JPH022847U - - Google Patents
Info
- Publication number
- JPH022847U JPH022847U JP8041588U JP8041588U JPH022847U JP H022847 U JPH022847 U JP H022847U JP 8041588 U JP8041588 U JP 8041588U JP 8041588 U JP8041588 U JP 8041588U JP H022847 U JPH022847 U JP H022847U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- lead
- lead frame
- chip component
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案によるリードフレームの一実
施例を示した平面図、第２図は同リードフレーム
を用いたハイブリツトＩＣの平面図、第３図は同
ハイブリツトＩＣの断面図である。
図中、１は支持板、２はリード片、３は凹部、
４はＩＣ基板、５はチツプコンデンサ、６は樹脂
からなる外装体である。
FIG. 1 is a plan view showing an embodiment of a lead frame according to this invention, FIG. 2 is a plan view of a hybrid IC using the same lead frame, and FIG. 3 is a sectional view of the same hybrid IC. In the figure, 1 is a support plate, 2 is a lead piece, 3 is a recess,
4 is an IC board, 5 is a chip capacitor, and 6 is an exterior body made of resin.
Claims (1)
支持板上に配置し、同リードフレームの所定リー
ド片とＩＣ基板の所定部位とを配線接続するとと
もに、その全体を樹脂による外装体にて被覆して
なるハイブリツトＩＣにおいて、 チツプ型コンデンサ等のチツプ部品を上記リー
ド片上に配置したことを特徴とするハイブリツト
ＩＣ。 (2) 上記チツプ部品が配置されるリード片には
そのチツプ部品を収納する所定深さの凹部が形成
されている請求項１記載のハイブリツトＩＣ。 (3) ハイブリツトＩＣ基板が載置される支持板
と、そのまわりに配置された複数のリード片とを
有するハイブリツトＩＣ用リードフレームにおい
て、 所定の上記リード片には、チツプ型コンデンサ
等のチツプ部品を収納する所定深さの凹部が形成
されていることを特徴とするリードフレーム。[Scope of Claim for Utility Model Registration] (1) A hybrid IC board is placed on a support plate of a lead frame, and a predetermined lead piece of the lead frame and a predetermined part of the IC board are connected by wiring, and the whole is made of resin. A hybrid IC covered with an exterior body, characterized in that a chip component such as a chip type capacitor is disposed on the lead piece. (2) The hybrid IC according to claim 1, wherein the lead piece on which the chip component is arranged has a recessed portion of a predetermined depth for accommodating the chip component. (3) In a hybrid IC lead frame that has a support plate on which a hybrid IC board is mounted and a plurality of lead pieces arranged around the support plate, a given lead piece contains a chip component such as a chip capacitor. A lead frame characterized in that a recessed portion of a predetermined depth is formed to accommodate the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8041588U JPH022847U (en) | 1988-06-17 | 1988-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8041588U JPH022847U (en) | 1988-06-17 | 1988-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022847U true JPH022847U (en) | 1990-01-10 |
Family
ID=31305243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8041588U Pending JPH022847U (en) | 1988-06-17 | 1988-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022847U (en) |
-
1988
- 1988-06-17 JP JP8041588U patent/JPH022847U/ja active Pending