JPH02285648A - Insulation coated bonding wire - Google Patents

Insulation coated bonding wire

Info

Publication number
JPH02285648A
JPH02285648A JP1107067A JP10706789A JPH02285648A JP H02285648 A JPH02285648 A JP H02285648A JP 1107067 A JP1107067 A JP 1107067A JP 10706789 A JP10706789 A JP 10706789A JP H02285648 A JPH02285648 A JP H02285648A
Authority
JP
Japan
Prior art keywords
bonding wire
aromatic polyester
polyester resin
coated
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1107067A
Other languages
Japanese (ja)
Other versions
JPH0624211B2 (en
Inventor
Masao Kimura
木村　正生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP1107067A priority Critical patent/JPH0624211B2/en
Priority to DE69016315T priority patent/DE69016315T2/en
Priority to PCT/JP1990/000405 priority patent/WO1990011617A1/en
Priority to US07/613,700 priority patent/US5396104A/en
Priority to EP90904950A priority patent/EP0416133B1/en
Priority to KR1019900702530A priority patent/KR940008555B1/en
Priority to SG1995904934A priority patent/SG30586G/en
Publication of JPH02285648A publication Critical patent/JPH02285648A/en
Publication of JPH0624211B2 publication Critical patent/JPH0624211B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/553—Materials of bond wires not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Wire Bonding (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To manufacture the title insulation coated bonding wire in excellent insulation characteristics, continuous joint characteristics, thermal resistance, etc., capable of preventing the shortcircuit due to contact by a method wherein the bonding wire is coated with an aromatic polyester resin having the basic skeleton represented by specific structural formula as well as the melt index within specific range. CONSTITUTION:The title bonding wire is coated with an aromatic polyester resin of melt index of 1.0-100g/min having the basic skeleton represented by the shown structural formula. For example, a high purity bonding gold wire in outer diameter of 30mum as a base material is immersed in a solution wherein the said aromatic polyester resin is melted in chloroform and then picked up in the vertical direction to remove the solvent for manufacturing the bonding wire coated with the insulating aromatic polyester resin. Finally, the concentration of the solution and the coating rate is adjusted corresponding to the melt index of the applied aromatic polyester resin so that the bonding wire may be coated with the said resin in film thickness of around 0.3mum.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、〒導体装置の結線に用いられるボンディング
ワイヤに関するもので、特に、絶縁被覆ボンディングワ
イヤ、詳しくは芳香族ポリエステル樹脂をボンディング
ワイヤ上に被覆して成る絶縁被覆ボンディングワイヤに
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a bonding wire used for connecting conductor devices, and particularly relates to an insulated bonding wire, specifically an aromatic polyester resin coated on the bonding wire. This invention relates to an insulated bonding wire formed by coating.

（従来の技術） 従来、半導体装置の製造過程で用いられているボンディ
ングワイヤは、たとえば金（Ａｕ）、銅（Ｃｕ）、アル
ミニウム（Ａｌ２　）等よりなる導電性のワイヤ基材が
そのまま裸線として利用されている。(Prior art) Bonding wires conventionally used in the manufacturing process of semiconductor devices are made of conductive wire base materials made of, for example, gold (Au), copper (Cu), aluminum (Al2), etc. as bare wires. It's being used.

そのため、このようなワイヤを用いて半導体ペレットの
ボンディングバットとリードフレームのインナーリード
の如き外部出力端子への導電部とをボンディングする場
合、ボンディング不良、レジンモールド型パッケージに
おけるレジンの流れ等の何らかの原因によりワイヤが隣
接する他のワイヤやインナーリードあるいはタブ等と接
触すると、ショート不良を生じるという問題がある。Therefore, when using such a wire to bond the bonding butt of a semiconductor pellet and a conductive part to an external output terminal such as an inner lead of a lead frame, there may be some causes such as poor bonding or flow of resin in a resin molded package. Therefore, there is a problem in that when a wire comes into contact with another adjacent wire, inner lead, tab, etc., a short circuit occurs.

