JPH0228911A - Chip type capacitor - Google Patents

Chip type capacitor

Info

Publication number
JPH0228911A
JPH0228911A JP63179853A JP17985388A JPH0228911A JP H0228911 A JPH0228911 A JP H0228911A JP 63179853 A JP63179853 A JP 63179853A JP 17985388 A JP17985388 A JP 17985388A JP H0228911 A JPH0228911 A JP H0228911A
Authority
JP
Japan
Prior art keywords
capacitor
frame
synthetic resin
groove
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63179853A
Other languages
Japanese (ja)
Other versions
JP2627778B2 (en
Inventor
Hideki Kawahara
河原　英希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP63179853A priority Critical patent/JP2627778B2/en
Publication of JPH0228911A publication Critical patent/JPH0228911A/en
Application granted granted Critical
Publication of JP2627778B2 publication Critical patent/JP2627778B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To facilitate a mounting step on a printed board by bending leads of a capacitor along the opening edge face and bottom face of a sheath frame, and securing them together with synthetic resin coating on a groove formed in the bottom of the frame. CONSTITUTION:A capacitor 1 is contained in a space from one opening edge face of a sheath frame 2, the end face is abutted against a side 5 covering part of the other opening edge face of the frame 2, and anchored in the space. Leads 3 extended from the capacitor 1 through a sealer are bent along the opening edge face and bottom of the frame 2 near a groove 6. In this case, the groove 6 is covered with synthetic resin or conductive synthetic resin 4 in this embodiment, or the leads 3 are coated with the resin 4 to be secured to the groove 6 together. That is, the ends of the leads 3 are secured to the groove 6 of the frame 2 with the solidified resin 4. Thus, the leads 3 are not separated from the frame 2, and a rigid chip type capacitor against an external stress can be realized.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はコンデンサの改良にかかり、特にプリント基
板への表面実装に適したチップ形コンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in capacitors, and particularly to chip-type capacitors suitable for surface mounting on printed circuit boards.

〔従来の技術〕[Conventional technology]

従来、コンデンサのチップ化を実現するには、コンデン
サ素子に樹脂モールド加工を施し、樹脂端面から導出し
た外部接続用のリード線を樹脂端面に沿って折り曲げ、
プリント基板の配線パターンに臨ませていた。Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the lead wire for external connection led out from the resin end was bent along the resin end.
It was facing the wiring pattern of the printed circuit board.

あるいは、例えば、実公昭５９−３５５７号公報に記載
された考案のように、従来のコンデンサを外装枠に収納
し、リード線を外装枠の端面と同一平面に配置したもの
が提案されていた。また、特開昭６０−２４５１１６号
公報および特開昭６０−２４５１１５号公報に記載され
た発明のように、有底筒状の外装枠にコンデンサを設置
して外装枠底面の貫通孔からリード線を導出し、このリ
ード線を外装枠の外表面に設けた凹部に納めるよう折り
曲げたものが提案されていた。このような従来のチップ
形コンデンサは通常のコンデンサの構造を変更すること
なく、表面実装を可能にしている。Alternatively, for example, as in the idea described in Japanese Utility Model Publication No. 59-3557, it has been proposed that a conventional capacitor is housed in an outer frame and the lead wires are disposed on the same plane as the end surface of the outer frame. In addition, as in the inventions described in JP-A-60-245116 and JP-A-60-245115, a capacitor is installed in a cylindrical exterior frame with a bottom, and a lead wire is inserted from a through hole in the bottom of the exterior frame. It has been proposed that the lead wire is bent to fit into a recess provided on the outer surface of the outer frame. Such conventional chip capacitors can be surface mounted without changing the structure of the normal capacitor.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、モールド加工を施すチップ形コンデンサ
では、モールド加工時の熱的ストレスによりコンデンサ
素子が熱劣化するおそれがあり、その製造方法も煩雑で
あった。However, in chip-type capacitors that are molded, there is a risk that the capacitor element will be thermally degraded due to thermal stress during molding, and the manufacturing method thereof is also complicated.

