JPH022949B2 - - Google Patents

Info

Publication number
JPH022949B2
JPH022949B2 JP11090987A JP11090987A JPH022949B2 JP H022949 B2 JPH022949 B2 JP H022949B2 JP 11090987 A JP11090987 A JP 11090987A JP 11090987 A JP11090987 A JP 11090987A JP H022949 B2 JPH022949 B2 JP H022949B2
Authority
JP
Japan
Prior art keywords
substrate
noble metal
polymer
palladium
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11090987A
Other languages
English (en)
Other versions
JPS634075A (ja
Inventor
Roido Jakuson Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS634075A publication Critical patent/JPS634075A/ja
Publication of JPH022949B2 publication Critical patent/JPH022949B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【発明の詳細な説明】 Ａ 産業上の利用分野 この発明は、基板に無電解メツキ法により金属
メツキができるように、基板上に貴金属のシード
を付着させる方法に関するものである。
Ｂ 従来技術 米国特許第4517254号明細書には、ポリイミド
の接着メタライゼーシヨンの方法が開示されてい
る。これには、ポリエチレンイミンは、ポリイミ
ドの前処理のために、水酸化アルカリの水溶液と
して用いられる多数の窒素化合物のうちの１つで
あることが示されている。
Ｃ 発明が解決しようとする問題点 この発明の目的は、基板上に貴金属シードを付
着させ、強固に結合させる方法を提供することに
ある。
Ｄ 問題点を解決するための手段 この発明によれば、貴金属化合物と錯体を生成
する能力のある重合体の薄層で基板をコーテイン
グする。この薄層は厚みが１ミクロン未満である
ことが好ましい。適当な重合体には、ポリアミ
ン、ポリ酸、およびポリ酸の塩が含まれる。錯体
を生成する重合体層は、好ましくは、溶液による
デイツプ・コーテイング、スプレイ・コーテイン
グ、またはスピン・コーテイング、もしくはプラ
ズマ付着等の非溶液法によりコーテイングする。
シーデイングは、重合体と、無電解メツキの触媒
作用を有する、またはこのような触媒に変換され
ることのできる貴金属化合物との錯体を形成する
ことにより行う。重合体は、貴金属化合物を基板
に強固に結合させる作用を有する。好ましい貴金
属化合物には、塩化パラジウム（）、硫酸パラ
ジウム（）等の水溶性の塩、酢酸パラジウム
（）等の有機溶媒溶性の化合物、パラジウムア
セチルアセトネート等の揮発性錯体が含まれる。
銅、ニツケル、金、プラチナ、銀等の他の金属も
使用できる。貴金属化合物と、錯体生成重合体と
の錯体は、貴金属化合物を重合体の溶液に添加し
て、この溶液を基板に塗布するか、重合体を基板
表面に塗布した後、別工程として貴金属化合物を
塗布するかの方法により形成させることができ
る。貴金属化合物を別に塗布するには、好ましく
は貴金属化合物の溶液を、デイツプ・コーテイン
グ、スプレイ・コーテイング、またはスピン・コ
ーテイングにより、もしくは化合物の蒸気に基板
を露出させることにより行う。過剰の貴金属化合
物は、水または溶剤で洗浄することにより、また
は揮発性貴金属化合物の場合は排気により除去す
ることができる。次に、必要があれば、貴金属化
合物は、露光、加熱、プラズマへの露出、または
還元剤処理等、多くの方法で活性化させることが
できる。場合により、活性化は不必要である。基
板のメタライゼーシヨンは、基板を銅およびニツ
ケル・メツキに用いるコモン・バス等の無電解メ
ツキ浴中に浸漬して行う。
基板の選択的メタライゼーシヨンは、フオトレ
ジストを使用して行う。これは、薄い錯体生成重
合体の層で基板をコーテイングした後、フオトレ
ジストで基板をコーテイングし、これをパターン
に従つて露光し、現像して、メタライズされる区
域を画定する。錯体生成重合体は、露光および現
像により露出されるが、侵食されることはない。
次に基板全体を貴金属化合物でコーテイングす
る。化合物はレジストの現像により露出された錯
体生成重合体と結合するが、フオトレジストとは
結合しない。したがつて化合物は水または溶剤で
洗浄することにより、または揮発性貴金属化合物
の場合は排気により、レジストから除去すること
ができる。代替方法として、貴金属化合物と、錯
体生成重合体との錯体を、フオトレジストの塗布
の前に、貴金属化合物と錯体生成重合体との単一
溶液を塗布するか、これらを別個に塗布するかに
より形成させることがきる。このように、錯体生
成重合体層は、貴金属化合物と基板を結合させる
だけでなく、電気解メツキによりメタライズする
基板の選択した区域を画定する作用を有する。次
に、必要があれば貴金属化合物を活性化させ、基
板を無電解メツキ浴中でメタライズする。
この発明の方法は特に電子パツケージング基
板、特に永久レジスト、すなわち回路ラインを画
定するだけでなく、誘電体の一部として基板上に
残るレジストをコーテイングした回路板に適用さ
れる。現在、永久レジストを用いて製造した印刷
回路板の、パターン化した無電解メツキは、通常
の方法では行うことができない。通常、パラジウ
ム等の貴金属の粒子からなるシーダをレジストの
下に付着させる。レジストを露出して回路のチヤ
ネルを画定し、基板を無電解付着浴に浸漬して回
