JPH0227972Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a structure of a solder gushing portion in an automatic soldering device, which is an apparatus for manufacturing printed circuit boards used in various electronic devices.

[Conventional technology]

As shown in FIGS. 4 and 6, the structure of a conventional solder gushing section is such that a helical shaft 3a is disposed horizontally at the upper end gushing port 1' of the gushing path 1 along the gushing port 1', and the helical shaft 3a
By connecting the helical shaft 3a to a driving source and rotating the helical shaft 3a in a fixed direction, a wavy surface is generated on the surface of the solder coming out from the outlet 1'.

Further, as shown in FIGS. 6 and 7, a large number of holes 3b', 3b', etc. were arranged in a row along the outlet 1' formed at the upper end of the solder outlet 1'. A diaphragm 3b is installed horizontally, the diaphragm 3b is connected to a vibration source, and the diaphragm 3b is vibrated in the horizontal direction to form a wavy surface on the surface of the solder that gushes out. There are also some that use an endless belt with holes for circulation.

[Problem that the invention attempts to solve]

However, the former of the above-mentioned conventional examples has a long helical shaft and is expensive to manufacture, and also requires special processing depending on the scale, making it difficult to convert to other uses.

Furthermore, the latter example requires a vibrator to apply vibrations, resulting in high costs. With other endless belts, even if the material is heat resistant, the temperature at which the solder melts is the lowest.
It is required to withstand high temperatures of 230 (℃) or higher, and even if there were rubber or synthetic resin that could withstand it, it would be extremely difficult for such organic materials to withstand long-term use. On the contrary, it has the disadvantage of being expensive and being less economical.

Therefore, the present invention attempts to improve the problems in the above-mentioned conventional example.

[Means for solving problems]

Two chains are stretched along the spout formed at the upper end of the solder gushing path, and are appropriately connected to a drive source so as to circulate in opposite directions.

[Effect]

A wavy surface is formed on the gushing surface by causing the solder rising through the gushing path to gush out between the links of the chain circulating in a fixed direction.

〔Example〕

Hereinafter, the present invention will be explained in detail with reference to the embodiments shown in the drawings.As shown in Figs. , a sprocket wheel 2 1 pivotally mounted at both ends of the spout 1' in the longitudinal direction of the spout 1', which is opened at the upper end of the spout passage ₁ ;
Another pair of sprocket wheels 2 ₂ , 2 ₂ are pivotally mounted on the axis of 2 ₁ , and two independent endless chains 3 ₁ are provided between the respective sprocket wheels 2 ₁ , 2 ₁ and 2 ₂ , 2 ₂ . , 3 ₂ are stretched so that they are interlocked by the motor 6 via the reducer 5, and one of the two sprockets 2 ₁ on the drive shaft (motor shaft) is fixed at the end of the central drive shaft,
The other sprocket 2 ₂ is fixed to the end of the outer cylindrical shaft that holds the central drive shaft, and the base ends of the central shaft and the outer cylindrical shaft are connected to each other in the speed reducer 5 to drive the sprockets in different directions of rotation. It is assumed that it is connected to a shaft (not shown) and that the rotational speed is appropriately reduced.

Furthermore, although the above example illustrates the case where two chains 3 ₁ and 3 ₂ having different circulation directions are driven by a single drive source, it is also possible to drive the two chains 3 ₁ and 3 ₂ by a motor with a dedicated reducer, respectively. It is also possible to drive it.

The present invention is constructed as described above, and the molten solder rises through the gushing path 1 and circulates through the chain 3 ₁ ,
3. It flows upward through the links of ₂ , and blows out toward the bottom surface of the printed circuit board 4 moving in a fixed direction above it, and solders the pattern wiring and circuit elements of the printed circuit board on the bottom side of the printed circuit board. It is something to attach.

At this time, by rotating the chains 3 ₁ and 3 ₂ at a constant speed in the direction of the arrow, the link gap also moves, and the solder surface that has flowed upward through the chains 3 ₁ and 3 ₂ has a wavy shape. This is to form a surface and expel flux gas from the underside of the printed circuit board, allowing bubble-free soldering.

By circulating the two chains in different directions in this manner, the formation of the wavy surface can be enhanced.

[Effect of idea]

Since the present invention is configured as described above, it is not necessary to manufacture a dedicated chain for each scale of soldering equipment, and it can easily be adapted to any scale by simply changing the number of links. It is easy to manage parts, and since it does not require separate processing like conventional spiral shafts and diaphragms, it is inexpensive, the configuration is simple, and there is no need for a vibrating device. It has many excellent effects, such as the ability to strengthen the formation of a wavy surface by increasing the number of threads in the chain.

[Brief explanation of the drawing]

1 to 3 show an embodiment of the present invention, FIG. 1 is a cutaway vertical side view of the main part, FIG. 2 is a cross-sectional view of the same as above, and FIG. 3 is a perspective view of the main part of the above. Fourth
7 shows a conventional example, FIG. 4 is a vertical side view, FIG. 5 is a plan view of the same as above, FIG. 6 is a vertical side view of another example, and FIG. 7 is a side view of the same as above. FIG. 1...Gushing path, 1'...Gushing outlet, 2 ₁ , 2 ₂ ...
Sprocket wheel, 3 ₁ , 3 ₂ ... chain.

Claims (1)

[Scope of utility model registration request] In an automatic soldering device that solders circuit elements to the printed circuit board while transferring a printed circuit board on which circuit elements have been temporarily mounted, the solder flows out from the outlet of the solder flowing toward the printed circuit board. A solder gushing part in an automatic soldering apparatus characterized in that two chains are stretched along the spout and the chains are circulated in opposite directions to form a wavy surface on the solder gushing surface. structure.