また、チップ形のコンデンサをプリント基板に実装して
半田付けを施すと、その溶融した半田の表面張力、ある
いは半田熱によりチップ形コンデンサがプリント基板上
を浮遊してしまうこうとがあった。そのため、チップ形
コンデンサを適正な位置に配置することができず、作業
効率が悪化する場合があった。Further, when a chip-shaped capacitor is mounted on a printed circuit board and soldered, the chip-shaped capacitor tends to float on the printed circuit board due to the surface tension of the molten solder or solder heat. Therefore, the chip-type capacitor could not be placed at an appropriate position, and work efficiency sometimes deteriorated.

あるいは、外装枠にコンデンサを収納したチップ形コン
デンサを半田付けする場合、プリント基板に半田によっ
て固着されるのは、チップ形コンデンサの一方端面のみ
である。そのため、第２図に示したように、半田熱によ
り外装枠２がプリント基板７から浮き上がることがあっ
た。その影響でリード線３に機械的なストレスがかかり
、リード線３が脆弱になるほか、コンデンサ１本体の電
気的特性に悪影響を及ぼすことがあった。あるいは、リ
ード線３導出側の反対端部にストレスがかかる場合には
、リード線３が外装枠２から離脱してしまい、ときには
切断されてしまうこともあった。Alternatively, when soldering a chip capacitor with the capacitor housed in an exterior frame, only one end surface of the chip capacitor is fixed to the printed circuit board by solder. Therefore, as shown in FIG. 2, the outer frame 2 may be lifted off the printed circuit board 7 due to soldering heat. As a result, mechanical stress was applied to the lead wire 3, which not only made the lead wire 3 brittle but also had an adverse effect on the electrical characteristics of the capacitor 1 body. Alternatively, if stress is applied to the end opposite to the lead-out side of the lead wire 3, the lead wire 3 may come off from the exterior frame 2 and sometimes be cut.

この発明の目的は、通常のコンデンサの構造を変更する
ことなく、プリント基板への実装工程を容易にするチッ
プ形コンデンサを提供することにある。An object of the present invention is to provide a chip-type capacitor that can be easily mounted on a printed circuit board without changing the structure of a conventional capacitor.

〔問題点を解決するための手段〕[Means for solving problems]

この発明は、コンデンサの外観形状に適合した収納空間
を有する外装枠に、コンデンサを収納するとともに、コ
ンデンサのリード線を外装枠の開口端面および底面に沿
って折り曲げ、外装枠底面に設けた溝部に塗着した合成
樹脂とともに固定したことを特徴としている。This invention stores a capacitor in an exterior frame that has a storage space that matches the external shape of the capacitor, bends the capacitor lead wires along the open end surface and bottom of the exterior frame, and inserts them into a groove provided on the bottom of the exterior frame. It is characterized by being fixed together with a painted synthetic resin.

また具体的には、外装枠の溝部に塗着する合成樹脂が導
電性の合成樹脂からなることを特徴としている。More specifically, it is characterized in that the synthetic resin applied to the groove of the exterior frame is made of a conductive synthetic resin.

〔作　用〕[For production]

図面に示すように、外装枠２の底面には、予めリード線
３が収納される溝部６が形成されているとともに、合成
樹脂４が塗着されている。そしてコンデンサ１のリード
線３は、外装枠２の開口端面から底面に沿って折り曲げ
られて溝部６に収納され、合成樹脂４とともに固着され
ることになる。As shown in the drawings, a groove 6 in which the lead wire 3 is housed is formed in advance on the bottom surface of the exterior frame 2, and a synthetic resin 4 is coated thereon. Then, the lead wire 3 of the capacitor 1 is bent along the bottom surface from the open end surface of the exterior frame 2, is housed in the groove 6, and is fixed together with the synthetic resin 4.

〔実施例〕〔Example〕

次いでこの発明の実施例を図面にしたがい説明する。 Next, embodiments of the invention will be described with reference to the drawings.

第１図は、この発明の実施例を示した斜視図、である。FIG. 1 is a perspective view showing an embodiment of the invention.

