JPH0227749U - - Google Patents

Info

Publication number
JPH0227749U
JPH0227749U JP10619788U JP10619788U JPH0227749U JP H0227749 U JPH0227749 U JP H0227749U JP 10619788 U JP10619788 U JP 10619788U JP 10619788 U JP10619788 U JP 10619788U JP H0227749 U JPH0227749 U JP H0227749U
Authority
JP
Japan
Prior art keywords
light
photosensitive element
sealed
resin
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10619788U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10619788U priority Critical patent/JPH0227749U/ja
Publication of JPH0227749U publication Critical patent/JPH0227749U/ja
Pending legal-status Critical Current

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Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の平面図、第２図は
断面図である。 １：半導体チツプ、２：透光性樹脂、４：遮光
性樹脂ホルダ、５：金属支持板、８：接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 光感応素子を含む半導体基板が透光性樹脂によ
    り封止され、その封止体の光感応素子への光入射
    面以外の面が遮光性樹脂よりなる付帯部分と接着
    されたことを特徴とする光半導体装置。
JP10619788U 1988-08-11 1988-08-11 Pending JPH0227749U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10619788U JPH0227749U (ja) 1988-08-11 1988-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10619788U JPH0227749U (ja) 1988-08-11 1988-08-11

Publications (1)

Publication Number Publication Date
JPH0227749U true JPH0227749U (ja) 1990-02-22

Family

ID=31339492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10619788U Pending JPH0227749U (ja) 1988-08-11 1988-08-11

Country Status (1)

Country Link
JP (1) JPH0227749U (ja)

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