路を形成する。メツキおよびレジストはく離後、
浴から過剰のシーダを除去する。レジストが回路
板の一部として残ると、これらの金属粒子も回路
板中に残り、短絡の通路の作用をする。この発明
は、レジストを露出、現像した後、回路チヤネル
の下面のみにシードを付着させる事により、永久
レジストを使用して基板に回路を形成する方法を
与える。
下記の例は、この発明を実施するための好まし
い方法を説明するものである。
Ｅ 実施例 例 １ 清浄な回路板の基板を、分子量が1000000のポ
リアクリル酸の0.05重合％溶液でデイツプ・コー
テイングした。基板を室温および最終的に100℃
で乾燥した後、永久レジストでコーテイングし、
露出して、１，１，１―トリクロロエタンでスプ
レイ現像を行つた。この後、基板を水酸化ナトリ
ウムの１重量％水溶液に浸漬し、脱イオン水で清
浄し、硫酸パラジウム（）の２重量％水溶液に
浸漬した後、再び脱イオン水で洗浄した。次にパ
ラジウム（）を金属パラジウムに予め還元せず
に、銅の無電解メツキを行つた。メツキは、銅
2.5ｇ／、EDTA40ｇ／、ホルムアルデヒド
0.5ｇ／を含む（定常状態の）無電解メツキ浴
で、PH11.7、温度70〜75℃で操作して行つた。銅
が所要の部分に、選択的に均一に付着した。
例 ２ 清浄な回路板の基板を、分子量が325000のポリ
アクリル酸ナトリウムの2.6重量％溶液でデイツ
プ・コーテイングした。この基板を室温および最
終的に100℃で乾燥した後、市販の乾燥皮膜回路
板レジストでコーテイングし、露出して１，１，
１―トリクロロエタンでスプレイ現像した。次に
基板をPdCl22重量％、NaCl1.3重量％を含有する
水溶液に浸漬した。過剰のPdCl2／NaClをすす
ぎ流した後、パラジウム（）を金属パラジウム
に予め還元せずに、例１で述べた無電解銅メツキ
浴で、無電解メツキを行つた。銅は所要の部分
に、選択的に均一に付着した。銅の付着が完了し
た後、レジストをジクロロメタンで除去し、基板
を高温の脱イオン水で洗浄し、過剰のポリアクリ
ル酸ナトリウムを除去した。
例 ３ 清浄なセラミツクのパッケージング基板を、分
子量が325000のポリアクリル酸ナトリウムを2.0
重量％、PdSO4を２重量％含有する水溶液でスピ
ン・コーテイングした。この基板を100℃で乾燥
した。乾燥した基板にレジストをコーテイング
し、露出、現像した。次にパラジウム（）を金
属パラジウムに予め還元せずに、例１で述べた無
電解メツキ浴で、基板に銅の無電解メツキを行つ
た。付着の選択性および均一性は良好であつた。
銅の付着が完了した後、レジストを除去し、基板
を高温の脱イオン水で洗浄し、過剰のポリアクリ
ル酸ナトリウムとPdSO4を除去した。
例 ４ 清浄な回路板の基板を、分子量12.00のポリエ
チレンイミンの２重量％水溶液でデイツプ・コー
テイングした。次にこの基板を、永久レジストで
コーテイング、露出した後、１，１，１―トリク
ロロエタンでスプレイ現像した。次に、塩化パラ
ジウム（）およびTClを含有する水溶液に基板
を浸漬した。これには液化パラジウム（）の
2.5重量％溶液を使用した。活性の強い無電解メ
ツキ浴を使用した場合は、わずか0.3重量％の塩
化パラジウム（）溶液で十分であつた。いずれ
の場合も、水溶液中のHClのモル濃度は、塩化パ
ラジウム（）のモル濃度の約２倍とした。水洗
により結合しない塩化パラジウム（）を除去し
た後、基板をPH12.8で、0.2Mのホルムアルデヒ
ド水溶液に浸漬して、パラジウム（）を金属パ
ラジウムに還元した。次に基板に無電解メツキを
行つた。高濃度の塩化パラジウム（）浴でシー
デイングした基板は、例１で述べた無電解メツキ
浴でメツキした。低濃度の塩化パラジウム（）
浴でシーデイングした基板は、銅2.5ｇ／およ
びホルムアルデヒド5.5ｇ／を含有する水性無
電解メツキ浴で、PH12.8、温度23℃でメツキを行
つた。いずれの無電解銅付着浴でも、この方法に
より良好な選択性が得られた。銅は、レジストを
除去した部分に均一に付着したが、レジストの表
面には付着しなかつた。
例１〜３で示したように、場合によつては還元
工程は不要である。これは、ほとんどのメツキ浴
で、Pd（）が無電解銅付着の活性開始剤である
ためである。これは、これらの浴に含有される塩
基性のホルムアルデヒドが、パラジウム（）を
急速に還元して金属パラジウムとするためであ
る。
Ｆ 発明の効果 この方法は、特に永久レジストを用いて製造す
る回路板の場合、通常のシーデイング法に比較し
て多くの利点を有する。この方法によれば、金属
も電解質も誘電体内に取り込まれることはない。
これは、レジストの下には重合体材料しかないた
めである。重合体は、誘合体層どうし、および誘
電体層と銅のラインとの接着を高めるためのもの
を選択することができ、これにより、回路板全体
の品質が改善される。この方法はアスペクト比の
高い孔のメツキにも応用することができる。これ
は、重合体のコーテイングが、孔の表面にも基板
の表面にも行うことができるためである。
この発明は、従来の貴金属粒子のシーダと比較
しても利点を有する。従来のシーダはコロイドと
して付着させ、したがつて粒子の大きな固まりを
形成することがあり、これが最約のメツキされた
コーテイングに欠陥を生ずる原因となつた。ま
た、コロイド状のシーダは、再現が困難であるこ
とがある。この明細書に述べる方法では、貴金属
シーダは、単相溶液、または蒸気として付着させ
るため、コロイド状シーダの塗布または調製に固
有の問題が除かれる。従来のシーダはまた、無電
解金属メツキの直前に、金属粒子の表面から酸化
物を除去する促進工程を必要とする。促進の後、
酸化物が再び形成する前に、基板をメツキしなけ
ればならない。この明細書に述べる方法では、シ
ーダは酸化物のコーテイングで覆われることがな
いため、促進剤は不要である。この結果、シーデ
イングした基板は、再活性化、または促進させる
ことなく、メツキ前にいつまでも放置することが
できる。