特に、大規模集積回路（ＬＳＩ）における多ピン化によ
り、ペレットとインナーリードとの距離が大きくなる傾
向に伴って、ワイヤのスパンの長さを長くする必要があ
るが、このような場合には、ワイヤがカール現象を起こ
し、隣接するワイヤ等との接触に起因するショート不良
がより発生し易くなっている。In particular, with the increase in the number of pins in large-scale integrated circuits (LSIs), the distance between the pellet and the inner lead tends to increase, so it is necessary to increase the length of the wire span. , the wire curls, and short-circuit defects due to contact with adjacent wires are more likely to occur.

そのため、ボンディングワイヤを絶縁膜で被覆すること
が考えられ、特開昭５９−１５４０５４号公報に示され
ているように、絶縁性の高分子樹脂材料で被覆されたボ
ンディングワイヤを用いれば、ショート不良等を防げる
とされている。Therefore, it has been considered to cover the bonding wire with an insulating film, and as shown in Japanese Patent Laid-Open No. 59-154054, if a bonding wire coated with an insulating polymeric resin material is used, short circuits can occur. It is said that it can prevent such things.

しかしながら、用いる高分子材料によっては、ボンディ
ングワイヤとリードフレームもしくはポンディングパッ
ドとの接合性が悪かったり、後の封止工程やハンダ付は
等の工程において耐熱性が足りない欠点があった。However, depending on the polymer material used, there are drawbacks such as poor bonding between the bonding wire and the lead frame or the bonding pad, and insufficient heat resistance in subsequent steps such as sealing and soldering.

一般に、耐熱性を要求される絶縁被覆の材料としては、
エンジニアリングプラスチックと呼ばれている樹脂があ
り、その中でも芳香族ポリエステルがこれらの特性に優
れていることが見い出されている（Ｎえば、特開昭５４
−１３８０５６号公報、特開昭５８−１３７９０５号公
報）。In general, insulation coating materials that require heat resistance include:
There are resins called engineering plastics, and among them, aromatic polyesters have been found to have excellent properties (for example, in JP-A-54
-138056, JP-A-58-137905).

ところが、一般に知られている芳香族ポリエステル樹脂
は、耐熱性、耐摩耗性、難燃性、抗張力等の機械特性、
耐衝撃性、絶縁性等の電気特性に優れた樹脂であるが、
押し出し加工性が悪く、押し出し機を用いた電線被覆方
式で被覆する方法では、ボンディングワイヤの周囲に均
一な厚みで薄い絶縁被膜を形成するのは極めて困難であ
った。However, generally known aromatic polyester resins have poor mechanical properties such as heat resistance, abrasion resistance, flame retardancy, and tensile strength.
Although it is a resin with excellent electrical properties such as impact resistance and insulation,
Extrusion processability is poor, and it is extremely difficult to form a thin insulating film with a uniform thickness around the bonding wire using a wire coating method using an extruder.

また、変性等により押し出し加工性を良くした芳香族ポ
リエステル樹脂は耐熱性、耐摩耗性に劣るという問題が
あった。Furthermore, aromatic polyester resins that have been improved in extrusion processability through modification or the like have a problem in that they are inferior in heat resistance and abrasion resistance.

しかも、ボンディングワイヤの周囲に、均一な厚みで薄
い絶縁被膜を形成するのに適切と考えられる、溶剤に溶
かして塗布する方法でボンディングワイヤ上に薄い均一
な被膜を形成するのは、高い機械強度や耐熱性を有する
芳香族ポリエステル樹脂は一般には耐薬品性が高く、溶
剤に溶かして塗布する方法で、ボンディングワイヤ上に
薄い均一な被膜を形成するのは困難であった。Furthermore, forming a thin, uniform coating on the bonding wire using a method of dissolving it in a solvent and applying it, which is considered appropriate for forming a thin insulating coating with a uniform thickness around the bonding wire, has high mechanical strength. Aromatic polyester resins generally have high chemical resistance, and it has been difficult to form a thin, uniform coating on bonding wires by dissolving them in a solvent and applying them.

また変性等により溶剤に溶は品くすると耐候性、耐熱性
等が悪くなるのが普通であった。したがって、今までは
、芳香族ポリエステルを被覆層とした絶縁ボンディング
ワイヤを作ることははなはだ困難であった。In addition, when the solubility in a solvent becomes poor due to modification or the like, weather resistance, heat resistance, etc. usually deteriorate. Therefore, until now, it has been extremely difficult to produce insulated bonding wires using aromatic polyester as a coating layer.

