JPH0227785A - Integrated circuit element and its manufacture - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an integrated circuit element for operating a display element or a light receiving element that requires two-dimensional driving, such as a liquid crystal display device, and a method for manufacturing this integrated circuit element. It is something.

2. Description of the Related Art A conventional method for mounting an integrated circuit device will be described with reference to the drawings. FIG. 7 shows a conventional example in which integrated circuit elements are mounted on a switching element array substrate.

A switching element array 2 is provided on a glass substrate 1, and an integrated circuit element 3 for driving the Y-axis and an integrated circuit element 4 for driving the X-axis are mounted around this.

The integrated circuit element 3 is arranged so as to be supplied with signals from both the upper and lower directions of the switching element array 2. The pass lines 5 , 6 of the integrated circuit elements 3 and 4 are arranged around the glass substrate 1 and continue to the external lead terminals 7 .

Problems to be Solved by the Invention However, as shown in FIG. 7, in the conventional configuration, the path lines 5 and 6 have a three-dimensionally intersecting region 8, which poses a problem in terms of signal insulation. Since the pass line 5.6 is necessarily arranged around the substrate 1, the interlayer insulating film (
There were also problems such as decreased reliability (not shown) and occurrence of defects such as pinholes.

Means for Solving the Problems The present invention solves the above-mentioned problems by providing a signal output pad arranged parallel to one side of a quadrilateral, and a signal output pad arranged parallel to one side opposite to the above-mentioned side. It is characterized by comprising a plurality of pads in areas where there are no integrated circuit driving pads and integrated circuit patterns, and conductive wiring arranged parallel to the other two sides orthogonal to the above two sides of the quadrilateral. The integrated circuit elements are mounted on an insulating substrate.

According to the present invention, with the above-described configuration, there is no three-dimensional intersection between path lines on an insulating substrate, and highly reliable three-dimensional wiring is automatically completed simply by mounting an integrated circuit element. Furthermore, since the pass line can be placed further inside the insulating substrate than in the past, the reliability of the wiring can be improved.

Further, the manufacturing process is simplified by separating the manufacturing process of the integrated circuit pattern from the manufacturing process of the conductive wiring arranged in the area where the integrated circuit pattern does not exist. That is, many integrated circuit elements for mounting on an insulating substrate have the same integrated circuit pattern. Therefore, compared to the case where the area where the integrated circuit pattern exists and the conductive wiring placed in the area where the integrated circuit pattern does not exist are manufactured at the same time, according to the manufacturing method of the present invention, the integrated circuit pattern is the same. Integrated circuit elements that differ only in conductive wiring can be manufactured more easily. In other words, without changing the entire integrated circuit pattern manufacturing process, only the conductive wiring at the end of the integrated circuit element can be manufactured to match the wiring on the insulating board for mounting, which is faster than when manufacturing at the same time. This simplifies the manufacturing process.

Embodiment Hereinafter, an integrated circuit element according to an embodiment of the present invention will be explained in detail with reference to the drawings.

FIG. 1 is a plan view of an integrated circuit element 11 for mounting on an insulating substrate. In order to make the following explanation easier to understand, the figure shows the main surface on the side where the pad is present among the two main surfaces of the integrated circuit element as seen through the main surface on the opposite side. In other words, it is an inverted symmetrical view of the main surface of the integrated circuit element on the side where the pad is present. The area indicated by 12 is an area where a pattern for an integrated circuit exists. In addition, a signal output pad 13 is parallel to one side of the quadrilateral integrated circuit element.
However, an integrated circuit driving pad and a dummy head 14 are arranged parallel to one side opposite to the above-mentioned side. Almost all of the signal output pads 13 are used for output, but only some of the integrated circuit drive pads 14 are actually used, and the rest are mainly used for adhesive mounting on an insulating substrate. Used to maintain strength and reliability. Here, this pad is called a dummy pad.

Pads 15 and 16 are used to change the order of pass lines according to the pads, and may be formed not only on one side of the integrated circuit pattern but also on both sides. Also, 19.2
0 is a conductive wiring connecting the pass line order change pads 15 and 16. Pass line order change pad 17.1g
are similarly connected by conductive wiring 21122.

FIG. 2 shows a pattern of pass lines on an insulating substrate. That is, 23, 24, and 25 are pass lines for driving the integrated circuit element 11, and are to be connected to integrated circuit driving pads 26, 27, and 28, respectively.

FIG. 3 shows how the integrated circuit element 11 of FIG. 1 is mounted on the insulating substrate of FIG. 2.

When a plurality of integrated circuit elements are mounted in a substantially straight line as shown in FIG. , just by mounting the integrated circuit element 11, highly reliable three-dimensional wiring is automatically completed using the conductive wirings 19 and 20.

In FIG. 4, the pass line 3O for driving the integrated circuit element is connected to the second
This figure shows a case in which there are more cases than those shown in the figure. When the integrated circuit element 11 of this example was used, the order of up to four pass lines could be changed by simply changing the pattern on the insulating substrate.

