JPH0227761U - - Google Patents

Info

Publication number
JPH0227761U
JPH0227761U JP10611588U JP10611588U JPH0227761U JP H0227761 U JPH0227761 U JP H0227761U JP 10611588 U JP10611588 U JP 10611588U JP 10611588 U JP10611588 U JP 10611588U JP H0227761 U JPH0227761 U JP H0227761U
Authority
JP
Japan
Prior art keywords
substrate
bonded
pattern
disposed
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10611588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10611588U priority Critical patent/JPH0227761U/ja
Publication of JPH0227761U publication Critical patent/JPH0227761U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本考案の平面斜視図、第２図は本考案
の断面図、第３図は従来例の平面斜視図、第４図
は従来例の断面図である。 １……ＦＰＣ基板、２……露出パターン、３…
…接合パターン、４……側面端部、５……ガラエ
ポ基板（ベース基板）、６……端部接合パターン
、７……半田付部分、８……接合基板端部、９…
…側面露出パターン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 小型電子機器の基板の接続構造において、両端
    の接合パターンが巾広に配設されているベース基
    板と、前記ベース基板上面に配設され、前記接合
    パターン上面に対向して配設される露出パターン
    が配設されている接合基板とで構成され、接続部
    分が前記接合基板の側面露出パターン下面を含ん
    で接合されている事を特徴とする基板の接続構造
    。
JP10611588U 1988-08-11 1988-08-11 Pending JPH0227761U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10611588U JPH0227761U (ja) 1988-08-11 1988-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10611588U JPH0227761U (ja) 1988-08-11 1988-08-11

Publications (1)

Publication Number Publication Date
JPH0227761U true JPH0227761U (ja) 1990-02-22

Family

ID=31339338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10611588U Pending JPH0227761U (ja) 1988-08-11 1988-08-11

Country Status (1)

Country Link
JP (1) JPH0227761U (ja)

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