JPH0227607U - - Google Patents
Info
- Publication number
- JPH0227607U JPH0227607U JP1988105792U JP10579288U JPH0227607U JP H0227607 U JPH0227607 U JP H0227607U JP 1988105792 U JP1988105792 U JP 1988105792U JP 10579288 U JP10579288 U JP 10579288U JP H0227607 U JPH0227607 U JP H0227607U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wedge bonding
- bonding wire
- utility
- sectional shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/533—Cross-sectional shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/533—Cross-sectional shape
- H10W72/534—Cross-sectional shape being rectangular
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Landscapes
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Description
第１図はこの考案によるワイヤーの一実施例に
係る断面図、第２図および第３図は従来例を示し
た断面図である。
係る断面図、第２図および第３図は従来例を示し
た断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 断面形状が楕円状であることを特徴とする
ウエツジボンデイング用ワイヤー。 (2) 上記ワイヤーはアルミニウム線からなる請
求項１記載のウエツジボンデイング用ワイヤー。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105792U JPH0227607U (ja) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105792U JPH0227607U (ja) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227607U true JPH0227607U (ja) | 1990-02-22 |
Family
ID=31338725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988105792U Pending JPH0227607U (ja) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227607U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04118942A (ja) * | 1990-09-10 | 1992-04-20 | Hitachi Ltd | ワイヤボンディング方法、およびその装置 |
-
1988
- 1988-08-10 JP JP1988105792U patent/JPH0227607U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04118942A (ja) * | 1990-09-10 | 1992-04-20 | Hitachi Ltd | ワイヤボンディング方法、およびその装置 |