JPH02296367A - Solid state image pick-up device - Google Patents

Abstract

PURPOSE:To enhance the quality and the productivity of the title solid state image pick-up device by a method wherein a silicone resin is used as a mounting agent to bond a solid state image pick-up device onto the specific position in the recess of a semiconductor enclosure. CONSTITUTION:A silicone resin is used as a mounting agent 3 to bond a solid image pick-up element 4 onto the specific position in the recess of a semiconductor enclosure 2. This silicone resin used as the mounting agent 3 can meet such requirements as the low gas production ratio of Na or Cl, etc., to be an obstructive material to the setting of the mounting agent 3 during the high temperature setting process as well as the almost perfect moisture resistance. Accordingly, the inducement to the release of resin interface in contact adhesion to the recess of the semiconductor enclosure 2 can be prevent from being offered. Furthermore, the setting time of the silicone resin is specified not to exceed 30 minutes. Through these procedures, the quality and the productivity of the title solid image pick-up device 1 can be enhanced.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a solid-state imaging device.

(Conventional technology) Solid-state imaging devices are generally manufactured as follows.

First, a solid-state imaging device such as a CCD is fixed to a predetermined location in a recess of a semiconductor envelope made of ceramic or glass epoxy using a mounting agent made of epoxy resin. Then, the fixed electrodes of the solid-state image pickup device and the inner leads of the semiconductor envelope are connected by wire bonding using thin wires such as Au or A11, and then resin material 1]-1 is applied. Thereafter, the solid-state image sensor is covered with a light-transmitting member in order to protect the solid-state image sensor from external forces and ensure an optical path.

(Problems to be Solved by the Invention) However, in the conventional solid-state imaging device obtained in this manner, since an epoxy resin is used as a mounting agent, there are the following problems.

a) Epoxy resin is free from Na and C during the high temperature curing process.
The gas generation rate is high, such as 1.111. Bubbles of Na, Cg, etc., which become curing inhibitors, are likely to be generated in the resin. This induces peeling of the resin interface that is in close contact with the recess of the semiconductor envelope, which is not very desirable in terms of quality.

b) In addition, the epoxy mounting agent must be
It took two hours, which was not very desirable for mass production of solid-state imaging devices.

C) Furthermore, epoxy mounting agents easily absorb moisture;
The absorbed moisture becomes moisture that inhibits curing of the sealing resin. For this reason, as in item a), separation of Al1 was induced at the resin interface in close contact with the recess of the semiconductor envelope, which was not very desirable in terms of quality.

The present invention has been made in consideration of the above two problems, and it is an object of the present invention to provide a solid-state imaging device with as high quality as possible and with high productivity.

[Structure of the invention]

(Means for Solving the Problems) The present invention fixes a solid-state image sensor to a predetermined position in a recess of a semiconductor envelope using a mounting agent, and connects electrodes of the fixed solid-state image sensor to a predetermined position of a recess of a semiconductor envelope. In a solid-state imaging device formed by connecting the inner lead of the device by wire bonding, using an elastic resin to fix the resin, and then covering the photosensitive part of the solid-state imaging device with a light-transmitting material, a silicon-based mounting agent is used. It is characterized by the use of resin.

(Function) According to the solid-state imaging device of the present invention configured as described above,
Silicone resin is used as a mounting agent. This silicone-based resin has a lower rate of generation of gases such as Na and Cg that become curing inhibitors during the high-temperature curing process than conventionally used Epoquine-based resins, and also hardly absorbs moisture. This makes it possible to prevent as much as possible the occurrence of peeling of the resin interface that is in close contact with the concave portion of the semiconductor envelope, making it possible to obtain a high-quality solid-state imaging device.

Furthermore, since the curing time of the silicone resin is 30 minutes or less, productivity can be improved as much as possible compared to the conventional case of using an epoxy resin.

(Embodiment) FIG. 1 shows an embodiment of the solid-state imaging device of the present invention. In the solid-state imaging device 1 of this embodiment, a mounting agent 3 made of silicone resin is applied to a predetermined location of a recessed portion of a conductor envelope 2 made of ceramic or glass epoxy or the like using a dispenser or a transfer technique. Next, after positioning and placing the solid-state image sensor 4 on the mounting agent, the mount agent 3 is cured at high temperature using an oven'', 9, and the solid-state image sensor r-4 is placed in the recess of the semiconductor envelope 2. Stir and stir.

After that, the electrodes (not shown) of the solid-state image sensor 4 and the inner leads 5 of the semiconductor envelope 2 are connected with a thin wire (such as Au or Aβ).
Connect by wire bonding using wire) 6. Then, sealing is performed using a silicon-based sealing IL resin 7. At this time, the sealing resin 7 is prevented from leaking out from the recessed portion of the semiconductor envelope 2. Next, a light-transmitting part 8 is placed on the sealing resin 7 using a vacuum suction method so as to cover the photosensitive part of the solid-state image sensor 4.
The sealing resin 7 is cured using an oven or the like, and the translucent member 8 is fixed.

According to the solid-state imaging device formed in this way, silicone resin is used as the mounting agent.

Compared to conventionally used epoxy resins, this silicone resin contains Na, which is a curing inhibitor during the high temperature curing process.
The generation rate of gases such as and Cg is low, and it absorbs almost no moisture. Therefore, peeling of the resin interface that is in close contact with the recessed portion of the semiconductor envelope 2 can be prevented as much as possible. Furthermore, because the sealing resin 7 uses a silicone resin similar to the mounting agent 3, there is almost no difference in expansion coefficient between the mounting agent 3 and the sealing resin 7, and therefore peeling at the resin interface is less likely to occur. Become.

Furthermore, since the curing time of silicone resin is 30 minutes or less, productivity can be improved as much as possible compared to conventional products using epoxy resin.

As explained above, according to this embodiment, it is possible to obtain a solid-state imaging device with substantially higher quality and productivity.

〔Effect of the invention〕

According to the present invention, it is possible to obtain a solid-state imaging device with as high quality as possible and with high productivity.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of a solid-state imaging device according to the present invention. 1... Solid-state imaging device, 2... Semiconductor envelope, 3... Mounting agent, 4 - Solid-state imaging device, 5... Inner lead,
6...Thin wire (wire), 7...Sealing resin, 8...Translucent material. Applicant's agent Mr. Sato

Claims (1)

[Claims] 1. A solid-state image sensor is fixed to a predetermined position in a recess of a semiconductor envelope using a mounting agent, and the electrodes of the fixed solid-state image sensor are connected to the inner leads of the semiconductor envelope. In the solid-state imaging device formed by connecting the solid-state imaging device by wire bonding and then resin-sealing using an elastic resin, and covering the photosensitive part of the solid-state imaging device with a light-transmitting member, a silicon-based resin is used as the mounting agent. A solid-state imaging device characterized by: 2. The solid-state imaging device according to claim 1, wherein a silicon resin is used as the elastic resin.