JPH02277249A - Sealing-resin coating of semiconductor element - Google Patents

Abstract

PURPOSE:To coat a sealing resin of a definite quantity by recovering an excess sealing resin when a circuit substrate is coated excessively. CONSTITUTION:A semiconductor element 2 which has been mounted on a circuit substrate 1 is coated excessively with a sealing resin 4 by using a dispenser 4. Simultaneously with a lowering operation of a resin recovery part 9 onto the circuit substrate 1 on a stage, the excess sealing resin 4 is sucked into a pipe; when the sealing resin 4 of a definite quantity is left, the resin recovery part 9 is raised. That is to say, only the sealing resin 4 sucked by using the resin recovery part 9 is returned to a resin recovery container. Thereby, it is possible to control a resin quantity to be left on the circuit substrate to a proper quantity and to coat the sealing resin of the definite quantity.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a sealing resin coating method for sealing with resin a semiconductor element mounted on a circuit board.

[Summary of the Invention 1 This invention provides a method for applying a sealing resin for a semiconductor element.
By collecting excess sealing resin when excessively applied onto the circuit board, it is possible to apply a constant amount of sealing resin.

[Prior Art] Conventionally, as shown in FIG. 2, a sealing resin 4 dispensed by a dispenser device 8 is applied within the frame of a sealing gum 3 onto a semiconductor element 2 mounted on a circuit board l. are doing. In order to uniformly apply the sealing resin 4, the usual method of dispensing the sealing resin 4 is to use a dispenser with high resolution or a dispenser with temperature control to apply a fixed amount of the resin.

[Problems to be solved by the invention] However, in the conventional semiconductor device sealing method as described above, even if the above-mentioned high-performance dispenser is used, the viscosity of the resin itself changes depending on the temperature environment, and the amount of resin in the syringe changes. Because variations in the discharge amount occur due to changes in the balance between There are problems such as the wire bonding wire being exposed because the sealing resin does not flow all the way to the outer periphery.On the other hand, if the amount of sealing resin is too large, the viscosity of the resin may temporarily decrease during heat curing. As a result, there is a risk that the surface tension of the sealing dam will exceed the surface tension limit and flowing out of the sealing dam, making it extremely difficult to control the amount of resin.

[Means for Solving the Problems] This invention has been made to solve the above problems, and even if there is variation in the discharge amount of the dispenser, the sealing resin is Apply the
In the next step, by recovering the excess sealing (b1 fat), it becomes possible to apply an appropriate sealing resin to the semiconductor elements on the circuit board.

[Function] By using the sealing resin application method of the present invention as described above, it becomes possible to easily absorb variations in the amount of resin dispensed by the dispenser, and moreover, the height of the resin recovery section can be adjusted. By changing , the desired sealing height can be controlled.

[Example] Below, an example of the present invention will be described based on the drawings. FIG. 1 explains the steps of the sealing resin application method of the present invention. FIG. 1(a) shows excessive sealing with a dispenser 8 on the semiconductor element 2 mounted on the circuit board The step of applying the sealing resin 4, shown in FIGS. 1(b) and 1(c), is the step of absorbing the excess sealing resin into the vibrator 9A at the same time as the resin collecting section 9 descends onto the circuit board 1 on the next stage. , 1st
Figure (d) shows a process in which the resin recovery section 9 rises when a certain amount of sealing resin remains, and each of (a), (b), and (c)
) and (d), the coating process is completed.

Furthermore, in order to explain in detail the recovery mechanism of the sealing tM fat, referring to the explanatory diagram in FIG. , an excessive amount of sealing resin 4 is supplied on top of it in advance, and then the resin recovery part 9 is pushed down to remove the vibrator 9A.
Collect excess sealing resin through the tube. Excess sealing resin is absorbed into the resin recovery container 6.

In this invention, the sealing tB absorbed by the resin recovery section 9
Since only the resin 4 is collected in the resin recovery container 6, the amount of resin remaining on the circuit board 1 is controlled to an appropriate amount.

[Effect of the invention 1] As explained above, the present invention supplies an excessively applied sealing resin so that the resin is sufficiently spread within the area of the sealing dam, and then removes the excess amount in the next step. The simple method of recovery has the effect of appropriately controlling the amount of sealing resin.

FIG. 2 is an explanatory diagram of a sealing resin coating device for body elements.

・・Circuit board semiconductor element sealing dam ・Sealing resin resin collection container carrier tape dispenser Resin recovery department that's all Applicant: Seiko Electronics Industries Co., Ltd. Agent Patent Attorney Hayashi Nosuke

[Brief explanation of drawings]

Fig. 1 is a process explanatory diagram of the sealing 1fi4 resin coating method of the present invention, Fig. 2 is an explanatory diagram of the conventional resin coating method for semiconductor elements, and Fig. 3 is a process explanatory diagram of the sealing 1fi4 resin coating method of the present invention. \
2nd edition of Rinko Handobayashi's traditional Rinko 11 anti-grease coating
figure

Claims (1)

[Claims] A method for applying a sealing resin to a semiconductor element provided on a circuit board, including (a) a step of applying an excessive amount of the sealing resin onto the circuit board. (b) A step of recovering an excessive amount of the applied sealing resin. A method for applying a sealing resin for a semiconductor element, comprising: