JPH0229513U - - Google Patents
Info
- Publication number
- JPH0229513U JPH0229513U JP10858488U JP10858488U JPH0229513U JP H0229513 U JPH0229513 U JP H0229513U JP 10858488 U JP10858488 U JP 10858488U JP 10858488 U JP10858488 U JP 10858488U JP H0229513 U JPH0229513 U JP H0229513U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- chip
- electronic component
- type electronic
- lead member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案に係るチツプ型電子部品の正面
図、第２図は外部リード部材を折り曲げる以前の
チツプ型電子部品の正面図、第３図は外部リード
部材の折り曲げ後のチツプ型電子部品の倒立させ
たものの斜視図である。第４図は従来のチツプ型
電子部品の一具体例を示す正断面図、第５図Ａ，
Ｂ，Ｃは外部リード部材の折り曲げ順序を示す各
正面図、第６図は従来のチツプ型電子部品におけ
る樹脂モールドされた部品本体と外部リード部材
の接続状態と外観形状を例示する正面図である。
４，６…外部リード部材、１３，１４…凹部、
１７…チツプ型電子部品、ｔ０…外部リード部材
の厚み、ｔ１…凹部の深さ。
Figure 1 is a front view of the chip-type electronic component according to the present invention, Figure 2 is a front view of the chip-type electronic component before the external lead member is bent, and Figure 3 is the chip-type electronic component after the external lead member is bent. FIG. 2 is a perspective view of an inverted version of Figure 4 is a front sectional view showing a specific example of a conventional chip type electronic component, Figure 5A,
B and C are front views showing the bending order of the external lead members, and FIG. 6 is a front view illustrating the connection state and external shape of the resin-molded component body and the external lead member in a conventional chip-type electronic component. . 4, 6... External lead member, 13, 14... Recessed part,
17...Chip type electronic component, t0 ...Thickness of external lead member, t1 ...Depth of recess.
Claims (1)
に反対方向に向かつて導出されて折曲げ成形され
る外部リード部材を有するチツプ型電子部品にお
いて、 前記部品本体に、少なくとも前記外部リード部
材の厚みと略同一の深さを有する凹部を形成し、
この凹部に外部リード部材を収納したことを特徴
とするチツプ型電子部品。[Claims for Utility Model Registration] A chip-type electronic component having external lead members that are led out and bent in opposite directions from the side end surfaces of a resin-molded component body, wherein at least the forming a recess having a depth substantially equal to the thickness of the external lead member;
A chip-type electronic component characterized in that an external lead member is housed in this recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10858488U JPH0229513U (en) | 1988-08-17 | 1988-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10858488U JPH0229513U (en) | 1988-08-17 | 1988-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229513U true JPH0229513U (en) | 1990-02-26 |
Family
ID=31344060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10858488U Pending JPH0229513U (en) | 1988-08-17 | 1988-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229513U (en) |
-
1988
- 1988-08-17 JP JP10858488U patent/JPH0229513U/ja active Pending
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