JPH02276253A - Bonding agent applying device - Google Patents

Bonding agent applying device

Info

Publication number
JPH02276253A
JPH02276253A JP1098021A JP9802189A JPH02276253A JP H02276253 A JPH02276253 A JP H02276253A JP 1098021 A JP1098021 A JP 1098021A JP 9802189 A JP9802189 A JP 9802189A JP H02276253 A JPH02276253 A JP H02276253A
Authority
JP
Japan
Prior art keywords
nozzle
adhesive
semiconductor chip
size
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1098021A
Other languages
Japanese (ja)
Inventor
Seiji Goto
誠二 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP1098021A priority Critical patent/JPH02276253A/en
Publication of JPH02276253A publication Critical patent/JPH02276253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To make it possible to reduce significantly the control of a nozzle and the exchange manhour of the nozzle by a method wherein the title device is provided with a driving mechanism, which is mounted to a holder and at the same time, moves the nozzle in directions X, Y and Z to a semiconductor chip. CONSTITUTION:In this bonding agent applying device, a syringe 1 having a pastelike bonding agent 3 in it is provided with a nozzle 2a having a single injection hole regardless of the size of a semiconductor chip and a driving mechanism for moving this nozzle 2a in directions X, Y and Z is mounted to a holder 6. The moving distance of the nozzle is set according to the size of the chip 4, the agent 3 is continuously dripped through the nozzle 2a and the agent 3 is applied on the surface of the chip 4. In respect to a coating operation, the movement patterns of the nozzle corresponding to the sizes of the chips are stored i advance in the side of the applying device and the size of the chip has only to be simply set at the time of work. Thereby, the operation of this device can be automatically conducted.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置の製造に関し、特にダイボンディ
ング時に使用するペースト状接着材を基板側への塗布す
る接着剤塗布に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the manufacture of semiconductor devices, and more particularly to adhesive application in which a paste-like adhesive used during die bonding is applied to a substrate side.

〔従来の技術〕[Conventional technology]

第２図は従来の一例を示す接着剤装置の側面図である。 FIG. 2 is a side view of a conventional adhesive device.

従来、この橋の接着剤塗布装置は、同図に示すように、
接着剤３が充填されたシリジン１と、このシリジン１の
先端に取付けられたノズル８と、シリジン１を保持し、
上下方向に移動するホルダ６とから構成されていた。こ
の接着剤塗布装置を使用して半導体チップ４（図面では
平面図として描かれている）に接着剤３を塗布するとき
は、シリジン１の先端に取付けられた多数の噴出口をも
つノズル８を矢印の方向に上下運動させ、半導体チップ
４面に接着剤を滴下し、塗布状態９のように接着剤を塗
布していた。Conventionally, the adhesive application equipment for this bridge was as shown in the figure.
Holding the siridine 1 filled with the adhesive 3, the nozzle 8 attached to the tip of the siridine 1, and the siridine 1,
It consisted of a holder 6 that moves in the vertical direction. When applying the adhesive 3 to the semiconductor chip 4 (shown as a plan view in the drawing) using this adhesive applicator, the nozzle 8 with multiple spouting ports attached to the tip of the syringe 1 is used. While moving up and down in the direction of the arrow, the adhesive was dripped onto the surface of the semiconductor chip 4, and the adhesive was applied as in application state 9.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら上述した従来の接着剤塗布装置では、半導
体チップのサイズの大小に対応して、先端ノズル形状、
針の数・位置等を変えなければならないという欠点があ
る。また、このノズルの管理及び先端ノズルの交換に多
大な工数がかかるという欠点がある。However, in the conventional adhesive applicator described above, the shape of the tip nozzle is adjusted depending on the size of the semiconductor chip.
The disadvantage is that the number and position of needles must be changed. Another drawback is that it takes a lot of man-hours to manage the nozzles and replace the tip nozzles.

本発明の目的は、かかる問題を解消する接着剤塗布装置
を提供することにある。An object of the present invention is to provide an adhesive applicator that solves this problem.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の接着剤塗布装置は、接着剤が充填されたシリン
ジの先端に取り付けられたノズルと、このノズルを保持
するホルダとを有し、半導体チップ面に接着剤を塗布す
る接着剤塗布装置において、前記ホルダに取り付けられ
ているとともに前記半導体チップに対してＸ、Ｙ及びＺ
方向に前記ノズル移動する駆動機構とを備えて構成され
る。The adhesive applicator of the present invention has a nozzle attached to the tip of a syringe filled with adhesive and a holder that holds the nozzle, and is an adhesive applicator that applies adhesive to a semiconductor chip surface. , are attached to the holder and have X, Y, and Z positions relative to the semiconductor chip.
and a drive mechanism that moves the nozzle in the direction.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例を示す接着剤塗布装置の側面
図である。この接着剤塗布装置は、ペースト状の接着剤
３の入ったシリンジ１に、半導体チップの大小に関わら
ず、単一の噴出口のノズル２ａを設け、このノズル２ａ
を矢印に示すＸ。FIG. 1 is a side view of an adhesive coating device showing an embodiment of the present invention. In this adhesive application device, a syringe 1 containing a paste-like adhesive 3 is provided with a single nozzle 2a, regardless of the size of the semiconductor chip.
An arrow indicates an X.