（発明が解決しようとする課題） 上記に鑑み、本発明は、前記従来技術の問題点を解決し
、ボンディングワイヤどうしあるいはボンディングワイ
ヤと他の導電部との接触によるショート不良を防止する
ことのできる樹脂被覆ボンディングワイヤを提供するこ
とにある。(Problems to be Solved by the Invention) In view of the above, the present invention solves the problems of the prior art and can prevent short-circuit defects caused by contact between bonding wires or between bonding wires and other conductive parts. An object of the present invention is to provide a resin-coated bonding wire.

（課題を解決するための手段） 本発明は、下記の構造式で示される基本骨格を有し、メ
ルトインデックスとして１．０〜１００ｇ／１１０ｍｉ
ｎ（ＡＳＴ　−Ｄ　１２３８準拠；温度３００’Ｃ１荷
重２．１［ｉｏｋｇ）の芳香族ポリエステル樹脂をボン
ディングワイヤ上に被覆してなる絶縁ボンディングワイ
ヤである。(Means for Solving the Problems) The present invention has a basic skeleton represented by the following structural formula, and has a melt index of 1.0 to 100 g/110 mi.
This is an insulated bonding wire in which the bonding wire is coated with aromatic polyester resin (according to AST-D 1238; temperature 300'C1 load 2.1 [iokg)].

本発明において、芳香族ポリエステル樹脂を用いたのは
、芳香族ポリエステル樹脂が耐熱性、耐摩耗性、難燃性
、抗張力等の機械特性、耐衝撃性、絶縁性等の電気特性
に優れた樹脂であるためである。In the present invention, aromatic polyester resin was used because aromatic polyester resin has excellent mechanical properties such as heat resistance, abrasion resistance, flame retardancy, and tensile strength, and electrical properties such as impact resistance and insulation. This is because.

ところが、本発明では上記の構造式で示される基本骨格
を有し、特定の範囲のメルトインデックスを有する芳香
族ポリエステル樹脂を使用することにより、耐熱性と絶
縁性に優れた芳香族ポリエステル樹脂被覆ボンディング
ワイヤを作成することに成功した。However, in the present invention, by using an aromatic polyester resin that has the basic skeleton shown by the above structural formula and has a melt index within a specific range, an aromatic polyester resin coated bonding with excellent heat resistance and insulation properties can be obtained. Successfully created a wire.

本発明で用いる芳香族ポリエステル樹脂が絶縁被膜に適
している理由は明らかではないが、一般にエンジニアリ
ングプラスチックスとして用いられているポリエチレン
テレフタレートや、ポリブチレンテレフタレートが結晶
性の樹脂であるのに対し、本発明に用いた芳香族ポリエ
ステルから形成される被膜の高次構造が非晶質であるた
めと思われる。It is not clear why the aromatic polyester resin used in the present invention is suitable for insulation coatings, but while polyethylene terephthalate and polybutylene terephthalate, which are generally used as engineering plastics, are crystalline resins, this This is probably because the higher-order structure of the film formed from the aromatic polyester used in the invention is amorphous.

本発明で用いる芳香族ポリエステル樹脂は、メルトイン
デックス（ＡＳＴＭ−Ｄ　Ｉ２３８準拠；温度３００℃
、荷重２．１６０ｋｇ）としては、１．０〜１００ｇ／
１０ｍｉｎの範囲にある芳香族ポリエステル樹脂である
。The aromatic polyester resin used in the present invention has a melt index (ASTM-D I238 compliant; temperature 300°C).
, load 2.160kg) is 1.0 to 100g/
It is an aromatic polyester resin within a range of 10 min.

ら 芳香族ポリエステル樹脂のメルトインデックスが１．Ｏ
ｇ／　１０ｍｉｎ未満では粘度が高すぎて、ボンディン
グワイヤ上に均一な厚みの被覆層を形成できない。ある
程度均一な厚みの部分ができても連続結合性が劣り、信
頼性に欠ける。The aromatic polyester resin has a melt index of 1. O
g/10 min, the viscosity is too high and it is impossible to form a uniformly thick coating layer on the bonding wire. Even if a portion with a somewhat uniform thickness is formed, the continuous bondability is poor and reliability is lacking.