図示しないコンデンサ素子は、電極箔と電解紙とを巻回
して形成する。そして、このコンデンサ素子を有底筒状
の外装ケースに収納するとともに、その開口部を弾性ゴ
ム等からなる封口体で密封している。電極箔と電気的に
接続されたリード線３は、コンデンサ素子から封口体を
貫通して外部に導かれている。A capacitor element (not shown) is formed by winding electrode foil and electrolytic paper. This capacitor element is housed in a cylindrical outer case with a bottom, and its opening is sealed with a sealing body made of elastic rubber or the like. A lead wire 3 electrically connected to the electrode foil is led from the capacitor element to the outside through the sealing body.

また、外装枠２は、内部にコンデンサ１を収納するのに
適した形状もしくは寸法に形成された収納空間が形成さ
れている。そして、この外装枠２の収納空間のニガの開
口端面には、この開口端面の一部を覆う壁部５が形成さ
れている。Moreover, the exterior frame 2 has a storage space formed in the shape or size suitable for storing the capacitor 1 therein. A wall portion 5 is formed on the opening end surface of the storage space of the exterior frame 2 to cover a part of the opening end surface.

コンデンサ１は、外装枠２の一方の開口端面から収納空
間に収納され、その端面ば外装枠２の他方の開口端面の
一部を覆う壁部５と当接して、収納空間に係留される。The capacitor 1 is housed in the storage space from one open end surface of the exterior frame 2, and is moored in the storage space with its end surface abutting against a wall portion 5 covering a portion of the other open end surface of the exterior frame 2.

封口体を貫通してコンデンサ１から導かれたリード線３
は、外装枠２の開口端面および底面に沿って折り曲げら
れて溝部６に臨む。このとき溝部６には予め合成樹脂、
この実施例では、導電性の合成樹脂４を塗布し、あるい
はリード線３に該合成樹脂４を塗布して、リード線３と
ともに溝部６に固着させる。Lead wire 3 led from capacitor 1 through the sealing body
is bent along the opening end face and bottom face of the exterior frame 2 and faces the groove portion 6 . At this time, the groove portion 6 is filled with synthetic resin,
In this embodiment, a conductive synthetic resin 4 is applied, or the lead wire 3 is coated with the synthetic resin 4, and the lead wire 3 and the lead wire 3 are fixed in the groove 6.

この実施例によれば、リード線３の先端部分は固化した
合成樹脂４により、外装枠２の溝部６に固着されること
になる。そのため、リード線３が外装枠２から離脱する
ことがなくなり、外部からのストレスに対して強固なチ
ップ形コンデンサを実現できる。また、半田付は工程に
おいても外装枠３の浮遊が防止できる。According to this embodiment, the tip portion of the lead wire 3 is fixed to the groove 6 of the outer frame 2 by the solidified synthetic resin 4. Therefore, the lead wire 3 does not come off from the exterior frame 2, and a chip-type capacitor that is strong against external stress can be realized. Furthermore, floating of the exterior frame 3 can be prevented during the soldering process.

なお、この実施例では、導電性の合成樹脂４を用いたが
、通常の導電性でない合成樹脂を用いてもよい。この場
合、合成樹脂は、予め外装枠２の溝部６にに塗布し、コ
ンデンサ１のリード線３を収納することになる。In this embodiment, a conductive synthetic resin 4 is used, but a general non-conductive synthetic resin may be used. In this case, the synthetic resin is applied in advance to the groove 6 of the exterior frame 2, and the lead wire 3 of the capacitor 1 is housed therein.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明は、コンデンサの外観形状に適
合した収納空間を有する外装枠に、コンデンサを収納す
るとともに、コンデンサのリード線を外装枠の開口端面
および底面に沿って折り曲げ、外装枠底面に設けた溝部
に塗着した合成樹脂とともに固定したことを特徴として
いるので、コンデンサのリード線と外装枠とが合成樹脂
により固定され、半田付は工程での外装枠の浮遊が防止
できる。そのため、チップ形コンデンサを適正に実装す
ることが容易になり、作業効率が向上する。As described above, the present invention stores a capacitor in an exterior frame having a storage space that matches the external shape of the capacitor, bends the lead wires of the capacitor along the open end surface and the bottom surface of the exterior frame, and Since the lead wire of the capacitor and the outer frame are fixed together with the synthetic resin coated in the groove provided in the capacitor, the lead wire of the capacitor and the outer frame are fixed by the synthetic resin, and floating of the outer frame during the soldering process can be prevented. Therefore, it becomes easy to properly mount the chip capacitor, and work efficiency improves.

