JPH02276256A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH02276256A JPH02276256A JP9800189A JP9800189A JPH02276256A JP H02276256 A JPH02276256 A JP H02276256A JP 9800189 A JP9800189 A JP 9800189A JP 9800189 A JP9800189 A JP 9800189A JP H02276256 A JPH02276256 A JP H02276256A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- temperature
- injection
- sealing
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 31
- 238000002347 injection Methods 0.000 abstract description 19
- 239000007924 injection Substances 0.000 abstract description 19
- 230000007547 defect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の製造方法に関し、特に、トラン
スファ成形法による熱硬化性樹脂を使用する樹脂封止方
法に関するものである。以下、特にことわりのない限り
において、樹脂封止方法とは、トランスファ成形法によ
る樹脂封止方法であることとする。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a semiconductor device, and particularly to a resin sealing method using a thermosetting resin by transfer molding. Hereinafter, unless otherwise specified, the resin sealing method refers to a resin sealing method using a transfer molding method.
従来の樹脂封止方法においては、樹脂の射出過程から樹
脂の硬化過程にかけて、封止用金型の温度は、第２図に
示すように、常に一定に保たれるよう制御されて、樹脂
封止が行なわれていた。In the conventional resin encapsulation method, the temperature of the encapsulation mold is controlled to be kept constant from the resin injection process to the resin curing process, as shown in Figure 2, and the resin encapsulation is completed. A suspension was in place.
為に、硬化時間を短くすることが行なわれているが、樹
脂が熱硬化型であ、ることがら、短い時間に硬化させる
目的で、封止用金型温度を高く設定する必要があった。Therefore, efforts have been made to shorten the curing time, but since the resin is thermosetting, it was necessary to set the temperature of the sealing mold high in order to cure it in a short time. .
その為、樹脂の射出は高い温度条件下で行なわれていた
。Therefore, resin injection was performed under high temperature conditions.
樹脂封止過程においては、樹脂が一旦、溶融し、溶融し
た状態で金型内に射出、充填され、その後、硬化せしめ
ることが理想的であり、未充填等の樹脂外観不良が生じ
難い。In the resin sealing process, it is ideal that the resin is once melted, injected and filled into a mold in the molten state, and then hardened, so that defects in resin appearance such as unfilled resin are unlikely to occur.
しかし、高い温度条件下で、樹脂の射出が行なわれると
、金型的各部に充填が完了する前に、樹脂の硬化が始ま
ってしまい、未重点等の樹脂外観不良が生じ易くなると
いう欠点があった。However, when resin is injected under high temperature conditions, the resin begins to harden before filling is completed in each part of the mold, which has the disadvantage that resin appearance defects such as unfilled spots are likely to occur. there were.
特に、大型の樹脂封止金型においては、−回の封止に要
する樹脂量が多くなるのに伴い、射出時間が長くなるこ
とから、射出過程で樹脂の硬化が始まり易く、未充填不
良もより発生し易かった。In particular, in large resin-sealed molds, the injection time increases as the amount of resin required for one sealing increases, so the resin tends to harden during the injection process, leading to unfilled defects. It was more likely to occur.
本発明の目的は、硬化時間を変えることなく、生産効率
を維持しながら、従来生じ易かった未充填等の樹脂の外
観不良を生じ難くすることができる樹、脂封止方法によ
る半導体装置の製造方法を提供することにある。An object of the present invention is to manufacture semiconductor devices using a resin/resin sealing method that can prevent resin appearance defects such as unfilling, which were easily caused in the past, while maintaining production efficiency without changing curing time. The purpose is to provide a method.
本発明の樹脂封止法王は、封止用金型の温度を低く設定
した状態で、樹脂の射出を完了させて、その直後、封止
用金型の温度を上昇させながら、樹脂を硬化させるもの
である。In the resin sealing method of the present invention, resin injection is completed with the temperature of the sealing mold set low, and immediately after that, the resin is cured while raising the temperature of the sealing mold. It is something.
次に、本発明の実施例について、数値を上げて、且つ、
数値と図示して、具体的に説明する。Next, regarding the examples of the present invention, the numerical values are increased, and
A specific explanation will be given using numerical values and diagrams.
本発明による樹脂封止条件例を以下に記述する。Examples of resin sealing conditions according to the present invention will be described below.