またメルトインデックスが１００　ｇ　／　ｌｏｍｉｎ
を超えると粘度が低くなりすぎて、ボンディングワイヤ
との密着性が悪くなり、剥げ易くなり連続接合性には問
題はないが、絶縁性が無くなり、何れの場合にも実用に
耐えるものが得られない。Also, the melt index is 100 g/lomin
If the viscosity is exceeded, the viscosity becomes too low, and the adhesion with the bonding wire deteriorates, making it easy to peel off. Although there is no problem with continuous bonding, the insulation properties are lost, and in any case, a product that can withstand practical use cannot be obtained. do not have.

本発明の芳香族ポリエステルからなる絶縁被覆ボンディ
ングワイヤの絶縁膜の厚さについては、厚みが厚いほど
絶縁性という点においては優れているが、それと同時に
厚くなるほど接合性が悪くなること、また、絶縁膜の厚
さが薄くなるほど接合性は向上するが絶縁膜としての性
能が低下し、厚みが０．０１ｕｒｒ１以下では耐電圧が
悪くなってしまう。Regarding the thickness of the insulating film of the insulated bonding wire made of aromatic polyester of the present invention, the thicker the insulating film, the better the insulation property, but at the same time, the thicker the insulating film, the worse the bonding property. As the thickness of the film becomes thinner, the bondability improves, but the performance as an insulating film deteriorates, and when the thickness is less than 0.01 urr1, the withstand voltage deteriorates.

そのため、適切な絶縁膜の厚さとしては、絶縁被覆の厚
さが０．０１〜ｌＯμｍ、好ましくは０．０１〜２ＩＥ
ｒ１１最も好ましくは０．０２〜０．７ｔＩｘＩである
。Therefore, as an appropriate thickness of the insulating film, the thickness of the insulating coating is 0.01 to 10μm, preferably 0.01 to 2IE
r11 is most preferably 0.02 to 0.7tIxI.

被膜の形成方法としては、押し出し被覆法、静電粉体コ
ーチ、イング法、浸せき塗工法、スプレィコーティング
法、電着コーティング法等が考えられるが、上記のよう
な極めて薄い絶縁被膜を均一に被覆するためには浸せき
塗工法により、被覆することが望ましい。Possible methods for forming the film include extrusion coating method, electrostatic powder coaching, coating method, dip coating method, spray coating method, and electrodeposition coating method. In order to do this, it is desirable to coat by dip coating method.

また、この芳香族ポリエステル樹脂には、必要に応じて
この種の芳香族ポリエステル樹脂に従来から使用されて
きた老化防止剤、難燃剤、充填剤、電圧安定剤、滑剤、
加工助剤、紫外線吸収剤等の各種の添加剤を配合するこ
とができる。In addition, this aromatic polyester resin may contain anti-aging agents, flame retardants, fillers, voltage stabilizers, lubricants, etc. that have been conventionally used in aromatic polyester resins of this type.
Various additives such as processing aids and ultraviolet absorbers can be added.

（作　　用） 上述したように限られたメルトインデックスを有する芳
香族ポリエステル樹脂を使用することにより、ボンディ
ングワイヤ上に均一に形成することができ、かつ限られ
た厚みの絶縁層を被覆することにより得られる芳香族ポ
リエステル樹脂被覆絶縁ボンディングワイヤは、耐熱性
と絶縁性と接合性に優れたものであるので、ボンディン
グ不良もなく、かつ、ボンディングワイヤどうしや、ボ
ンディングワイヤと半導体チップ等とのショートを防ぐ
ことができ、更にリード間隔を縮小し、半導体装置の多
端子化を図ることができる。(Function) As mentioned above, by using an aromatic polyester resin having a limited melt index, it is possible to uniformly form the bonding wire on the bonding wire, and by covering the bonding wire with an insulating layer of limited thickness. The resulting aromatic polyester resin-coated insulated bonding wire has excellent heat resistance, insulation, and bonding properties, so there is no bonding defect and short circuit between bonding wires or between bonding wires and semiconductor chips, etc. In addition, it is possible to reduce lead spacing and increase the number of terminals in a semiconductor device.

