JPH0230839Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention is designed to rationally and efficiently perform bonding work when carrying a package of semiconductor elements such as an IC using a carrier unit. The present invention relates to a bonding device that can perform bonding.

[Conventional technology]

In bonding work for packages of semiconductor devices such as ICs, a carrier unit for package transportation, which is adapted to the dimensions of many types of packages, is used to transport the packages, which are the objects to be bonded, to the bonding station. has been done.

For example, as shown in FIG.
Packages 3 to be bonded arranged on a package tray 2 supported on an XY table 1 moving in the Y direction are sucked and transferred by a loader 4 using a vacuum or a magnet.
After the position is corrected if necessary on the way, it is loaded onto the carrier unit 6 at the loading position on the running path 5, and the carrier unit 6 travels along the running path 5 by means of a feed pawl (not shown), and is detected by the pattern recognition camera 7. After pattern recognition of the package 3 is performed to detect positional deviation, the package 3 is transported to a bonding station 8. At the bonding station 8, the carrier unit 6 is lifted and supported by the raising of the pedestal 9, and after the positional deviation is corrected, the bonding tool 10a attached to the bonding head 10 is used to assemble the package 3 as needed. Bonding work is carried out. Thereafter, the pedestal 9 is lowered, the carrier unit 6 travels to the unloading position, and the unloader 11, which is similar to the loader 4, carries the bonded package 3 to the collection section.
The packages are collected in a package tray 13 supported by an XY table 12.

[Problem that the invention attempts to solve]

However, in this way, the carrier unit 6
When bonding the package 3 using The modification is carried out by carrier unit 6.
Compared to the case where only the package 3 is targeted, the volume and weight of the carrier unit 6 are larger, and it takes time to lift and correct the position in the XYθ directions, etc. The energy required to accelerate a large mass had to be large. In addition, in the case of thermocompression bonder,
Heat is also transmitted to the carrier unit 6, resulting in a large amount of heat loss.In the case of an ultrasonic bonder, the ultrasonic waves are also transmitted to the carrier unit 6, causing a loss of ultrasonic energy. Furthermore, if the edge of the carrier unit 6 is high, the vertical stroke of the bonding tool on the Z axis becomes large in order to avoid this.

When a package is placed on a carrier unit and transported in this way, the present invention automatically separates the package from the carrier unit at the bonding station and lifts the package.
The purpose of the present invention is to provide a bonding device that can efficiently perform position correction, etc., with little energy, regardless of the carrier unit, suppresses loss of heating energy, and minimizes the vertical stroke of bonding. be.

[Means and actions for solving problems]

In the present invention, a package 3 is placed on the upper surface of a carrier unit 6 that is sequentially transferred on a traveling path 5, a through hole 16 is provided in the center of the package 3, and a bonding head 10 and a position correction claw 17 are provided. The present invention provides a bonding apparatus which is capable of transporting the package to a station 8 and is characterized in that a pedestal 9 having a package suction surface is disposed in the bonding station 8 so as to be able to rise and fall freely through a through hole 16 of a carrier unit 6. 6 to bonding station 8
The package 3 that has been transported is lifted by the pedestal 9 that rises through the through hole 16, separated from the carrier unit 6, and supported by vacuum suction, etc., and the position correction claw 17 is moved horizontally to correct the position of the package 3. , the package cage 3 can be easily lifted and positioned, etc. with little energy.
The heating energy is also small, and vertical movement of the bonding tool can be minimized.

〔Example〕

An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram of only the vicinity of the bonding station 8 of the ultrasonic bonding apparatus, and shows a structure that matches the dimensions of the package 3 and on which the package 3 is placed. A carrier unit 6 travels on a running path 5 and transfers a package 3 to a bonding station 8.
A through hole 16 is provided in the center of the carrier unit 6, and when the carrier unit 6 reaches the bonding station 8, the pedestal 9 that moves up and down passes through the through hole 16.
Only the package 3 is lifted and supported.

A suction surface for holding the package 3 by vacuum or magnet is formed on the upper surface of the pedestal 9, and a position correction claw 17 that moves in the horizontal direction is provided at the raised position of the package 3 on the bonding station 8. It is deployed.

Therefore, as shown in FIG.
When the package 3 is pushed to the bonding station 8, the pedestal 9 rises, passes through the through hole 16 in the center of the carrier unit 6, lifts only the package 3, supports it by vacuum suction, and uses the position correction claw 17 to horizontally move the package 3. After the position is corrected, bonding work is performed using the bonding tool 10a. At this time, since the pedestal 9 supports only the package 3 without supporting the carrier unit 6, the energy and time required for lifting and correcting the position in the X, Y, and θ directions can be minimized. become. When the bonding work is completed in this way, the pedestal 9 is lowered to break the vacuum, and the package 3 is again placed on the carrier unit 6.
is transported to the collection position.

Further, the third illustrated example shows another embodiment of the present invention, and the illustrated example shows a part of a thermocompression bonding apparatus. That is, a preheater 18 is provided on the running path 5 so that it can be raised and lowered, and this preheater 18
A cradle 9 for bonding is formed integrally with the other part of the preheater 18, and a cradle 9 for lifting the package 3 that passes through the through hole 16 of the carrier unit 6 is provided in the other part of the preheater 18 with a gap corresponding to the traveling distance of the carrier unit 6 at one time. A cradle 19 is provided.

In this third illustrated example, the package 3 transported by the carrier unit 6 is heated by the preheater 18, but as the preheater 18 rises, the pedestal 9 also rises, and the package 3 is heated for bonding. the package 3 before the pedestal 19 reaches the bonding position.
You will need to lift it up and preheat it. In this way, the packages 3 are successively preheated and then bonded, but in this case the packages 3 are heated directly without going through the carrier unit 6, so that thermal energy is saved. Furthermore, in the bonding station 8, the heat received from the pedestal 9 is effectively used without escaping to the carrier unit 6, so that there is little loss of thermal energy.

[Effect of idea]

As described above, the present invention separates only the package from the carrier unit, lifts it up and supports it by suction, without raising and lowering the package together with the carrier unit as in the conventional case, and furthermore, a horizontal position correction claw is installed in the raised position of the package. Because it is equipped with a 300-degree heat exchanger, less energy is required to lift and adjust the position of the package cage, and less heat calories are required for heating in thermocompression bonding, and the work can be done extremely efficiently. It is something.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the main part showing one embodiment of the present invention, Fig. 2 is a detailed explanatory diagram of the vicinity of the bonding station shown in Fig. 1, and Fig. 3 is a sectional view of the main part showing another embodiment of the invention. 4 is a sectional view showing a conventional example of a bonding device. 1... XY table, 2... Package tray, 3... Package, 4... Loader, 5... Running path, 6... Carrier unit, 7... Pattern recognition camera, 8... Bonding station,
9... pedestal, 10... bonding head, 10
a... Bonding tool, 11... Unloader, 12... XY table, 13... Package tray, 16... Through hole, 17... Position correction claw,
18... Preheater, 19... pedestal, 20... transfer claw.

Claims (1)

[Scope of utility model registration request] The package 3 is placed on the upper surface of the carrier unit 6 that is sequentially transferred on the traveling path 5, a through hole 16 is provided in the center thereof, and the package 3 is transferred to the bonding station 8 equipped with a bonding head 10 and a position correction claw 17. A bonding apparatus characterized in that a pedestal 9 having a package suction surface is disposed in a bonding station 8 through a through hole 16 of a carrier unit 6 so as to be able to be raised and lowered.