JPH0227735U - - Google Patents
Info
- Publication number
- JPH0227735U JPH0227735U JP10665488U JP10665488U JPH0227735U JP H0227735 U JPH0227735 U JP H0227735U JP 10665488 U JP10665488 U JP 10665488U JP 10665488 U JP10665488 U JP 10665488U JP H0227735 U JPH0227735 U JP H0227735U
- Authority
- JP
- Japan
- Prior art keywords
- package
- locking means
- recess
- carrier
- accommodated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims 2
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案のＩＣキヤリアの第一実施例に
よる斜視図、第２図は第１図のＡ方向から見たＩ
Ｃキヤリアの部分拡大分解斜視図、第３図は本考
案によるロツク手段とスライダとの関係を示す部
分斜視図、第４図はロツク手段の変形例の部分斜
視図、第５図及び第６図は第二実施例によるキヤ
リア本体の部分斜視図及び部分縦断面図、第７図
は従来の半導体キヤリアの分解斜視図である。
１……キヤリア本体、２……凹部、５……ロツ
ク手段、６……支軸、７……スライダ、９……ピ
ン、Ｐ……ＩＣパツケージ。
Fig. 1 is a perspective view of the first embodiment of the IC carrier of the present invention, and Fig. 2 is an I seen from direction A in Fig. 1.
FIG. 3 is a partial perspective view showing the relationship between the locking means and the slider according to the present invention; FIG. 4 is a partial perspective view of a modification of the locking means; FIGS. 5 and 6. 7 is a partial perspective view and a partial longitudinal sectional view of a carrier main body according to a second embodiment, and FIG. 7 is an exploded perspective view of a conventional semiconductor carrier. DESCRIPTION OF SYMBOLS 1... Carrier body, 2... Recess, 5... Lock means, 6... Support shaft, 7... Slider, 9... Pin, P... IC package.
Claims (1)
Ｃパツケージのリード端子を挿入し得るように上
記凹部の周囲に沿つて列設された多数のスリツト
とを備えたキヤリア本体と、一端が上記キヤリア
本体に揺動可能に枢支され揺動することにより他
端部が上記凹部の角部に対し進入・退避し、進入
した位置にあるときは該凹部内に収容されたＩＣ
パツケージの角部を係止する爪部が形成されてい
るロツク手段と、上記キヤリア本体に摺動可能に
装着されていると共に上記ロツク手段と連結し往
復動することにより上記ロツク手段を揺動せしめ
得るスライダとから成るＩＣキヤリア。 (2) 前記凹部内に設けたＩＣパツケージの受け
部に該ＩＣパツケージを押圧するばねを設けたこ
とを特徴とする請求項(1)に記載のＩＣキヤリア
。 (3) 前記ロツク手段の爪部の収容されたＩＣパ
ツケージとの係合面は、先細り状のテーパ面又は
曲面をなしていることを特徴とする請求項(1)又
は(2)に記載のＩＣキヤリア。[Claims for Utility Model Registration] (1) Recessed portion and I for placing the IC package
A carrier body having a large number of slits arranged along the periphery of the recess so that lead terminals of a C-package can be inserted therein; The other end enters and retreats from the corner of the recess, and when it is in the entered position, the IC accommodated in the recess
A locking means is formed with a claw portion for locking a corner of the package, and the locking means is slidably attached to the carrier body and is connected to the locking means to reciprocate to swing the locking means. IC carrier consisting of a slider to obtain. (2) The IC carrier according to claim 1, wherein a spring for pressing the IC package is provided in the receiving part of the IC package provided in the recess. (3) The engaging surface of the claw portion of the locking means with the accommodated IC package has a tapered surface or a curved surface. IC carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10665488U JPH0723960Y2 (en) | 1988-08-12 | 1988-08-12 | IC carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10665488U JPH0723960Y2 (en) | 1988-08-12 | 1988-08-12 | IC carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0227735U true JPH0227735U (en) | 1990-02-22 |
| JPH0723960Y2 JPH0723960Y2 (en) | 1995-05-31 |
Family
ID=31340361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10665488U Expired - Lifetime JPH0723960Y2 (en) | 1988-08-12 | 1988-08-12 | IC carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723960Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224313A (en) * | 1993-01-22 | 1994-08-12 | Yamaichi Electron Co Ltd | IC carrier |
| WO2006097973A1 (en) * | 2005-03-11 | 2006-09-21 | Micronics Japan Co., Ltd. | Ic carrier, ic socket and method for testing ic device |
-
1988
- 1988-08-12 JP JP10665488U patent/JPH0723960Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224313A (en) * | 1993-01-22 | 1994-08-12 | Yamaichi Electron Co Ltd | IC carrier |
| WO2006097973A1 (en) * | 2005-03-11 | 2006-09-21 | Micronics Japan Co., Ltd. | Ic carrier, ic socket and method for testing ic device |
| US7884630B2 (en) | 2005-03-11 | 2011-02-08 | Micronics Japan Co., Ltd. | IC carrie, IC socket and method for testing IC device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723960Y2 (en) | 1995-05-31 |
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