JPS61199059U - - Google Patents

Info

Publication number
JPS61199059U
JPS61199059U JP1985082044U JP8204485U JPS61199059U JP S61199059 U JPS61199059 U JP S61199059U JP 1985082044 U JP1985082044 U JP 1985082044U JP 8204485 U JP8204485 U JP 8204485U JP S61199059 U JPS61199059 U JP S61199059U
Authority
JP
Japan
Prior art keywords
photoelectric conversion
glass
image sensor
mounting structure
conversion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985082044U
Other languages
English (en)
Other versions
JPH0749806Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985082044U priority Critical patent/JPH0749806Y2/ja
Publication of JPS61199059U publication Critical patent/JPS61199059U/ja
Application granted granted Critical
Publication of JPH0749806Y2 publication Critical patent/JPH0749806Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の密着型イメージセンサーの
実装構造の例を示す要部の断面図。第２図、第３
図、第４図は、従来の密着型イメージセンサーの
実装構造を示す要部の断面図。 １……光電変換素子、２，２′……ガラス基板
、３……入射光、４……ボンデイングワイヤー、
５……封止剤、６……光電変換素子駆動用集積回
路、７……光学接着剤、８……配線パターン電極
、９……セラミツク基板、１０……ガラスマスク
、１１……スペーサー、１２……光電変換材料。

Claims (1)

    【実用新案登録請求の範囲】
  1. 光電変換素子をガラス基板上へ、屈折率がガラ
    スに対し、０．９〜１．１倍の屈折率を有する透
    明な接着剤によつて接着することを特徴とする密
    着型イメージセンサーの実装構造。
JP1985082044U 1985-05-31 1985-05-31 イメージセンサの実装構造 Expired - Lifetime JPH0749806Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985082044U JPH0749806Y2 (ja) 1985-05-31 1985-05-31 イメージセンサの実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985082044U JPH0749806Y2 (ja) 1985-05-31 1985-05-31 イメージセンサの実装構造

Publications (2)

Publication Number Publication Date
JPS61199059U true JPS61199059U (ja) 1986-12-12
JPH0749806Y2 JPH0749806Y2 (ja) 1995-11-13

Family

ID=30629404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985082044U Expired - Lifetime JPH0749806Y2 (ja) 1985-05-31 1985-05-31 イメージセンサの実装構造

Country Status (1)

Country Link
JP (1) JPH0749806Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637072A (ja) * 1986-06-27 1988-01-12 Matsushita Electric Ind Co Ltd 密着形光電変換素子ユニツト
JP2011077554A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法
JP2011077555A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法
JP2011077553A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948954A (ja) * 1982-09-13 1984-03-21 Kyocera Corp 密着型読み取り装置
JPS6037194A (ja) * 1983-08-09 1985-02-26 株式会社東芝 ハイブリツド集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948954A (ja) * 1982-09-13 1984-03-21 Kyocera Corp 密着型読み取り装置
JPS6037194A (ja) * 1983-08-09 1985-02-26 株式会社東芝 ハイブリツド集積回路装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637072A (ja) * 1986-06-27 1988-01-12 Matsushita Electric Ind Co Ltd 密着形光電変換素子ユニツト
JP2011077554A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法
JP2011077555A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法
JP2011077553A (ja) * 2011-01-05 2011-04-14 Sony Corp 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法

Also Published As

Publication number Publication date
JPH0749806Y2 (ja) 1995-11-13

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