JPH0227761U - - Google Patents
Info
- Publication number
- JPH0227761U JPH0227761U JP10611588U JP10611588U JPH0227761U JP H0227761 U JPH0227761 U JP H0227761U JP 10611588 U JP10611588 U JP 10611588U JP 10611588 U JP10611588 U JP 10611588U JP H0227761 U JPH0227761 U JP H0227761U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonded
- pattern
- disposed
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 6
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の平面斜視図、第２図は本考案
の断面図、第３図は従来例の平面斜視図、第４図
は従来例の断面図である。
１……ＦＰＣ基板、２……露出パターン、３…
…接合パターン、４……側面端部、５……ガラエ
ポ基板（ベース基板）、６……端部接合パターン
、７……半田付部分、８……接合基板端部、９…
…側面露出パターン。
FIG. 1 is a perspective plan view of the present invention, FIG. 2 is a cross-sectional view of the present invention, FIG. 3 is a perspective plan view of a conventional example, and FIG. 4 is a cross-sectional view of the conventional example. 1...FPC board, 2...Exposed pattern, 3...
... Bonding pattern, 4... Side edge, 5... Glass epoxy board (base board), 6... Edge bonding pattern, 7... Soldering part, 8... End of bonded board, 9...
...Side exposure pattern.
Claims (1)
の接合パターンが巾広に配設されているベース基
板と、前記ベース基板上面に配設され、前記接合
パターン上面に対向して配設される露出パターン
が配設されている接合基板とで構成され、接続部
分が前記接合基板の側面露出パターン下面を含ん
で接合されている事を特徴とする基板の接続構造
。 In a connection structure for a board of a small electronic device, a base substrate has a wide bonding pattern at both ends, and an exposed pattern is disposed on the top surface of the base substrate and faces the top surface of the bonding pattern. What is claimed is: 1. A connection structure for a substrate, comprising a bonded substrate on which a bonded substrate is disposed, and a connecting portion is bonded to include a lower surface of a side surface exposed pattern of the bonded substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10611588U JPH0227761U (en) | 1988-08-11 | 1988-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10611588U JPH0227761U (en) | 1988-08-11 | 1988-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227761U true JPH0227761U (en) | 1990-02-22 |
Family
ID=31339338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10611588U Pending JPH0227761U (en) | 1988-08-11 | 1988-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227761U (en) |
-
1988
- 1988-08-11 JP JP10611588U patent/JPH0227761U/ja active Pending