JPH0228363U - - Google Patents
Info
- Publication number
- JPH0228363U JPH0228363U JP10382488U JP10382488U JPH0228363U JP H0228363 U JPH0228363 U JP H0228363U JP 10382488 U JP10382488 U JP 10382488U JP 10382488 U JP10382488 U JP 10382488U JP H0228363 U JPH0228363 U JP H0228363U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- circuit board
- printed circuit
- cream solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図、第２図及び第３図は本考案の一実施例
を示す図である。
１…高溶融点クリーム半田、２…低溶融点クリ
ーム半田、３…銅パターン、４…熱容量の小さい
表面実装部品、５…熱容量の大きい表面実装部品
、６…プリント基板、１０，１１…半田印刷マス
ク。
FIGS. 1, 2, and 3 are diagrams showing an embodiment of the present invention. 1...High melting point cream solder, 2...Low melting point cream solder, 3...Copper pattern, 4...Surface mount component with small heat capacity, 5...Surface mount component with large heat capacity, 6...Printed circuit board, 10, 11...Solder printing mask.
Claims (1)
リント基板上に表面実装部品を搭載し、リフロー
半田付する半田付装置において、熱容量の異なる
表面実装部品に応じて溶融点の異るクリーム半田
を対応させて印刷しリフロー半田付することを特
徴とする半田付装置。 In a soldering device that prints cream solder on a printed circuit board, mounts surface mount components on the printed circuit board, and performs reflow soldering, cream solder with a different melting point is matched to the surface mount components with different heat capacities. A soldering device that performs printing and reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10382488U JPH0228363U (en) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10382488U JPH0228363U (en) | 1988-08-04 | 1988-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0228363U true JPH0228363U (en) | 1990-02-23 |
Family
ID=31334996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10382488U Pending JPH0228363U (en) | 1988-08-04 | 1988-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0228363U (en) |
-
1988
- 1988-08-04 JP JP10382488U patent/JPH0228363U/ja active Pending