（実　施　例） 絶縁被覆の形成方法としては、高純度の外径３０μｓの
金製のボンディングワイヤをワイヤ基材とし、芳香族ポ
リエステル樹脂をクロロホルムに溶解した溶液中に、ワ
イヤ基材を通してから鉛直方向に引き上げて、溶剤を除
去して絶縁性の芳香族ポリエステル樹脂を被覆したボン
ディングワイヤを作成した。(Example) The method for forming the insulation coating is to use a high-purity gold bonding wire with an outer diameter of 30 μs as a wire base material, pass the wire base material through a solution of aromatic polyester resin dissolved in chloroform, and then vertically A bonding wire coated with an insulating aromatic polyester resin was prepared by removing the solvent.

被覆の膜厚は溶液の濃度と粘度と被覆速度とに依存し、
更に溶液の粘度は樹脂の分子量、即ちメルトインデック
スに依存するので、用いた芳香族ポリエステル樹脂のメ
ルトインデックスに応じて溶液の濃度、被覆速度を調整
して、それぞれ被膜の厚さか約０．３μｓになるように
被覆した。The coating thickness depends on the concentration, viscosity, and coating speed of the solution.
Furthermore, since the viscosity of the solution depends on the molecular weight of the resin, that is, the melt index, the concentration of the solution and the coating speed were adjusted according to the melt index of the aromatic polyester resin used, so that the thickness of the coating was approximately 0.3 μs. It was coated to make it look like this.

その被覆されたゼンディングワイヤを用い、Ｊ１連続ボ
ンデインク試験及び落錘衝撃試験を１゛テっだ結果を第
１表に示す。Table 1 shows the results of a J1 continuous bond ink test and a falling weight impact test using the coated wire.

高分子材料としては芳香族ポリエステル樹脂として、以
下の構造式を有する、ビスフェノールＡとジカルボン酸
（テレフタル酸とイソフタル酸の１＝１の混合比）の共
重合体である芳香族ポリエステルは、常法の界面重縮合
法に従って異なった分子量、即ち、異なったメルトイン
デックス値をもつ芳香族ポリエステルを合成して、実施
例１〜３、比較例１と２に用いた（日本化学会綿、新実
験化学講座第１９巻、高分子化学（■）。As an aromatic polyester resin as a polymer material, aromatic polyester, which is a copolymer of bisphenol A and dicarboxylic acid (mixing ratio of terephthalic acid and isophthalic acid of 1=1) and has the following structural formula, is prepared using a conventional method. Aromatic polyesters with different molecular weights, that is, different melt index values, were synthesized according to the interfacial polycondensation method and used in Examples 1 to 3 and Comparative Examples 1 and 2. Lecture Volume 19, Polymer Chemistry (■).

ｐ、　＋４８）。p, +48).

メルトインデックスは、ＡＳＴＭ−Ｄ　１２３８に準拠
し、押し出し温度は３００℃、荷重２．１ＧＯｋｇで行
なった。The melt index was determined in accordance with ASTM-D 1238, at an extrusion temperature of 300° C. and a load of 2.1 GO kg.

また、ボンディングワイヤのリードフレームとの連続接
合性ついては、２０００回以上連続ボンディングワイヤ
できた場合を○、途中でワイヤ切れ等を起こしたものを
×とした。更に、絶縁被膜の良否は走査型電子顕微鏡（
ＳＥＭ）を用いて１０００倍程度の倍率で観察し、絶縁
被膜が均質なものを○、剥がれや不均一な厚みであった
ものを×とした。Regarding the continuous bonding property of the bonding wire with the lead frame, cases where the bonding wire could be bonded continuously 2000 times or more were rated as ○, and cases where wire breakage etc. occurred midway were rated as ×. Furthermore, the quality of the insulation coating can be checked using a scanning electron microscope (
The samples were observed using a SEM (SEM) at a magnification of about 1000 times, and those in which the insulating coating was homogeneous were rated ◯, and those with peeling or uneven thickness were rated ×.

