JPH0229523U - - Google Patents

Info

Publication number
JPH0229523U
JPH0229523U JP1988107406U JP10740688U JPH0229523U JP H0229523 U JPH0229523 U JP H0229523U JP 1988107406 U JP1988107406 U JP 1988107406U JP 10740688 U JP10740688 U JP 10740688U JP H0229523 U JPH0229523 U JP H0229523U
Authority
JP
Japan
Prior art keywords
collet
chip
view
tray
reference marker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988107406U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988107406U priority Critical patent/JPH0229523U/ja
Publication of JPH0229523U publication Critical patent/JPH0229523U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の原理構成を示す正面図、第２
図は本考案の一実施例を部分断面で示す正面図、
第３図は本考案の一実施例におけるチツプ位置合
せ手順を説明するための斜視図、第４図はチツプ
位置合せがほぼ完了した状態を下から見た斜視図
、第５図は基準マーカの変形例を示すコレツトの
底面図、第６Ａ図は従来のチツプ把持工程を部分
断面で示す正面図、第６Ｂ図は従来のチツプ接着
工程を部分断面で示す正面図、第７Ａ図はチツプ
が傾いて把持された状態を示す側面図、第７Ｂ図
はチツプが傾いて把持された状態を示す底面図、
第８図はチツプ接着時の状態を部分断面で示す側
面図である。 １…チツプ、２…トレイ、３…基板、４…コレ
ツト、６…基準マーカ、７…検知部、２４…ミラ
ー、６０…基準線、６２…基準目盛。 Figure 1 is a front view showing the principle configuration of the present invention, Figure 2
The figure is a front view showing an embodiment of the present invention in partial cross section.
FIG. 3 is a perspective view for explaining the chip positioning procedure in an embodiment of the present invention, FIG. 4 is a perspective view of the state in which the chip positioning is almost completed, viewed from below, and FIG. 5 is a perspective view of the reference marker. FIG. 6A is a front view showing a conventional chip gripping process in partial cross section; FIG. 6B is a front view showing a conventional chip bonding process in partial cross section; FIG. 7A is a bottom view of a collet showing a modified example; FIG. 7A is a front view showing a conventional chip gripping process in partial cross section; FIG. 7B is a side view showing a state in which the chip is held at an angle; FIG. 7B is a bottom view showing a state in which the chip is held at an angle;
FIG. 8 is a side view showing, in partial cross section, the state when the chip is bonded. DESCRIPTION OF SYMBOLS 1...Chip, 2...Tray, 3...Substrate, 4...Collection, 6...Reference marker, 7...Detection part, 24...Mirror, 60...Reference line, 62...Reference scale.

Claims (1)

【実用新案登録請求の範囲】 チツプ１を載置するトレイ２と、前記チツプ１
を把持するコレツト４と、該コレツト４および前
記トレイ２を相対的に移動せしめる操作部５とを
有するダイボンデイング装置において、 該コレツト４の一部に基準マーカ６を形成し、 該基準マーカ６および前記チツプ１の相対位置
を監視する検知部７を設け、 前記相対位置を監視しながら前記操作部５を操
作して、前記チツプ１を前記コレツト４内の所定
位置に案内することを特徴とするダイボンデイン
グ装置。[Claims for Utility Model Registration] A tray 2 on which chips 1 are placed, and said chips 1.
In the die bonding apparatus, which has a collet 4 that grips the collet 4, and an operation section 5 that relatively moves the collet 4 and the tray 2, a reference marker 6 is formed on a part of the collet 4, and the reference marker 6 and the The present invention is characterized in that a detection unit 7 for monitoring the relative position of the chip 1 is provided, and the operating unit 5 is operated while monitoring the relative position to guide the chip 1 to a predetermined position in the collet 4. Die bonding equipment.
JP1988107406U 1988-08-16 1988-08-16 Pending JPH0229523U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988107406U JPH0229523U (en) 1988-08-16 1988-08-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988107406U JPH0229523U (en) 1988-08-16 1988-08-16

Publications (1)

Publication Number Publication Date
JPH0229523U true JPH0229523U (en) 1990-02-26

Family

ID=31341791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988107406U Pending JPH0229523U (en) 1988-08-16 1988-08-16

Country Status (1)

Country Link
JP (1) JPH0229523U (en)

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