JPH0230831Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a chip type electrolytic capacitor.

The applicant of the present application has disclosed, in another application, chip type electrolytic capacitors 1 and 2 as shown in FIGS. 1 and 2.
0 is proposed. The chip type electrolytic capacitor 1 shown in FIG.
It is coated with In addition, the chip type electrolytic capacitor 20 shown in FIG. 2 has a capacitor element 22 built into an aluminum case 21, and a resin layer 25 is formed on the rubber sealing body 23 of an aluminum electrolytic capacitor 24 sealed with a rubber sealing body 23. However, the entire body is covered with a heat-resistant insulating sleeve 26. 27 is aluminum case 21
This is a plate provided between the bottom surface and the other end of the insulating sleeve 26 to prevent solder adhesion or short circuit.

In manufacturing such chip-type electrolytic capacitors 1, 20, after the resin layers 6, 25 are cured by heat or ultraviolet rays, the capacitor elements 3, 22 are removed through the rubber sealants 4, 23. Straight lead wires 7, 8, 2 as shown by the dashed line in the middle
8 and 29 are bent and used as external terminals,
During this bending process, stress is applied to the lead wires 7 and 8.
Cracks 9 and 30 are generated at the interface between the lead wires 28 and 29 and the resin layer 25, and at the interface between the lead wires 28 and 29 and the resin layer 25.
When cracks 9 and 30 occur, Cl ^- in the organic halogen substrate cleaning agent or Cl ^- in the solder flux flows through the lead wires 7 , 8 , 28 , 29 at the cracks 9 and 30 to the capacitor elements 3 and 30 . 22, and the capacitor elements 3 and 22 are corroded.

However, the present invention provides a chip-type electrolytic capacitor having a structure in which cracks do not occur at the interface between the lead wire and the resin layer even when the lead wires of the chip-type electrolytic capacitor are bent as described above.

FIG. 3 shows a chip type electrolytic capacitor 1A that is an improved version of the chip type electrolytic capacitor 1 shown in FIG. 1, and FIG. 4 shows a chip type electrolytic capacitor 20A that is an improved version of the chip type electrolytic capacitor 20 shown in FIG. shows. Chip type electrolytic capacitor 1A, 2
In 0A, particularly improved parts will be explained, but since the remaining parts are the same as those of the conventional chip electrolytic capacitors 1 and 20, this explanation will be omitted and the same reference numerals will be given to indicate the same parts.

As shown in FIGS. 3 and 4, rounded recesses 10, 31 are formed in the outer surface portions of the resin layers 6, 25 around the lead wires 7, 8, 28, 29. Although the recesses 10 and 31 may be scraped off after the resin layers 6 and 25 are cured, it is preferable in terms of the manufacturing process that they be formed in advance and then cured before the resin layers 6 and 25 are cured. In addition, the resin lead wires 7, 8, 2 before curing
If a creeping-up phenomenon is observed in the lead wires 7, 8, 28, 29, it is recommended to apply a soft resin to the required locations of the lead wires 7, 8, 28, 29 to prevent this. When the linearly extending lead wires 7, 8, 28, 29 are bent with the recesses 10, 31 formed, the stress on the resin layers 6, 25 is reduced by the recesses 10, 3.
1, the interface between the lead wires 7, 8 and the resin layer 6, the lead wires 28, 29
There is no possibility that cracks will occur at the interface between the resin layer 25 and the resin layer 25, as has conventionally occurred.

As described above, the present invention incorporates at least a capacitor element in an aluminum case, and forms a resin layer on at least the rubber sealing body of an aluminum electrolytic capacitor sealed with a rubber sealing body.
In addition, since a recess is formed on the outer surface of the resin layer around the lead wire from the capacitor element via the rubber sealing body, it is possible to prevent the occurrence of cracks at the interface between the lead wire and the resin. This can be expected to improve the reliability and extend the life of capacitors.

[Brief explanation of the drawing]

1 and 2 are a sectional view and a side view, respectively, of a conventional chip type electrolytic capacitor, and FIGS. 3 and 4 are a sectional view and a side view, respectively, of a chip type electrolytic capacitor according to the present invention. In the figure, 1, 1A, 20, 20A... Chip type electrolytic capacitor, 2, 21... Case, 3, 22... Capacitor element, 4, 23... Sealing body, 5, 24... Aluminum electrolytic capacitor, 6, 25... Resin layer. ,
7, 8, 28, 29... Lead wire, 26... Sleeve, 27... Soldering prevention or short circuit prevention plate,
9, 30... crack, 10, 31... recess.

Claims (1)

[Scope of utility model registration request] In a chip-type electrolytic capacitor formed by forming at least a resin layer on at least the rubber sealing body of an aluminum electrolytic capacitor in which at least a capacitor element is assembled in an aluminum case and sealed with a rubber sealing body, there is no charge from the capacitor element through the rubber sealing body. A chip-type electrolytic capacitor characterized by forming a recess on the outer surface of a resin layer around a lead wire.