（実施例１〜３） ボンディングワイヤ上に、メルトインデックスがそれぞ
れ、３．５．１３．５５ｇ／１０ｍｉｎの芳香族ポリエ
ステル樹脂のクロロホルム溶液を用いて被覆し、被覆厚
さ０．３μｓの絶縁ボンディングワイヤを作成した。(Examples 1 to 3) Insulated bonding wires were coated on bonding wires using chloroform solutions of aromatic polyester resins with melt indexes of 3.5 and 13.55 g/10 min, respectively, and the coating thickness was 0.3 μs. It was created.

その特性を第１表に示した。いずれの場合にもＳＥＭを
用いて観察した結果滑らかに被覆されていることが認め
られた。Its properties are shown in Table 1. In both cases, observation using SEM revealed that the coating was smooth.

（比較例１） ボンディングワイヤ上に、メルトインデックスが０．８
　ｇ　／　１０１ｎの芳香族ポリエステル樹脂のクロロ
ホルム溶液を被覆しようとしたが、均一の厚みの被覆層
を形成されなかった。(Comparative Example 1) Melt index is 0.8 on bonding wire
Although an attempt was made to coat a chloroform solution of an aromatic polyester resin of g/101n, a coating layer with a uniform thickness could not be formed.

ＳＥＭを用いて観察したところ、ボンディングワイヤの
長さ方向に被覆の厚さが２倍程度にバラライでいるのが
見い出された。又作成した被覆ボンディングワイヤの中
から、比較的厚みの均一であった極少量の被覆厚さ０．
３−の絶縁ボンディングワイヤを接合しようとしたが、
このボンディングワイヤのリードフレームとの接合性は
、第１表に示したように貧弱であり、実用には適さなか
った。When observed using SEM, it was found that the thickness of the coating varied by about twice as much in the length direction of the bonding wire. Also, from among the coated bonding wires prepared, a very small amount of coated bonding wire with a relatively uniform thickness was found.
I tried to join the insulated bonding wire of 3-, but
The bonding properties of this bonding wire with the lead frame were poor as shown in Table 1, and it was not suitable for practical use.

（比較例２） メルトインデックスが１２０　ｇ　／　１０ｍｉｎの芳
香族ポリエステル樹脂のクロロホルム溶液を用いて被覆
した。この作成した被覆ボンディングワイヤのＳＥＭを
観察したが、ボンディングワイヤの表面から樹脂が剥が
れており、ボンディングには問題はなかったが、絶縁性
が確実ではなく、実用には適さなかった。(Comparative Example 2) A chloroform solution of an aromatic polyester resin having a melt index of 120 g/10 min was used for coating. An SEM observation of the coated bonding wire thus prepared revealed that the resin had peeled off from the surface of the bonding wire, and although there was no problem with bonding, the insulation was not reliable and was not suitable for practical use.

おそらく、メルトインデックスが大きすぎる、即ち、分
子量が小さすぎると被膜とワイヤの接着が貧弱となり、
剥がれ易くなるものと思われる。Presumably, if the melt index is too high, i.e. the molecular weight is too low, the adhesion between the coating and the wire will be poor;
It seems that it will peel off easily.

第１表からも明らかなように、メルトインデックスが大
きすぎると均一の厚みの被覆層を形成するのが困難であ
り、作成できた場合でも、このボンディングワイヤのリ
ードフレームとの接合性は貧弱であり、またメルトイン
デックスが小さすぎる場合には被膜とワイヤの接着が貧
弱であり、剥がれ易くて実用には適さなかった。As is clear from Table 1, if the melt index is too large, it is difficult to form a coating layer with a uniform thickness, and even if it is possible, the bonding properties of this bonding wire with the lead frame will be poor. However, if the melt index was too small, the adhesion between the coating and the wire would be poor and would easily peel off, making it unsuitable for practical use.

（発明の効果） 本発明によれば、限られたメルトインデックスを有する
芳香族ポリエステル樹脂を使用することにより、ボンデ
ィングワイヤ上に均一な被覆層を形成することができ、
かつ限られた厚みの絶縁層を被覆することにより、得ら
れる芳香族ポリエステル樹脂被覆絶縁ボンディングワイ
ヤは絶縁性、連続接合性、耐熱性等に優れたものである
。(Effects of the Invention) According to the present invention, by using an aromatic polyester resin having a limited melt index, a uniform coating layer can be formed on the bonding wire,
By covering the wire with an insulating layer having a limited thickness, the resulting aromatic polyester resin-coated insulated bonding wire has excellent insulation properties, continuous bonding properties, heat resistance, and the like.