射出過程における封止用金型温度・・・１５０°Ｃ硬化
過程における封止用金型温度・・１５０°Ｃがら連続上
昇最大１８０℃
射出時間 ・・・１５秒硬化時間
・・・１２０秒比較の為に、第
２図に従来の樹脂封止方法における、封止用金型温度を
示す。樹脂封止の過程と無関係に一定温度１６５℃に制
御している。第１図に本実施例における、封止用金型の
温度推移を示す。Ａは、樹脂封止の一サイクルの時間で
あり、同様にＢは、射出過程、Ｃは硬化過程、Ｄは、硬
化終了から次の射出開始までの時間を示す。Sealing mold temperature during the injection process: 150°C Sealing mold temperature during the curing process: Continuous increase from 150°C to max. 180°C Injection time: 15 seconds Cure time: 120 seconds Comparison For this reason, FIG. 2 shows the sealing mold temperature in the conventional resin sealing method. The temperature is controlled at a constant temperature of 165° C. regardless of the resin sealing process. FIG. 1 shows the temperature change of the sealing mold in this example. A is the time of one cycle of resin sealing, B is the injection process, C is the curing process, and D is the time from the end of curing to the start of the next injection.
本発明においては、樹脂封止の一サイクル中に、封止用
金型の温度を上昇又は加工の制御を行なう必要がある為
、制御機能を樹脂封止装置に付加する必要がある。In the present invention, it is necessary to increase the temperature of the sealing mold or control the processing during one cycle of resin sealing, so it is necessary to add a control function to the resin sealing apparatus.
本発明によれば、樹脂の射出過程において、封止用金型
の温度を低く設定することにより、樹脂の溶融状態にあ
る時間が長くなることがら、溶融している状態で射出を
終了し、封止用金型的各部への充填を完了させることが
出来る為、未充填等の樹脂の外観不良を生じ難くする効
果がある。According to the present invention, in the resin injection process, by setting the temperature of the sealing mold low, the time that the resin is in a molten state becomes longer, so the injection is finished while the resin is in a molten state, Since filling into each part of the sealing mold can be completed, it has the effect of making it difficult to cause defects in the appearance of the resin such as unfilled parts.
次に、射出終了直後より、金型温度を上昇させることに
よって、樹脂の効果時間が長くならない様にすることが
出来る０本発明の効果をまとめると、効果時間を変えず
して、即ち生産能率を維持しながら、従来生じ易かった
未充填等の樹脂の外観不良を生じ難くすることである。Next, by increasing the mold temperature immediately after injection ends, the effective time of the resin can be prevented from becoming longer.To summarize the effects of the present invention, the effect of the present invention is to increase production efficiency without changing the effective time. The objective is to make it difficult for the appearance defects of the resin, such as unfilling, which were easily caused in the past, to occur while maintaining the above properties.
第１図は本発明の一実施例を説明するための封止用金型
の温度推移を示す図、第２図は、従来の樹脂封止方法に
おける、封止用金型の温度推移を示す図である。
Ａ・・・樹脂封止の一サイクルの時間、・Ｂ・・・射出
過程の時間、Ｃ・・・硬化過程の時間、Ｄ・・・硬化終
了から次の射出開始までの時間。FIG. 1 is a diagram showing the temperature transition of the sealing mold for explaining one embodiment of the present invention, and FIG. 2 is a diagram showing the temperature transition of the sealing mold in the conventional resin sealing method. It is a diagram. A... Time for one cycle of resin sealing, B... Time for injection process, C... Time for curing process, D... Time from completion of curing to start of next injection.
Claims (1)
おいて、封止用金型内に樹脂を射出する過程における封
止用金型の温度と、樹脂を硬化させる過程における封止
用金型の温度が異なることを特徴とする半導体装置の製
造方法。In the process of resin encapsulation of semiconductor devices using the transfer molding method, the temperature of the encapsulation mold during the process of injecting the resin into the encapsulation mold and the temperature of the encapsulation mold during the process of curing the resin are different. A method for manufacturing a semiconductor device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9800189A JPH02276256A (en) | 1989-04-17 | 1989-04-17 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9800189A JPH02276256A (en) | 1989-04-17 | 1989-04-17 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02276256A true JPH02276256A (en) | 1990-11-13 |
Family
ID=14207437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9800189A Pending JPH02276256A (en) | 1989-04-17 | 1989-04-17 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02276256A (en) |
-
1989
- 1989-04-17 JP JP9800189A patent/JPH02276256A/en active Pending
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