JPH0229530U - - Google Patents
Info
- Publication number
- JPH0229530U JPH0229530U JP10772888U JP10772888U JPH0229530U JP H0229530 U JPH0229530 U JP H0229530U JP 10772888 U JP10772888 U JP 10772888U JP 10772888 U JP10772888 U JP 10772888U JP H0229530 U JPH0229530 U JP H0229530U
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- metal
- plate flange
- annular
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案による第１の実施例を示す断面
図、第２図は本考案による第２の実施例を示す断
面図、第３図は従来における平形半導体装置の一
例を示す断面図である。
１……半導体素子、２，７……金属円形電極、
３……高絶縁性環状体、４，５，８……金属薄板
フランジ、６……容器、９……蓋、１０，１０′
……Ｏリング、１１，１２……貫通孔、１３，１
３′……ビス、１４，１４′……ナツト。
FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a second embodiment of the invention, and FIG. 3 is a sectional view showing an example of a conventional flat semiconductor device. be. 1... Semiconductor element, 2, 7... Metal circular electrode,
3... Highly insulating annular body, 4, 5, 8... Metal thin plate flange, 6... Container, 9... Lid, 10, 10'
... O-ring, 11, 12 ... Through hole, 13, 1
3'...screw, 14,14'...nut.
Claims (1)
導板フランジがろう接され、他方には中央に第１
の金属円形電極がろう接された第２の金属環状板
フランジが前記絶縁性環状体にろう接密閉され、
前記第１の金属円形電極上に半導体素子が配置さ
れ、更に中央部に第２の金属円形電極がろう接さ
れた第３の金属環状板フランジが前記絶縁性環状
体の一方の開口部のろう接された前記第１の金属
環状薄板フランジにＯリングを介して重ねられ外
周同一部に配置せられた孔を通してビス及びナツ
トで接続されたことを特徴とする平形半導体装置
。 A first metal annular conducting plate flange is soldered to one opening of the insulating annular body, and a first metal annular conductive plate flange is soldered to the other opening in the center.
a second metal annular plate flange to which a metal circular electrode is soldered is soldered and sealed to the insulating annular body;
A semiconductor element is disposed on the first metal circular electrode, and a third metal annular plate flange having a second metal circular electrode soldered to the center thereof is soldered to one opening of the insulating annular body. A flat semiconductor device, characterized in that it is connected to the first metal annular thin plate flange which is in contact with the first metal annular thin plate flange via an O-ring and through holes arranged on the same part of the outer circumference with screws and nuts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10772888U JPH0229530U (en) | 1988-08-16 | 1988-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10772888U JPH0229530U (en) | 1988-08-16 | 1988-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229530U true JPH0229530U (en) | 1990-02-26 |
Family
ID=31342403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10772888U Pending JPH0229530U (en) | 1988-08-16 | 1988-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229530U (en) |
-
1988
- 1988-08-16 JP JP10772888U patent/JPH0229530U/ja active Pending
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