JPH0227742U - - Google Patents
Info
- Publication number
- JPH0227742U JPH0227742U JP10620788U JP10620788U JPH0227742U JP H0227742 U JPH0227742 U JP H0227742U JP 10620788 U JP10620788 U JP 10620788U JP 10620788 U JP10620788 U JP 10620788U JP H0227742 U JPH0227742 U JP H0227742U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- terminal
- power terminal
- power
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図乃至第３図は本考案の実施例を示す図、
第４図は、従来の半導体装置の電源位置を示す図
、第５図は、中央部に電源端子を有する半導体装
置の例を示す図である。
１……パツケージ本体、２……リード端子、３
……電源リード端子、１２……品目を示す捺印、
１３……電源端子を示す捺印である。
1 to 3 are diagrams showing embodiments of the present invention,
FIG. 4 is a diagram showing the power supply position of a conventional semiconductor device, and FIG. 5 is a diagram showing an example of a semiconductor device having a power supply terminal in the center. 1...Package body, 2...Lead terminal, 3
... Power lead terminal, 12 ... Stamp indicating item,
13...This is a seal indicating a power supply terminal.
Claims (1)
を有し、該リードの中央部分に電源端子を有する
半導体装置において、電源端子の位置を表示し、
かつ、前記電源端子を他の端子と異なる形状とし
たことを特徴とする半導体装置。 (2) ＩＣを搭載し、平行する複数の外部リード
を有し、該リードの中央部分に電源端子を有する
半導体装置において、電源端子の位置を表示し、
かつ、前記電源端子を他の端子と異なるピツチと
したことを特徴とする半導体装置。[Claims for Utility Model Registration] (1) In a semiconductor device equipped with an IC, having a plurality of parallel external leads, and having a power terminal in the center of the lead, the position of the power terminal is indicated,
Further, a semiconductor device characterized in that the power supply terminal has a shape different from that of other terminals. (2) In a semiconductor device equipped with an IC, having a plurality of parallel external leads, and having a power terminal in the center of the leads, displaying the position of the power terminal;
A semiconductor device characterized in that the power supply terminal has a different pitch from other terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620788U JPH0227742U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620788U JPH0227742U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227742U true JPH0227742U (en) | 1990-02-22 |
Family
ID=31339511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10620788U Pending JPH0227742U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227742U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374098A (en) * | 2001-04-13 | 2002-12-26 | Yamaha Corp | Semiconductor package and method of mounting semiconductor package |
-
1988
- 1988-08-10 JP JP10620788U patent/JPH0227742U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374098A (en) * | 2001-04-13 | 2002-12-26 | Yamaha Corp | Semiconductor package and method of mounting semiconductor package |
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