JPH0227791A - Formation of printed circuit board - Google Patents
Formation of printed circuit boardInfo
- Publication number
- JPH0227791A JPH0227791A JP17747188A JP17747188A JPH0227791A JP H0227791 A JPH0227791 A JP H0227791A JP 17747188 A JP17747188 A JP 17747188A JP 17747188 A JP17747188 A JP 17747188A JP H0227791 A JPH0227791 A JP H0227791A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- circuit board
- conductive paste
- conductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title claims 2
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000012360 testing method Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性ペーストの半田付は性を大幅に向上させ
るプリント回路基板の形成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a method of forming printed circuit boards in which the soldering properties of conductive pastes are significantly improved.
熱可塑性樹脂基板上に導電性ペーストをスクリーン印刷
し、プリント回路基板を形成する方法はメンブレンスイ
ッチやタッチパネル等でエレクトロニクス産業分野では
広く一般に知られている方法である。The method of screen printing a conductive paste on a thermoplastic resin substrate to form a printed circuit board is a method widely known in the electronics industry for membrane switches, touch panels, etc.
又、ホットプレス又は、ホットローラー等により導体回
路を紙フエノール樹脂基板中に埋没させる方法は、リレ
ー回路等で摺動性を向上させる方法としてエレクトロニ
クス産業分野では広く一般に利用されている。Further, a method of embedding a conductor circuit in a paper phenolic resin substrate using a hot press or a hot roller is widely used in the electronics industry as a method for improving sliding properties in relay circuits and the like.
しかしながら、熱可塑性樹脂基板と導電性ペーストは密
着力が弱く、半田可能型銀ペースト及び低融点銀入り半
田を用いても、十分な半田接着強度を得ることができず
、電子部品の半田実装が出来ない欠点がある。又、紙フ
エノール基板へ導体回路を圧力と温度により埋没させる
方法は、リレー回路における摺動抵抗を低減させること
を目的としている。However, the adhesion between thermoplastic resin substrates and conductive paste is weak, and even when solderable silver paste and low-melting point silver-containing solder are used, sufficient solder bond strength cannot be obtained, making it difficult to solder-mount electronic components. There is a drawback that it cannot be done. Furthermore, the method of embedding a conductor circuit in a paper phenol substrate using pressure and temperature is aimed at reducing the sliding resistance in a relay circuit.
又、摺動性付与剤が導体回路の表面に塗布されており、
半田付けできない。In addition, a sliding property imparting agent is applied to the surface of the conductor circuit,
Can't solder.
本発明者は、かかる問題点、欠点を解決し、熱可塑性樹
脂基板に、導電性ペーストを用いて導体回路を形成し、
半田実装できる全く新しいプリント回路基板形成のため
に、鋭意研究を重ねた。The present inventor solved these problems and drawbacks by forming a conductive circuit on a thermoplastic resin substrate using a conductive paste,
We conducted extensive research to create a completely new printed circuit board that can be soldered.
その結果、プリント回路基板樹脂の軟化点以上に加温し
、プレス加圧（２０ｋｇ／ｃｍ”）することにより、導
体回路を熱可塑性樹脂基板内に埋没することができ、基
板と導体回路の密着力を大幅に高めること、又、その際
、導体回路内の導電性付与金属（Ａｇ、Ｃｕ、Ａｇ処理
Ｃｕ粉等２の充填密度が高くなり、導体回路の電気抵抗
値が大きく低下することを見いだした。As a result, by heating the printed circuit board resin above its softening point and pressurizing it (20 kg/cm"), it is possible to embed the conductor circuit in the thermoplastic resin board, and the board and the conductor circuit are tightly bonded. In addition, in this case, the packing density of the conductive metal (Ag, Cu, Ag-treated Cu powder, etc. 2) in the conductor circuit increases, and the electrical resistance value of the conductor circuit decreases significantly. I found it.
この事実により、単体回路の半田濡れ性は大幅に改善さ
れかつ半田密着強度は銅張りガラスエポキシ基板に匹敵
する値を得、本発明を完成した。Due to this fact, the solder wettability of the single circuit was greatly improved, and the solder adhesion strength was comparable to that of a copper-clad glass epoxy board, and the present invention was completed.
本発明は、熱可塑性樹脂基板上に導電性ペーストにより
導体回路を形成し、しかる後。In the present invention, a conductive circuit is formed on a thermoplastic resin substrate using a conductive paste, and then a conductive circuit is formed on a thermoplastic resin substrate.
前記導体回路を加熱及び加圧することにより基板中に埋
没させることを特徴とするプリント回路基板の形成方法
である。This method of forming a printed circuit board is characterized by embedding the conductor circuit in the board by heating and pressurizing the conductor circuit.