Claims (1)

  1. 【特許請求の範囲】 １ (a) 基板を、貴金属化合物と錯体を形成し得
    る重合体の層で被覆し、 (b) 上記重合体の層を、該重合体と形成し得る貴
    金属化合物と接触させる工程を有する、 無電解メツキ用シードの形成方法。 ２ 上記重合体の層の厚さが1μm以下である特許
    請求の範囲第１項記載の方法。 ３ 上記重合体がポリアミンである特許請求の範
    囲第１項記載の方法。 ４ 上記重合体がポリ酸またはポリ酸塩である特
    許請求の範囲第１項記載の方法。 ５ 上記貴金属化合物が、塩化パラジウム（）、
    硫酸パラジウム（）またはパラジウム・アセチ
    ルアセトネートである特許請求の範囲第１項記載
    の方法。
JP62110909A 1986-06-16 1987-05-08 無電解メツキ用シ−ドの形成方法 Granted JPS634075A (ja)

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US874976 1978-02-03
US06/874,976 US4701351A (en) 1986-06-16 1986-06-16 Seeding process for electroless metal deposition

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JPS634075A JPS634075A (ja) 1988-01-09
JPH022949B2 true JPH022949B2 (ja) 1990-01-19

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EP0250867A1 (en) 1988-01-07
JPS634075A (ja) 1988-01-09
US4701351A (en) 1987-10-20

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