Ｙ、Ｚ方向に移動させる駆動機構（図示せず）をホルダ
６に取付けたことである。それ以外は従来例と同じであ
る。また、半導体チップ４の寸法に応じて、ノズルの移
動距離を設定し、ノズル２ａより連続的に接着剤３を滴
下して、接着剤３を半導体チップ４の面に塗布すること
である。A drive mechanism (not shown) for moving in the Y and Z directions is attached to the holder 6. Other than that, it is the same as the conventional example. Further, the moving distance of the nozzle is set according to the dimensions of the semiconductor chip 4, and the adhesive 3 is applied to the surface of the semiconductor chip 4 by continuously dropping the adhesive 3 from the nozzle 2a.

塗布動作については、あらかじめ半導体チップの寸法に
対応したノズルの移動動作パターンを塗布することであ
る。Regarding the coating operation, coating is performed in advance using a movement pattern of the nozzle corresponding to the dimensions of the semiconductor chip.

塗布動作については、あらかじめ半導体チップの寸法に
対応したノズルの移動動作パターンを塗布装置側に記憶
させておくことにより、作業時には、半導体チップのサ
イズを設定するだけで、この接着剤塗布装置の動作が自
動的に行なえるようにしである。Regarding the coating operation, by storing the movement movement pattern of the nozzle corresponding to the size of the semiconductor chip in advance in the coating device, the operation of the adhesive coating device can be adjusted by simply setting the size of the semiconductor chip during work. This is so that it can be done automatically.

またノズル２ａの噴出口については、半導体素子サイズ
に対し共用化できるのであれば、−個のと限定するもの
ではない。さらに、接着剤の滴下についても、連続的で
なく、従来と同様に断続的に滴下しても同様の効果が得
られる。Further, the number of ejection ports of the nozzle 2a is not limited to - as long as it can be shared for the size of the semiconductor element. Furthermore, the same effect can be obtained even if the adhesive is dropped not continuously but intermittently as in the conventional case.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は半導体チップの大小に関
わらず、ノズル形状を変更する必要がなくなるので、ノ
ズルの管理及び、ノズルの交換工数が大幅に低減出来る
効果がある。このことは、特に今隆の半導体装置の多品
種小量生産化あるいは設備インライン化に対して特に大
きな効果が見込まれる。As described above, the present invention eliminates the need to change the nozzle shape regardless of the size of the semiconductor chip, and therefore has the effect of significantly reducing the number of nozzle management and nozzle replacement man-hours. This is expected to have a particularly great effect on Ima Taka's high-mix, low-volume production of semiconductor devices or in-line equipment.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す接着剤塗布装置の側面
図、第２図は従来の一例を示す接着剤塗布装置の側面図
である。 １・・・シリンジ、２ａ、８・・・ノズル、３・・・接
着剤、４・・・半導体チップ、６・・・ホルダ、９・・
・塗布状態。FIG. 1 is a side view of an adhesive applicator showing an embodiment of the present invention, and FIG. 2 is a side view of an adhesive applicator showing a conventional example. 1... Syringe, 2a, 8... Nozzle, 3... Adhesive, 4... Semiconductor chip, 6... Holder, 9...
・Coating condition.

Claims (1)

【特許請求の範囲】[Claims] 接着剤が充填されたシリンジの先端に取り付けられたノ
ズルと、このノズルを保持するホルダとを有し、半導体
チップ面に接着剤を塗布する接着剤塗布装置において、
前記ホルダに取り付けられているとともに前記半導体チ
ップに対してＸ、Ｙ及びＺ方向に前記ノズル移動する駆
動機構とを備えることを特徴とする接着剤塗布装置。An adhesive application device that has a nozzle attached to the tip of a syringe filled with adhesive and a holder that holds the nozzle, and applies adhesive to a semiconductor chip surface,
An adhesive application device comprising: a drive mechanism that is attached to the holder and moves the nozzle in X, Y, and Z directions relative to the semiconductor chip.
JP1098021A 1989-04-17 1989-04-17 Bonding agent applying device Pending JPH02276253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1098021A JPH02276253A (en) 1989-04-17 1989-04-17 Bonding agent applying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1098021A JPH02276253A (en) 1989-04-17 1989-04-17 Bonding agent applying device

Publications (1)

Publication Number Publication Date
JPH02276253A true JPH02276253A (en) 1990-11-13

Family

ID=14208224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1098021A Pending JPH02276253A (en) 1989-04-17 1989-04-17 Bonding agent applying device

Country Status (1)

Country Link
JP (1) JPH02276253A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194341A (en) * 1987-02-09 1988-08-11 Toshiba Corp Die bonding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194341A (en) * 1987-02-09 1988-08-11 Toshiba Corp Die bonding apparatus

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