また、外部からの機械的なストレスに対しても強固にな
るため、リード線の劣化を抑制できるほか、コンデンサ
本体への影響を軽減させることができ、信頬性の高いチ
ップ形コンデンサが得られる。Additionally, since it is strong against external mechanical stress, deterioration of the lead wires can be suppressed and the effects on the capacitor body can be reduced, resulting in a chip-type capacitor with high reliability. .

更に具体的には、合成樹脂が導電性であることを特徴と
しているので、リード線に予めこの合成樹脂を塗布して
おくことができ、製造工程が簡略になる。More specifically, since the synthetic resin is characterized by being electrically conductive, the lead wire can be coated with the synthetic resin in advance, which simplifies the manufacturing process.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この発明の実施例によるチップ形コンデンサ
を示した斜視図である。また、第２図は従来のチップ形
コンデンサをプリント基板に実装した状態を示す正面図
である。 １・・・コンデンサ、２・・・外装枠、３・・・リード
線、４・・・合成樹脂、５・・・壁部、６・・・溝部、
７・・・プリント基板、８・・・半田。FIG. 1 is a perspective view showing a chip type capacitor according to an embodiment of the present invention. Moreover, FIG. 2 is a front view showing a state in which a conventional chip-type capacitor is mounted on a printed circuit board. DESCRIPTION OF SYMBOLS 1... Capacitor, 2... Exterior frame, 3... Lead wire, 4... Synthetic resin, 5... Wall part, 6... Groove part,
7... Printed circuit board, 8... Solder.

Claims (2)

【特許請求の範囲】[Claims] （１）コンデンサの外観形状に適合した収納空間を有す
る外装枠に、コンデンサを収納するとともに、コンデン
サのリード線を外装枠の開口端面および底面に沿って折
り曲げ、外装枠底面に設けた溝部に塗着した合成樹脂と
ともに固定したことを特徴するチップ形コンデンサ。(1) Store the capacitor in an exterior frame that has a storage space that matches the external shape of the capacitor, bend the capacitor lead wires along the open end and bottom of the exterior frame, and apply them to the grooves provided on the bottom of the exterior frame. A chip-type capacitor characterized by being fixed together with a synthetic resin. （２）外装枠の溝部に塗着する合成樹脂が導電性の合成
樹脂からなることを特徴とする請求項１記載のチップ形
コンデンサ。(2) The chip-type capacitor according to claim 1, wherein the synthetic resin applied to the groove of the outer frame is made of a conductive synthetic resin.
JP63179853A 1988-07-19 1988-07-19 Chip type capacitors Expired - Fee Related JP2627778B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63179853A JP2627778B2 (en) 1988-07-19 1988-07-19 Chip type capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63179853A JP2627778B2 (en) 1988-07-19 1988-07-19 Chip type capacitors

Publications (2)

Publication Number Publication Date
JPH0228911A true JPH0228911A (en) 1990-01-31
JP2627778B2 JP2627778B2 (en) 1997-07-09

Family

ID=16073060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63179853A Expired - Fee Related JP2627778B2 (en) 1988-07-19 1988-07-19 Chip type capacitors

Country Status (1)

Country Link
JP (1) JP2627778B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523511U (en) * 1991-08-31 1993-03-26 太陽誘電株式会社 Chip type electronic parts with lead terminals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523511U (en) * 1991-08-31 1993-03-26 太陽誘電株式会社 Chip type electronic parts with lead terminals

Also Published As

Publication number Publication date
JP2627778B2 (en) 1997-07-09

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