JPH0229524U - - Google Patents

Info

Publication number
JPH0229524U
JPH0229524U JP1988107701U JP10770188U JPH0229524U JP H0229524 U JPH0229524 U JP H0229524U JP 1988107701 U JP1988107701 U JP 1988107701U JP 10770188 U JP10770188 U JP 10770188U JP H0229524 U JPH0229524 U JP H0229524U
Authority
JP
Japan
Prior art keywords
semiconductor chip
chip suction
holder
suctioning
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988107701U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988107701U priority Critical patent/JPH0229524U/ja
Publication of JPH0229524U publication Critical patent/JPH0229524U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す断面図、第2
図は本考案の他の実施例を示す断面図である。第
3図は従来のマウント用コレツトの断面図である
。 1……ホルダー、2……可動コレツト先端部、
2′……コレツト先端部、3……ノズル穴、4…
…ペレツト、5……シート、6……突上針、7…
…コレツト可動アーム、8……真空チユーブ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing another embodiment of the present invention. FIG. 3 is a sectional view of a conventional mounting collet. 1...Holder, 2...Movable collet tip,
2'... Collet tip, 3... Nozzle hole, 4...
...Pellet, 5... Sheet, 6... Thrust needle, 7...
...Collection movable arm, 8...Vacuum tube.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを吸着して保持する半導体チツプ
吸着用コレツトにおいて、ホルダーの下部にチツ
プ吸着部を可動できるように取り付けたことを特
徴とする半導体チツプ吸着用コレツト。
A semiconductor chip suction collet for suctioning and holding a semiconductor chip, characterized in that a chip suction part is movably attached to the lower part of the holder.
JP1988107701U 1988-08-15 1988-08-15 Pending JPH0229524U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988107701U JPH0229524U (en) 1988-08-15 1988-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988107701U JPH0229524U (en) 1988-08-15 1988-08-15

Publications (1)

Publication Number Publication Date
JPH0229524U true JPH0229524U (en) 1990-02-26

Family

ID=31342352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988107701U Pending JPH0229524U (en) 1988-08-15 1988-08-15

Country Status (1)

Country Link
JP (1) JPH0229524U (en)

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