本発明において用いられる熱可塑性樹脂基板の材料は温
度と圧力により、導体回路が埋没できる程度に、軟化す
る樹脂材料であればよい。従ってＡＢＳ樹脂、ガラス繊
維強化ポリエステル樹脂、ポリカーボネート樹脂、ガラ
ス繊維強化ポリカーボネート樹脂、ポリフェニレンオキ
サイド樹脂等が利用できる。The material of the thermoplastic resin substrate used in the present invention may be any resin material that softens to the extent that the conductor circuit can be buried under temperature and pressure. Therefore, ABS resin, glass fiber reinforced polyester resin, polycarbonate resin, glass fiber reinforced polycarbonate resin, polyphenylene oxide resin, etc. can be used.
前記基板上に導電性ペーストにより導体回路を形成する
方法は特に制限されないがスクリーン印刷法が好適であ
る。The method of forming the conductive circuit using conductive paste on the substrate is not particularly limited, but a screen printing method is preferred.
本発明において、用いられる導電性ペーストは、本質的
に、半田付は可能な導電性ペーストであればよい。In the present invention, the conductive paste used may essentially be any conductive paste that can be soldered.
このような導電性ペーストとしては、例えば■リント−
ケミトロン製導電性銀ペースト、シントロンに−３４２
４をあげることができる。Examples of such conductive paste include ■lint
Chemitron conductive silver paste, Cintron-342
I can give you 4.
本発明において用いられる半田の種類は、導電性ペース
トに十分適合できる組成でなくてはならない。The type of solder used in the present invention must have a composition that is sufficiently compatible with the conductive paste.
〔実
特に、Ａｇ系導電性ペーストについては、Ａｇ含有量が
２〜３％の、Ａｇ食氷水防止処置施した半田を用いるの
がよい。[In fact, in particular, as for the Ag-based conductive paste, it is preferable to use solder with an Ag content of 2 to 3% and treated with Ag-edible ice water prevention treatment.
又、基板樹脂の耐熱性に応じて、融点の異なる半田をて
きぎ使い分けることが大切である。Furthermore, it is important to use solders with different melting points depending on the heat resistance of the substrate resin.
本発明における加熱及び加圧の方法は特に制限されない
が、ホットプレス、ホットロール等が好適である。又、
温度は、基板樹脂の軟化点よりも、やや高く圧力は、導
体回路を埋没できる圧力であればよい。The method of heating and pressurizing in the present invention is not particularly limited, but hot press, hot roll, etc. are suitable. or,
The temperature may be slightly higher than the softening point of the substrate resin, and the pressure may be a pressure that allows the conductor circuit to be buried.
施 例〕
実施例１
ガラス繊維強化ポリエステル樹脂基板（ユニチカ製、ユ
ニチカＧ−ＰＥＴ）上に、スクリーン印刷法により、半
田付は可能型導電製銀ペースト（＠シントーケミトロン
製、シントロンに−３４２４）を印刷し、これを電熱熱
風炉中で１５０℃で６０分間、焼き付は乾燥し、第１図
の様な試験用導体回路を形成した。Example] Example 1 A conductive silver paste that can be soldered (@Synto Chemitron, Shintron-3424) was applied to a glass fiber reinforced polyester resin substrate (Unitika, Unitika G-PET) by screen printing. This was printed and dried in an electric hot air oven at 150° C. for 60 minutes to form a test conductor circuit as shown in FIG.
導電体の膜厚は約１５〜２０μ、体積固有号
抵抗率は６×１０ Ω・１ であった、この試験用導体
回路をホットプレスにかけ導体回路を樹脂基板中に埋没
した。The film thickness of the conductor was approximately 15 to 20 μm, and the specific volume resistivity was 6×10 Ω·1. This test conductor circuit was hot-pressed and embedded in a resin substrate.
ホットプレス粂件は、プレス温度は１２５℃、プレス圧
は約２０ ｋｍ ／ ｃ♂、加圧時間は３秒である。For the hot press knitting material, the pressing temperature is 125°C, the pressing pressure is about 20 km/c♂, and the pressing time is 3 seconds.
ホットプレス後の導体回路は完全に基板中に埋没し、大
変に滑らかな、金属光沢のある表面状態を形成したにの
時の体積固有抵抗寸
率は２×１０ Ω・１であった。実験結果は第１図の様
であり、実用性の高いプリント回路基板を形成すること
ができた。After hot pressing, the conductive circuit was completely buried in the substrate, forming a very smooth surface with metallic luster, and the volume resistivity was 2×10 Ω·1. The experimental results are shown in FIG. 1, and a highly practical printed circuit board could be formed.
第１表 実験結果 尚、半田付は条件は次の様である。Table 1 Experimental results The conditions for soldering are as follows.
