JPH02304902A - Platinum temperature sensor - Google Patents
Platinum temperature sensorInfo
- Publication number
- JPH02304902A JPH02304902A JP12415989A JP12415989A JPH02304902A JP H02304902 A JPH02304902 A JP H02304902A JP 12415989 A JP12415989 A JP 12415989A JP 12415989 A JP12415989 A JP 12415989A JP H02304902 A JPH02304902 A JP H02304902A
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- wires
- wire
- coated
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 14
- 229910001260 Pt alloy Inorganic materials 0.000 claims abstract description 11
- 239000010935 stainless steel Substances 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- 229910052573 porcelain Inorganic materials 0.000 abstract description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052863 mullite Inorganic materials 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000011162 core material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】 （発明の技術分野） 本発明は、白金温度センサに関する。[Detailed description of the invention] (Technical field of invention) The present invention relates to a platinum temperature sensor.
（従来技術）
精密温度センサとして、従来より白金温度センサが用い
られてきた。かかる白金を用いた温度センサは耐熱性や
耐食性を考慮しリード線として白金線または白金被覆線
あるいは白金合金線または白金合金被覆線あるいはステ
ンレス線またはステンレス被覆線あるいはニッケル線ま
たはニッケル被覆線を用いてきた。(Prior Art) Platinum temperature sensors have conventionally been used as precision temperature sensors. Temperature sensors using platinum use platinum wires, platinum coated wires, platinum alloy wires, platinum alloy coated wires, stainless steel wires, stainless steel coated wires, nickel wires, or nickel coated wires as lead wires in consideration of heat resistance and corrosion resistance. Ta.
（この発明が解決しようとしている問題点）一般に電子
部品の接続方法としては半田付けが用いられており、半
田付けに適さない該リード線を用いた白金温度センサは
溶接など特殊な処理を行なわなければならず、使泪上工
程の追加など制約を受けていた。(Problem to be solved by this invention) Soldering is generally used as a connection method for electronic components, and platinum temperature sensors using lead wires that are not suitable for soldering must undergo special treatment such as welding. However, there were constraints such as the addition of an envoy process.
（問題点を解決する手段）
本発明はリード線に白金線または白金被覆線あるいは白
金合金線または白金合金被覆線あるいはステンレス線ま
たはステンレス被覆線あるいはニッケル線またはニッケ
ル被覆線を用いながら容易に半田付けを可能にすること
を目的とし、該リード線に半田メッキや錫メッキを施し
てその目的を達成したものである。これにより、抵抗、
コンデンサ、 トランジスｉおよびＩＣなどの一般の電
子部品と同様１通常の半田付けが可能となる。(Means for Solving Problems) The present invention enables easy soldering while using a platinum wire, a platinum coated wire, a platinum alloy wire, a platinum alloy coated wire, a stainless steel wire, a stainless steel coated wire, a nickel wire, or a nickel coated wire as a lead wire. This purpose was achieved by applying solder plating or tin plating to the lead wire. This results in resistance,
It can be soldered in the same way as general electronic components such as capacitors, transistors, and ICs.
（実施例１）
本発明の実施例を図面に基づいて説明する。第１図およ
び第２図において直径１ｍｍ長さ３ｍｍのムライト系磁
器を電気的絶縁基体とし、その表面にスパッタリング法
にて白金４膜を形成し、 内径０．９８ ｍｍ高さ１ｍ
ｍ厚さ０．２ｍｍのステンレスのキャップを両端に押入
して電極とする。 レーザ光により切溝な所定の抵抗値
になる迄入れてから、直径０．４ｍｍのニッケル線をリ
ード線として前記ｔａに溶接する。リード線はニッケル
線の他、ニッケル被覆線あるいは白金線または白金被覆
線あるいは白金合金線または白金合金被覆線あるいはス
テンレス線またはステンレス被覆線でも可能である。基
体及び電極をポリイミド樹脂でコーティングして、該リ
ード線に半田をメッキして白金温度センサを得た。 リ
ード線の被覆材料としては半田以外に錫セも可能である
。また被覆方法としてメッキの他に蒸着やスパッタリン
グ法等薄膜技術でも可能である。(Example 1) An example of the present invention will be described based on the drawings. In Figures 1 and 2, mullite porcelain with a diameter of 1 mm and a length of 3 mm is used as an electrically insulating base, and four platinum films are formed on its surface by sputtering, with an inner diameter of 0.98 mm and a height of 1 m.
m Stainless steel caps with a thickness of 0.2 mm are pressed into both ends to form electrodes. A nickel wire with a diameter of 0.4 mm is welded to the ta as a lead wire after it is cut with a laser beam until a predetermined resistance value is reached. The lead wire may be a nickel wire, a nickel coated wire, a platinum wire, a platinum coated wire, a platinum alloy wire, a platinum alloy coated wire, a stainless steel wire, or a stainless steel coated wire. The base and electrodes were coated with polyimide resin, and the lead wires were plated with solder to obtain a platinum temperature sensor. In addition to solder, tin can also be used as a coating material for the lead wire. In addition to plating, thin film techniques such as vapor deposition and sputtering can also be used as a coating method.
