reliability of printed board connections can be improved. In addition, the connection terminal 11,
Since the external dimensions of the connecting terminals 11' can be reduced, the mounting density of the connecting terminals 11, 11' can be increased. Furthermore, since the connecting terminals 11 and 11' have a plurality of thin wires 13 and 13' planted at appropriate intervals and are flexible, the printed board 1
When connecting 0 and 10', a large insertion/extraction force is not required, making the insertion/extraction operation easy.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram showing a conventional printed board connection structure using a connector with a spring contact and pins, and Figures 2 and 3 are explanatory diagrams showing a conventional printed board connection structure using pins and pads whose surfaces are soldered. FIG. 4 is an external perspective view showing the connection structure of a printed board according to the present invention, FIG. 5 is a front view showing a state in which connection terminals are attached to the printed board, and FIG.
The figure is a bottom view of the connection terminal, Figure 7 is an enlarged view of the thin line,
FIG. 8 is an enlarged front view showing a state in which two printed boards are connected by a connecting terminal. 10,10'...Printed board, 11,11'...
Connection terminal, 12...Base, 13, 13'...Thin wire, 14...Solder, 15...Connection part.

Claims (1)

[Scope of utility model registration request] In a printed board formed by mounting at least two printed boards in stages, a plurality of thin wires having at least the outer surface of the tip portion solder-plated are implanted at appropriate intervals at the connecting portion of each printed board. By providing connection terminals, making these printed boards face each other vertically, bringing the thin wires of the connection terminals of one printed board and the other printed board into contact so as to partially overlap each other, and heating the contact area. A printed board connection structure characterized in that the thin wires are connected to each other by solder to connect both printed boards.