JPH02296345A - Semiconductor device - Google Patents

Abstract

PURPOSE:To exclude the protrusion of a lead from a lead resin sealing part, and reduce a mounting area, by bending the lead connected with a semiconductor element in an U-shape, and arranging it on an insulating layer on the rear of a semiconductor element, through the side surface of the semiconductor element. CONSTITUTION:A lead 3 connected with an electrode 9 of a semiconductor element 6 is cut, made to pass through the side surface 14 of the semiconductor element, bent in an U-shape, and arranged on the rear 15 of the semiconductor element. A film 1 for retaining the lead acts as an insulating layer, and prevent the short circuitting between the semiconductor element 6 and the lead 3. After that, resin sealing is performed, while outer connection regions 16 of the leads 3 are left. Thereby the leads can be prevented from protruding from the resin sealing part, so that mounting area can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure for a semiconductor device, and more particularly to an improvement in the arrangement of leads of a semiconductor device.

[Conventional technology]

Generally, a semiconductor device is manufactured by attaching a semiconductor element to a die pad provided on a lead frame, connecting the external electrodes of the semiconductor element and terminals of the lead frame with wires, and bonding these with a resin pair using a thermosetting resin such as epoxy resin. ]After that, each terminal is cut and manufactured.

Recently, as electronic devices have become smaller and thinner, there has been a desire for thinner and smaller semiconductor devices to be mounted in higher density. In order to meet these demands, a semiconductor element is placed in the device hole of a film carrier, and the electrodes of the usually rectangular semiconductor element are directly connected to the leads of the film carrier.
By printing or potting a seal made of liquid resin (for example, epoxy resin) on this, a resin pair type semiconductor device came to be used. FIG. 4 is a plan view for explaining a semiconductor device using a film carrier. In the figure, 1 indicates device holes 2.2a, 2b, 2C having an area larger than the surface area of semiconductor elements 6.6a, 6b, 6C%, etc., which will be described later, at equal intervals in the length direction.
This is a film carrier (hereinafter referred to as a film) having a thickness of about 25 to 125 μm and provided with 1. 3 is a material with high conductivity such as copper provided on the film 1 with a thickness of 10~
There are many glues made of metal foil with a width of about 70 μm and a width of 30 to 200 μm, some of which protrude into the device hole and become free ends. 4 is a sprocket hole for conveying the film 1.

FIG. 5 is a schematic diagram showing an example of an apparatus for attaching a semiconductor element to the film 1 as described above, in which the semiconductor element 6 placed on the semiconductor element mounting table 5 is positioned at a predetermined position by a positioning guide 7. be done. On the other hand, the film guided by the tape rail 8 and fed in the direction perpendicular to the plane of the paper by the sprocket stops at the position where the device hole 2 reaches the top of the semiconductor element 6, and then Align electrode 1 and electrodes -1 and '3, respectively. Then, the heated bonding tool]O is lowered to apply pressure to each lead 3 and form it at a predetermined angle to bond and connect each lead 3 and the electrode 9. Next, the film 1 is moved to cut each lead 3, or a part of the semiconductor element 6 and the leads 3 are sealed in liquid by squeegee printing, botting, etc., as shown in the cross-sectional view of a conventional semiconductor device shown in FIG. Resin sealing part 1-1 by sealing with sealing resin
After forming the lead 3, the lead 3 including the film 1 for holding the lead is cut to produce a semiconductor device.

As shown in FIG. 7, the semiconductor device manufactured as described above has a large number of glue parts 3 and a printed circuit board 1-2.
The wires were connected to wiring terminals 13 provided on the wires by soldering, conductive adhesive, anisotropic conductive sheet, or the like.