代　理　人　　弁理士　　茶野木　立　夫手 続 補 正 書 （自発） （１）特許請求の範囲を別紙の通り補正する。Representative Patent Attorney Tate Chanoki Continued Supplementary Positive book (spontaneous) (1) Amend the claims as shown in the attached sheet.

（２）明細書５頁１４行の 平成２年３月１４ ■(2) Page 5, line 14 of the specification March 14, 1990 ■

Claims (1)

【特許請求の範囲】 下記の構造式で示される基本骨格を有し、メルトインデ
ックスが１．０〜１００ｇ／１０ｍｉｎの芳香族ポリエ
ステル樹脂をボンディングワイヤ上に被覆してなる絶縁
ボンディングワイヤ。 ▲数式、化学式、表等があります▼[Scope of Claims] An insulated bonding wire comprising a bonding wire coated with an aromatic polyester resin having a basic skeleton represented by the following structural formula and having a melt index of 1.0 to 100 g/10 min. ▲Contains mathematical formulas, chemical formulas, tables, etc.▼
JP1107067A 1989-03-28 1989-04-26 Insulation coating bonding wire Expired - Fee Related JPH0624211B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1107067A JPH0624211B2 (en) 1989-04-26 1989-04-26 Insulation coating bonding wire
DE69016315T DE69016315T2 (en) 1989-03-28 1990-03-27 RESIN-COATED CONNECTING WIRE, METHOD FOR THE PRODUCTION AND SEMICONDUCTOR ARRANGEMENT.
PCT/JP1990/000405 WO1990011617A1 (en) 1989-03-28 1990-03-27 Resin-coated bonding wire, method of producing the same and semiconductor device
US07/613,700 US5396104A (en) 1989-03-28 1990-03-27 Resin coated bonding wire, method of manufacturing the same, and semiconductor device
EP90904950A EP0416133B1 (en) 1989-03-28 1990-03-27 Resin-coated bonding wire, method of producing the same and semiconductor device
KR1019900702530A KR940008555B1 (en) 1989-03-28 1990-03-27 Resin coated bonding wire, method of manufacturing the same and semiconductor device
SG1995904934A SG30586G (en) 1989-03-28 1990-03-27 Resin-coated bonding wire method of producing the same and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1107067A JPH0624211B2 (en) 1989-04-26 1989-04-26 Insulation coating bonding wire

Publications (2)

Publication Number Publication Date
JPH02285648A true JPH02285648A (en) 1990-11-22
JPH0624211B2 JPH0624211B2 (en) 1994-03-30

Family

ID=14449650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1107067A Expired - Fee Related JPH0624211B2 (en) 1989-03-28 1989-04-26 Insulation coating bonding wire

Country Status (1)

Country Link
JP (1) JPH0624211B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2462822B (en) * 2008-08-18 2011-11-02 Crombie 123 Ltd Wire bonding
US8618420B2 (en) 2008-08-18 2013-12-31 Semblant Global Limited Apparatus with a wire bond and method of forming the same
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
US9648720B2 (en) 2007-02-19 2017-05-09 Semblant Global Limited Method for manufacturing printed circuit boards
US11786930B2 (en) 2016-12-13 2023-10-17 Hzo, Inc. Protective coating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9648720B2 (en) 2007-02-19 2017-05-09 Semblant Global Limited Method for manufacturing printed circuit boards
GB2462822B (en) * 2008-08-18 2011-11-02 Crombie 123 Ltd Wire bonding
US8618420B2 (en) 2008-08-18 2013-12-31 Semblant Global Limited Apparatus with a wire bond and method of forming the same
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
US11786930B2 (en) 2016-12-13 2023-10-17 Hzo, Inc. Protective coating
US12521756B2 (en) 2016-12-13 2026-01-13 Hzo, Inc. Protective coating

Also Published As

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