JPH0229716Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> This invention relates to a multilayer capacitor used as a pin connector with a filter function.

<Prior art> Pin connectors used to connect various electrical circuits connect an input terminal to one end of the pin and a relay terminal to the other end, but if the pin part is not sufficiently shielded, , noise will be generated on the output side.

For this reason, in conventional pin connectors, as shown in Fig. 1, a pipe-shaped capacitor 1 is used, the capacitor 1 is fitted onto the pin 2, and one capacitor electrode 3 of the capacitor 1 is attached to the pin 2, and the capacitor 1 is attached to the outside of the pin 2. A feed-through capacitor is used in which the ground electrode 4, which is the other capacitive electrode, is connected to the ground 5 using an external case, etc., and the high frequency generated at pin 2 is passed to the ground 5 to prevent the generation of noise. has been done.

By the way, when a cylindrical feed-through capacitor like the one above is used in a connector with many pins, capacitors corresponding to the number of pins are required, and they must be attached to each pin individually. As a result, the assembly process becomes complicated, and since a large number of capacitors are assembled, the size and weight of the connector become large, and in addition, the manufacturing cost becomes high.

<Problems to be solved by the invention> This invention was made to solve the problems mentioned above. It simplifies the assembly process of a connector with a large number of pins, and constructs a small and inexpensive connector. The purpose of the present invention is to provide a through-layer capacitor block that can be used.

<Means for Solving the Problems> The configuration of this invention is that ground electrodes are provided above and below the inside of a laminated substrate provided with pin through holes so as not to come into contact with the through holes, and the ground electrodes are provided on both opposing surfaces of the laminated substrate. A capacitive electrode is provided to form a capacitance with the ground electrode and short-circuited with the pin, allowing multiple pins to be connected together.

<Embodiment> Hereinafter, an embodiment of this invention will be described based on FIGS. 2 to 5 of the accompanying drawings.

As illustrated, the laminated substrate 11 includes various dielectric materials,
For example, a rectangular block is formed by laminating ceramics, and on both sides along the longitudinal direction,
A large number of pin through holes 12 are arranged side by side at regular intervals.

Ground electrodes A and B, which are continuous along the parallel direction of the pin through holes 12, are buried at positions on both sides along the longitudinal direction inside the laminated substrate 11 using appropriate means.

As shown in FIG. 3, the ground electrodes A and B are made such that the inner edges facing the through hole 12 maintain an appropriate distance from the through hole 12 and do not come into contact with the through hole 12, and the outer edges are laminated. External terminals C and C are formed so as to reach the outer circumferential surface of the substrate 11, and are connected to the ground electrodes A and B on the outer circumferential portion of the laminated substrate 11.

At the positions where each through hole 12 is provided on the upper and lower surfaces of the laminated substrate 11, strip-shaped capacitive electrodes D and E are provided so as to face the ground electrodes A and B with a part of the laminated substrate 11 sandwiched therebetween. .

In the illustrated case, the capacitor electrodes D and E have one end facing the end of the through hole 12, but they may be formed wider than the through hole 12 and surround the end of the through hole 12, for example. .

When the connecting pins 13 are inserted into each through hole 12 of the laminated substrate 11, the pins 13 are connected to the capacitive electrodes D and E provided on the upper and lower surfaces by means such as soldering, and are short-circuited.

In the case shown in the figure, the number of pins attached is five on each side of the laminated board 11, for a total of ten pins.
The number of pins is not limited to what is shown in the diagram, and can be freely increased or decreased as necessary.
The shape of 1 is not limited to a rectangle either.

In the capacitor block of the above embodiment, a through hole 12 for a pin 13 is formed in a laminated substrate 11 provided with ground electrodes A and B inside and capacitive electrodes D and E on the surface, and a through hole 12 for a pin 13 is formed on the outer periphery of the laminated substrate 11. , B is provided, thereby creating a capacitor block as shown in FIG.

By inserting pins 13 into each through hole 12 of this capacitor block and short-circuiting pins 13 and capacitor electrodes D and E by soldering or the like, a multi-pin connector as shown in the circuit shown in FIG. 5 is constructed. be done.

The circuit diagram shown in FIG. 5 is an equivalent circuit of the cross section of the capacitor block shown in _FIG .
D ₂ , D ₃ , D ₄ , D ₅ , E ₁ , E ₂ , E ₃ , E ₄ , E ₅ , are in the same multilayer substrate 11, and the respective combinations D ₁
and E ₁ , D ₂ and E ₂ , D ₃ and E ₃ , D ₄ and E ₄ , and D ₅ and E ₅ are in a conductive state with each other through their respective pins 13, and each capacitor electrode D ₁ to D ₅ , E ₁ to E ₅ form a capacitor between the common ground electrodes A and B, respectively.

<Effects of the invention> As described above, according to this invention, the ground electrode is provided inside the laminated board in which the pin through-hole is provided so as not to come into contact with the through-hole, and the earth electrode is inserted into the through-hole on the surface of the laminated board. Capacitive electrodes are provided to short-circuit with the pins, and ground electrodes are provided above and below the multilayer board, forming a π-shaped circuit, so capacitors for multiple pin connectors can be combined into one multilayer board. Moreover, a pin connector can be constructed by simply inserting a pin into a through hole, which simplifies the assembly process, reduces overall size and weight, and reduces assembly and material costs. can.

Furthermore, the π-type circuit configuration makes it possible to configure a feedthrough capacitor that has a better noise removal effect than a normal feedthrough capacitor.

Further, there are no restrictions on the shape of the laminated substrate, and it can be finished into various shapes as necessary.

By the way, the capacitance of the capacitor block of this invention varies depending on the size and rated voltage, but it is possible to obtain a capacitance of 10pF to 1NF.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal sectional view showing a conventional capacitor block, Fig. 2 is a perspective view of the capacitor block according to this invention, Fig. 3 is a plan view of the same, Fig. 4 is a longitudinal sectional view of the same, and Fig. 5 is a longitudinal sectional view of the same. It is an equivalent circuit diagram same as the above. 11...Substrate, 12...Through hole, 13...Pin, A, B...Earth electrode, C...External electrode,
D, E...capacitive electrodes.

Claims (1)

[Scope of utility model registration request] Ground electrodes are provided above and below the inside of a laminated board in which a hole through which a pin is formed so as not to come into contact with the hole, and a plurality of capacitive electrodes forming a capacitance with the ground electrode are provided on both opposing surfaces of this laminated board. established,
A through-layer capacitor block characterized in that a pin passing through a hole and a capacitor electrode can be short-circuited.