半田の種類 ：５ＴＲ−９３１３（■シントーケミト■
ン 製）半田方式 ：ペーパーリフロ一方式
気相温度は１５５〜１６０℃
実施例２
実施例１と同様に導電性銀ペーストを印刷し電熱熱風炉
中で１５０℃で３０分間焼き付は乾燥し、その後絶縁保
護コート（ＳＴＲ５１２０■シントーケミトロン製）を
２０〜２５μ（屹燥後の膜厚）塗布し、１５０℃で３０
分間焼付は乾燥し、第２図の様な試験用導体回路を形成
した。Type of solder: 5TR-9313 (■Shinto Chemito■
Soldering method: paper reflow one-way gas phase temperature 155-160°C Example 2 Conductive silver paste was printed in the same manner as in Example 1, baked in an electric hot air oven at 150°C for 30 minutes, and dried. After that, apply an insulation protection coat (STR5120 made by Shinto Chemitron) of 20 to 25 μm (film thickness after drying), and
After drying, a test conductor circuit as shown in FIG. 2 was formed.
当該試験板を実施例１と同条件でプレスした。ホットプ
レス後、絶縁保護コート及び導体回路は樹脂基板中に埋
没し、滑らかな表面状態を形成した。この試験板は、実
施例１と同じ、体積固有抵抗率、半田密着強度、半田濡
れ性を示した。The test plate was pressed under the same conditions as in Example 1. After hot pressing, the insulating protective coat and conductor circuit were buried in the resin substrate, forming a smooth surface. This test plate showed the same specific volume resistivity, solder adhesion strength, and solder wettability as in Example 1.
本発明の方法に従うと、従来半田付は実装のできなかっ
た熱可塑性ポリエステル基板にも、銅張り紙フエノール
基板又は銅張りガラスエポキシ基板兼の半田付は実装が
可能となり、全く新しい有効なプリント回路基板が実現
できる。According to the method of the present invention, it is now possible to mount copper-clad paper phenol boards or copper-clad glass epoxy boards by soldering, even on thermoplastic polyester boards that could not be mounted by soldering conventionally, creating a completely new and effective printed circuit board. can be realized.
基板材料的にも熱可塑樹脂は、全て利用でき、低融点半
田と半田付は性可能導電性ペースト（Ａｇ系、Ｃｕ系、
Ａｇ−Ｃｕ系等）との組み合わせにより、より安価なプ
リント回路基板が実現できる。All thermoplastic resins can be used as substrate materials, and low-melting point solders and conductive pastes (Ag-based, Cu-based,
A cheaper printed circuit board can be realized by combining it with Ag-Cu type etc.).
第１図及び第２図は基板１上に形成した試験用の導体回
路パターンを示す平面図でありＡは線幅１．０−膳、線
長１６ｃｍ＋のパターンＢはφ２關のパターン、Ｃは一
辺２龍の正方形のパターンを示す。
また第２図における斜線部は絶縁保護コート塗布部分を
示す。
特許出願人 神東塗料株式会社
箋ｚ１コFigures 1 and 2 are plan views showing conductor circuit patterns for testing formed on the substrate 1, where A is a line width of 1.0 cm and a line length of 16 cm+, pattern B is a φ2 pattern, and C is a pattern of about φ2. It shows a square pattern with two dragons on each side. Further, the shaded area in FIG. 2 indicates the area where the insulation protection coat is applied. Patent applicant: Shinto Paint Co., Ltd.
Claims (1)
び加圧することにより、基板中に埋没させることを特徴
とするプリント回路基板の形成方法。[Scope of Claims] A printed circuit board characterized in that a conductor circuit is formed on a thermoplastic resin substrate using a conductive paste, and then the conductor circuit is embedded in the substrate by heating and pressurizing the conductor circuit. Formation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17747188A JPH0227791A (en) | 1988-07-15 | 1988-07-15 | Formation of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17747188A JPH0227791A (en) | 1988-07-15 | 1988-07-15 | Formation of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227791A true JPH0227791A (en) | 1990-01-30 |
Family
ID=16031497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17747188A Pending JPH0227791A (en) | 1988-07-15 | 1988-07-15 | Formation of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227791A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002080637A1 (en) * | 2001-04-02 | 2002-10-10 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
| US7340825B2 (en) * | 2006-07-06 | 2008-03-11 | Harris Corporation | Method of making a transformer |
| US7381902B2 (en) | 2003-10-01 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Wiring board and method of manufacturing the same |
| CN100438724C (en) * | 2003-03-03 | 2008-11-26 | 精工爱普生株式会社 | Manufacturing method of wiring substrate |
-
1988
- 1988-07-15 JP JP17747188A patent/JPH0227791A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002080637A1 (en) * | 2001-04-02 | 2002-10-10 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
| US6824857B2 (en) | 2001-04-02 | 2004-11-30 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
| CN100438724C (en) * | 2003-03-03 | 2008-11-26 | 精工爱普生株式会社 | Manufacturing method of wiring substrate |
| US7381902B2 (en) | 2003-10-01 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Wiring board and method of manufacturing the same |
| US7340825B2 (en) * | 2006-07-06 | 2008-03-11 | Harris Corporation | Method of making a transformer |
| US7391293B2 (en) | 2006-07-06 | 2008-06-24 | Harris Corporation | Transformer and associated method of making using liquid crystal polymer (LCP) material |
| US7509727B2 (en) | 2006-07-06 | 2009-03-31 | Harris Corporation | Method of making a transformer |
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