FIG. 5 shows how three or more pass line changing pads 40 are arranged on the conductive wiring 19, 20, 21, 22. According to this arrangement method, the wiring pattern on the insulating substrate can be made more flexible, and by connecting multiple pads to the same bus line, the contact resistance between the pads and the pass line can be lowered. .

FIG. 6 shows a switching element array using the integrated circuit elements of FIG. 1. Compared to the conventional case, the pass line 5.6 is arranged more inside the glass substrate 1, so that the reliability of the wiring of the pass line 5.6 can be improved. In this embodiment, no particular regulations were set regarding the method of manufacturing the integrated circuit element, but the manufacturing process can be simplified by manufacturing using the method described below. First, an integrated circuit pattern area is created using a conventional integrated circuit manufacturing process. However, conductive wiring placement areas 101 and 102 are provided at both ends of the integrated circuit pattern area 12.
Leave it. Conductive wiring in the process of forming the final wiring pattern or low resistance wiring 19.20.21.22
A protective film (not shown) is formed using a normal integrated circuit manufacturing process, and further, in the normal process,
A pad was formed.

In this way, the manufacturing process of the integrated circuit pattern area 12,
The manufacturing process for the conductive wiring arrangement regions 101 and 102 is separated. In this case, the conductive wiring arrangement regions are formed on both sides of the integrated circuit pattern, but they may be formed only on one side.

Even if both conductive wiring placement areas 101 and 102 are combined, the width of the integrated circuit element increases by 0. It is only about 5 mm, and wiring for grade crossings can be realized without increasing the size of the integrated circuit element. Also, the manufacturing process of the integrated circuit pattern area 12 and the conductive wiring arrangement area 101.1.
By separating the manufacturing process of 02, the integrated circuit pattern area 12 is the same, and the conductive wiring placement area 101 is the same.
．． Integrated circuit elements that differ only in 102 can be manufactured more easily.

Effects of the Invention As is clear from the above description, the integrated circuit element of the present invention includes a signal output pad arranged parallel to one side of a quadrilateral, and an integrated circuit arranged parallel to one side opposite to the above-mentioned side. It has a structure in which a plurality of pads are provided in areas where there are no driving pads and integrated circuit patterns, and conductive wiring is arranged parallel to the other two sides of the quadrilateral that are orthogonal to the above two sides. This has the effect of eliminating three-dimensional intersections of pass lines on the insulating substrate and improving the reliability of wiring.

In addition, by separating the manufacturing process for integrated circuit patterns and the manufacturing process for conductor wiring placed in areas where integrated circuit patterns do not exist, integrated circuit patterns can be manufactured without changing the manufacturing process for integrated circuit patterns at all. It is possible to manufacture only the conductive wiring placed in the area where there is no pattern for mounting according to the wiring on the insulating board for mounting, and it also has the effect that the manufacturing method is simpler than when manufacturing at the same time. .

[Brief explanation of the drawing]

FIG. 1 is a plan view of an integrated circuit device according to an embodiment of the present invention, FIG. 2 is a plan view showing a pass line pattern on an insulating substrate on which the integrated circuit device according to the present invention is mounted, and FIG.
The figure is a plan view showing how the integrated circuit device of FIG. 1 is mounted on the insulating substrate of FIG. 2, and FIG. FIG. 5 is a plan view showing an integrated circuit device in which the integrated circuit device shown in FIG. FIG. 7 is a plan view showing a switching element array using integrated circuit elements, and FIG. 7 is a plan view showing a switching element array using conventional integrated circuit elements. 11... Integrated circuit element, 12 @... Integrated circuit pattern area, 13... Signal output pad,
14... Integrated circuit driving/XI 'y pad and dummy pad, 15, 16, 17, 18.40...
Pass line order change pad, 19.20.21.22・Φ
・Conductive wiring, 101.102・Banken conductive wiring placement area. Name of agent: Patent attorney Shigetaka Kurino Please see Figure 8, Base Line - Click here to receive a copy.

Claims (2)

[Claims] (1) A signal output pad placed parallel to one side of the quadrilateral, an integrated circuit driving pad placed parallel to one side opposite the above side, and multiple pads placed in an area where there is no integrated circuit pattern. 1. An integrated circuit element comprising: conductive wiring arranged parallel to two other sides perpendicular to the two sides of the quadrilateral. (2) Manufacturing process for signal output pads arranged parallel to one side of the quadrilateral, integrated circuit drive pads arranged parallel to one side opposite the above-mentioned side, and the area where the integrated circuit pattern is arranged. , a plurality of pads are provided in an area where an integrated circuit pattern does not exist, and the manufacturing process is separated from the manufacturing process of conductive wiring arranged parallel to the other two sides orthogonal to the above two sides of the quadrilateral. A method for manufacturing an integrated circuit device.