JPH0332425U - - Google Patents
Info
- Publication number
- JPH0332425U JPH0332425U JP1989092461U JP9246189U JPH0332425U JP H0332425 U JPH0332425 U JP H0332425U JP 1989092461 U JP1989092461 U JP 1989092461U JP 9246189 U JP9246189 U JP 9246189U JP H0332425 U JPH0332425 U JP H0332425U
- Authority
- JP
- Japan
- Prior art keywords
- package
- chip
- ring
- terminals
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は、この考案の一実施例によるＩＣパツ
ケージの内部配線の一部を示す平面図、第２図は
、従来のＩＣパツケージの内部配線を示す平面図
、第３図は第２図に示すＡ部の拡大図である。
図において、１……外部端子、２……内部リー
ド群、３……ダイパツト、４……ＩＣチツプ、５
〜１２……パツケージの内部リード、１３〜２０
……ＩＣチツプ端子、２１〜２３……リング状の
配線である。なお、図中同一符号は同一、または
相当部分を示す。
FIG. 1 is a plan view showing part of the internal wiring of an IC package according to an embodiment of the invention, FIG. 2 is a plan view showing the internal wiring of a conventional IC package, and FIG. 3 is similar to FIG. It is an enlarged view of part A shown. In the figure, 1...external terminal, 2...internal lead group, 3...die pad, 4...IC chip, 5
~12...Package internal lead, 13~20
. . . IC chip terminals, 21 to 23 . . . Ring-shaped wiring. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
の間にリング状の１本または複数本の配線を付加
することによつて、ピンレイアウトを自由にでき
ることを特徴とするＩＣパツケージ。 An IC package characterized in that the pin layout can be made freely by adding one or more ring-shaped wires between the terminals of the IC chip and the internal leads of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989092461U JPH0332425U (en) | 1989-08-04 | 1989-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989092461U JPH0332425U (en) | 1989-08-04 | 1989-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332425U true JPH0332425U (en) | 1991-03-29 |
Family
ID=31641889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989092461U Pending JPH0332425U (en) | 1989-08-04 | 1989-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332425U (en) |
-
1989
- 1989-08-04 JP JP1989092461U patent/JPH0332425U/ja active Pending