（実施例２）
第３図、第４図において（縦）３．２ｘ（横）１．６×
（厚さ）０．４ｍｍのアルミナ磁器を電気的絶縁基体と
し、その表面に白金膜を電子ビーム蒸着法で被着する。(Example 2) In Figures 3 and 4 (vertical) 3.2x (horizontal) 1.6x
Alumina porcelain (thickness) of 0.4 mm is used as an electrically insulating substrate, and a platinum film is deposited on the surface thereof by electron beam evaporation.
この基体な熱処理後エツチング、レーザ光等により所定
の抵抗値になるようにパターンを形成する。長辺方向両
端に！極を設は直径Ｑ、１８ｍｍのニッケル線を芯材と
し、その上に厚さ１０μｍの白金膜を被覆して作られた
線径が０．２ｍｍであるリード線を溶接する。 リード
線はこの他に白金線あるいは白金合金線または白金金金
被覆線あるいはステンレス線またはステンレス被覆線あ
るいはニッケル線またはニッケル被Ｔ！１ｍでも可能で
ある。基体および電極をエポキシ樹脂で覆い、該リード
線に半田をメッキして白金温度センサを得た。 リード
線の接続は、溶接の他導電ペーストな泪いても可能であ
る。After this substrate is heat-treated, a pattern is formed by etching, laser light, etc. so that it has a predetermined resistance value. At both ends of the long side! The poles were constructed by using a nickel wire with a diameter Q of 18 mm as a core material, and welding a lead wire with a wire diameter of 0.2 mm made by coating a platinum film with a thickness of 10 μm onto the core material. In addition to the above, the lead wire may be platinum wire, platinum alloy wire, platinum gold coated wire, stainless steel wire, stainless steel coated wire, nickel wire, or nickel coated T! Even 1m is possible. The base body and electrodes were covered with epoxy resin, and the lead wires were plated with solder to obtain a platinum temperature sensor. The lead wires can be connected by welding or by using conductive paste.
以上本発明によれば、次の如き利点を存する。According to the present invention, there are the following advantages.
■白金温度センサの接続に一般的な半田付けが可能とな
るため作業性が著しく向上する。■Workability is significantly improved as common soldering can be used to connect the platinum temperature sensor.
■リード線に用いる材料の選択範囲が広がり、製造手法
や性能価格等に応じてリード線を選択できるようになる
。■The selection range of materials used for lead wires has expanded, allowing lead wires to be selected according to manufacturing methods, performance, price, etc.
ｆｆ１図は実施例１による白金温度センサの断面図、Ｉ
！２図は実施例１のリード線の新面図である。第３図は
実施例２による一部切欠図、第４図は実施例２のリード
線の新面図である。
１： 電気的絶縁基体、２： 白金膜、３： 螺旋
状溝。
４： キャップ端子、 ５： リード線、 ６： コー
ティング膜、７： 半田被覆膜、 ８： リード線芯
材。
９： 白金被覆膜
第１図
第４日Figure ff1 is a cross-sectional view of the platinum temperature sensor according to Example 1, I
! FIG. 2 is a new view of the lead wire of Example 1. FIG. 3 is a partially cutaway view of the second embodiment, and FIG. 4 is a new view of the lead wire of the second embodiment. 1: electrically insulating substrate, 2: platinum film, 3: spiral groove. 4: Cap terminal, 5: Lead wire, 6: Coating film, 7: Solder coating film, 8: Lead wire core material. 9: Platinum coating film Figure 1, Day 4
Claims (1)
合金線または白金合金被覆線、あるいはステンレス線ま
たはステンレス被覆線、あるいはニッケル線またはニッ
ケル被覆線を用いた白金温度センサのリード線の一部ま
たは全体に半田メッキまたは錫メッキを施したことを特
徴とする白金温度センサPart or all of the lead wire of a platinum temperature sensor that uses platinum wire or platinum coated wire, platinum alloy wire or platinum alloy coated wire, stainless steel wire or stainless steel coated wire, or nickel wire or nickel coated wire as the lead wire. Platinum temperature sensor characterized by solder plating or tin plating
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12415989A JPH02304902A (en) | 1989-05-19 | 1989-05-19 | Platinum temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12415989A JPH02304902A (en) | 1989-05-19 | 1989-05-19 | Platinum temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02304902A true JPH02304902A (en) | 1990-12-18 |
Family
ID=14878403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12415989A Pending JPH02304902A (en) | 1989-05-19 | 1989-05-19 | Platinum temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02304902A (en) |
-
1989
- 1989-05-19 JP JP12415989A patent/JPH02304902A/en active Pending
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