[Problem to be solved by the invention]

However, in the prior art described above, since the leads 3 protrude outward from the resin sealing part, there is a problem in that the mounting area for the outwardly protruding leads becomes large. The present invention was made to solve these problems, and its purpose is to arrange an insulating layer on the back side of a semiconductor element in a semiconductor device mounted on a film carrier, and to connect leads connected to the semiconductor element. By bending it into a U-shape, passing through the side of the semiconductor element, placing it on the insulating layer on the back of the semiconductor element, and sealing it with resin, the leads do not protrude beyond the resin sealing part, thus reducing the mounting area. It is located where the equipment is provided.

[Means to solve the problem]

In the semiconductor device of the present invention, an insulating layer is placed on the back side of the semiconductor element, and the lead connected to the semiconductor element is bent into a U shape, passes through the side of the semiconductor element, and is placed on the insulating layer on the back side of the semiconductor element. It is characterized by being sealed.

[For production]

According to the structure of item 1 of the present invention, the leads can be prevented from protruding from the resin sealing portion, so that the mounting area can be reduced.

〔Example〕

FIG. 1 is a sectional view for explaining one embodiment of the present invention. 3 is a lead, 6 is a semiconductor element, and 11 is a resin sealing part. Connected to the electrode 9 of the semiconductor element 6 or partially connected to the electrode 9 of the semiconductor element 6
The lead 3 is cut, passed through the side surface 14 of the semiconductor element, bent into a U-shape, and placed on the back surface 15 of the semiconductor element. At this time, the lead holding film 1 plays the role of an insulating layer,
It serves to prevent short circuits between the semiconductor element 6 and the leads 3. Thereafter, the leads 3 are sealed with resin, leaving the external connection ranges 16, thereby completing a semiconductor device with a larger receiving area than conventional semiconductor devices. In addition, as shown in FIG. 2, sealing resin is applied to the back surface 15 of the semiconductor device T-6 in advance for insulation, and when the leads 3 are bent into a U shape, the back surface 15 of the semiconductor element 6 is A similar effect can be obtained by forming a gap with the lead 3 and filling the gap with resin during resin sealing to prevent interference with the semiconductor element 6. FIG. 3 shows an example of mounting the semiconductor device of the present invention, in which the external connection range of the semiconductor device manufactured as described above is soldered to the wiring terminal 3 provided on the printed wiring board 12, respectively. They can be connected using a conductive adhesive, an anisotropic conductive sheet, etc., and the packaging density can be increased compared to conventional methods.

〔Effect of the invention〕

As described above, according to the present invention, an insulating layer is provided on the back side of a semiconductor element, and the lead connected to the semiconductor element is bent into a U shape and passes through the side of the semiconductor element onto the insulating layer on the back side of the semiconductor element. By arranging the leads and sealing them with resin, it is possible to eliminate the need for the leads to protrude from a portion of the resin pair I and to keep the mounting area small compared to conventional semiconductor devices.

The explanatory diagrams, Figures 6 and 7, are conventional problems! ,′λ
FIG. 2 is a sectional view for explaining.

】・ 2・ 3・ 6・ 9・ 1　　　・ 12・ ]　3　・ 14・ 15・ 16・ film device hole lead semiconductor element electrode Resin sealing part printed wiring board Wiring terminal side Back side External connection range

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the invention, FIG. 3 is a sectional view of an implementation example using the present invention, and FIGS. Figure 5 shows the applicant who manufactures semiconductor devices using film carriers: Seiko Epson Co., Ltd. r1 Agent: Patent attorney Kizobe Suzuki (and 1 other person) - n 4

Claims (1)

[Claims] (1) A semiconductor element is disposed in a notch of a film carrier, and the leads of the film carrier are connected to a number of electrodes provided on the semiconductor element, respectively, and the leads are cut, or the semiconductor element and the leads are cut. In a semiconductor device in which the leads are cut after being partially sealed with resin etc., an insulating layer is placed on the back surface of the semiconductor element, and the leads connected to the semiconductor element are shaped into a U-shape. 1. A semiconductor device, characterized in that the leads are bent and passed through a side surface of the semiconductor element, placed on an insulating layer on the back surface of the semiconductor element, and sealed with a resin, and a part of the lead is exposed from the sealing resin.