JPH0229532U - - Google Patents
Info
- Publication number
- JPH0229532U JPH0229532U JP1988107718U JP10771888U JPH0229532U JP H0229532 U JPH0229532 U JP H0229532U JP 1988107718 U JP1988107718 U JP 1988107718U JP 10771888 U JP10771888 U JP 10771888U JP H0229532 U JPH0229532 U JP H0229532U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic component
- cap
- ceramic
- type element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図および第２図は本考案のセラミツクパツ
ケージ型素子の構成例を示すもので第１図は側面
図、第２図は上面図、第３図および第４図は従来
のセラミツクパツケージ型素子の構成を示したも
ので第３図は側面図、第４図は上面図である。
１……セラミツク回路基板、２……キヤツプ、
５……金属板、５ａ……膨出部、６……取着用透
孔。
1 and 2 show an example of the structure of the ceramic package type element of the present invention, in which Figure 1 is a side view, Figure 2 is a top view, and Figures 3 and 4 are examples of the conventional ceramic package type element. 3 is a side view and FIG. 4 is a top view. 1... Ceramic circuit board, 2... Cap,
5...Metal plate, 5a...Bulging portion, 6...Through hole for attachment.
Claims (1)
に搭載された電子部品と、前記回路基板に開口端
面が接続し搭載されている電子部品を気密に封止
するキヤツプと、前記回路基板と略同等の熱膨脹
率を有し且つ回路基板の他の主面にこの回路基板
より端縁が膨出して一体的に配設された金属板と
、前記金属板の膨出部に穿設された取着用透孔と
を具備して成ることを特徴とするセラミツクパツ
ケージ型素子。 A ceramic circuit board, an electronic component mounted on one main surface of the circuit board, a cap whose open end surface is connected to the circuit board and hermetically seals the mounted electronic component, and a cap approximately equivalent to the circuit board. a metal plate having a coefficient of thermal expansion of A ceramic package type element characterized by comprising a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107718U JPH0229532U (en) | 1988-08-16 | 1988-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107718U JPH0229532U (en) | 1988-08-16 | 1988-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229532U true JPH0229532U (en) | 1990-02-26 |
Family
ID=31342383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988107718U Pending JPH0229532U (en) | 1988-08-16 | 1988-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229532U (en) |
-
1988
- 1988-08-16 JP JP1988107718U patent/JPH0229532U/ja active Pending
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