JPH02308501A - Resistive coating - Google Patents

Resistive coating

Info

Publication number
JPH02308501A
JPH02308501A JP1128963A JP12896389A JPH02308501A JP H02308501 A JPH02308501 A JP H02308501A JP 1128963 A JP1128963 A JP 1128963A JP 12896389 A JP12896389 A JP 12896389A JP H02308501 A JPH02308501 A JP H02308501A
Authority
JP
Japan
Prior art keywords
powder
vehicle
resistor
solid
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1128963A
Other languages
Japanese (ja)
Inventor
Yasuto Kudo
康人 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP1128963A priority Critical patent/JPH02308501A/en
Publication of JPH02308501A publication Critical patent/JPH02308501A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To form a resistor on a Cu electrode in an inert atmosphere by mixing mixed powder of Cu and Ni, alloy powder and/or their mixture, and glass powder respectively in specified amount, and dispersing a solid in a vehicle, wherein weight ratio of Cu to Ni is selected. CONSTITUTION:The power of Cu and Ni is obtained by reducing respective sulfate aqueous solutions with hydrazine, and alloy powder can be made by atomizing a mixed dissolved solution of Cu and Ni. If the weight ratio of Cu/Ni is selected as 84/16-36/64, the temperature coefficient of a resistor becomes + or -200ppm/ deg.C in the range of -55 to +125 deg.C, and a suitable resistor can be obtained. The glass powder is borosilicate lead glass, or the like, and the softening point is 550-700 deg.C, and the thermal expansion coefficient is selected as 55-75X10<-7>/ deg.C in the case where the base material is alumina, and this is used about 3-67wt.% in solid matter. For the powder, one less than 2mum in average diameter is desirable. A vehicle where ethyl cellulose, or the like is dissolved in toluene, or the like, is used by 12 to 40 weight part to solid powder 100 weight part. This coating can be baked in inert atmosphere, and there is no problem in adhesive strength with a board, and connection with Cu electrode.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、不活性雰囲気で焼成して、低温度係数の抵抗
体を形成するための抵抗塗料に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resistive paint for forming a resistor with a low temperature coefficient by firing in an inert atmosphere.

〔従来の技術〕[Conventional technology]

アルミナ、ムライトなどのセラミック基体に、電極、抵
抗体などを含む回路が形成され、これに、IC、コンデ
ンサーなどの電子部品が搭載されたハイブリッドICが
多く使われている。このようなハイブリッドICにおい
て通常、電極はAg 、Ag/Pd 、 Auなどの貴
金属粉末をビヒクルに分散せしめてなる導電性塗料をセ
ラミック基体にスクリーン印刷し、これを空気中で焼成
して形成した貴金属電極であり、抵抗体は、酸化ルテニ
ウム粉末とガラス粉末をビヒクルに分散せしめてなる抵
抗塗料あるいはAg粉末、Pd粉末とガラス粉末をビヒ
クルに分散せしめてなる抵抗塗料を貴金属電極を連結す
るようにスクリーン印刷し、これを空気中で焼成して形
成される。
Hybrid ICs are often used, in which a circuit including electrodes, resistors, etc. is formed on a ceramic substrate such as alumina or mullite, and electronic components such as ICs and capacitors are mounted on this circuit. In such hybrid ICs, the electrodes are usually made of noble metal, which is formed by screen printing a conductive paint made by dispersing noble metal powder such as Ag, Ag/Pd, or Au in a vehicle on a ceramic substrate, and then firing it in air. The electrode and the resistor are made of a resistive paint made by dispersing ruthenium oxide powder and glass powder in a vehicle, or a resistive paint made by dispersing Ag powder, Pd powder, and glass powder in a vehicle, with a screen connected to the noble metal electrode. It is formed by printing and firing it in air.

ところで貴金属電極は高価であるというコスト上の問題
があり、また半田に浸食されやすい、Agの移行現象が
あるなどの特性上の問題がある。そこで、安価で、半田
浸食に強く、移行現象が起きにくい銅が用いられるよう
になってきた。
By the way, noble metal electrodes have a cost problem in that they are expensive, and they also have characteristic problems such as being easily corroded by solder and having a Ag migration phenomenon. Therefore, copper, which is inexpensive, resistant to solder erosion, and less susceptible to migration phenomena, has come to be used.

銅電極は、銅粉末を液体ビヒクルに分散せしめた塗料を
印刷し、窒素などの不活性雰囲気中で、600〜900
℃で焼成して形成されるが、銅電極は酸化されやすいた
めに、抵抗体についても同様の不活性雰囲気中で焼成で
きるものが要求される。ところが酸化ルテニウムを用い
た従来の抵抗塗料は、不活性雰囲気で焼成すると、ルテ
ニウム金属に還元されるため、所望の抵抗値、温度係数
が得られず、一方Ag粉末とPd粉末を用いた抵抗塗料
は、銅電極と反応して金属が縮れてしまったりするので
、銅電極との接続がうまく行かないという欠点がある。
Copper electrodes are printed with a paint containing copper powder dispersed in a liquid vehicle, and heated to 600 to 900 mL in an inert atmosphere such as nitrogen.
Although copper electrodes are formed by firing at °C, they are easily oxidized, so resistors are also required to be fired in a similar inert atmosphere. However, conventional resistance paints using ruthenium oxide are reduced to ruthenium metal when fired in an inert atmosphere, making it impossible to obtain the desired resistance value and temperature coefficient.On the other hand, resistance paints using Ag powder and Pd powder has the disadvantage that it does not connect well with copper electrodes because it reacts with the copper electrodes and causes the metal to curl.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

本発明の目的は不活性雰囲気で銅電極に抵抗体を形成で
きる新規な抵抗塗料を提供することにある。
An object of the present invention is to provide a novel resistance paint that can form a resistor on a copper electrode in an inert atmosphere.

〔課題を解決するための手段) 本発明にかかる抵抗塗料は、銅およびニッケルの混合粉
末、合金粉末および/またはこれらの混合物からなる導
電性粉末33〜97重量%とガラス粉末67〜3重量%
とからなり且つ銅とニッケルの重量比率がCu/Ni=
84/ 16〜36/64である固体粉末をビヒクルに
分散せしめた点に特徴がある。
[Means for Solving the Problems] The resistance paint according to the present invention contains 33 to 97% by weight of a conductive powder consisting of a mixed powder of copper and nickel, an alloy powder, and/or a mixture thereof, and 67 to 3% by weight of a glass powder.
and the weight ratio of copper and nickel is Cu/Ni=
It is characterized in that a solid powder having a particle size of 84/16 to 36/64 is dispersed in a vehicle.

〔作 用〕[For production]

ここで、銅粉末、ニッケル粉末はそれぞれの硫酸塩水溶
液をヒドラジンで還元することによって得られるし、ま
た金属の融液をアトマイズすることによっても得られる
。また、銅とニッケルの硫酸塩水溶液の混合液にビドラ
ジンを添加すれば、銅とニッケルの共沈混合物ができる
。−労合金粉末は銅とニッケルの混合融液をアトマイズ
することによって製造できる。
Here, copper powder and nickel powder can be obtained by reducing their respective sulfate aqueous solutions with hydrazine, or by atomizing a metal melt. Furthermore, if hydrazine is added to a mixed solution of copper and nickel sulfate, a coprecipitated mixture of copper and nickel can be produced. - Labor alloy powder can be produced by atomizing a mixed melt of copper and nickel.

銅とニッケルの比率を変えると抵抗値および温度係数が
変化するので、目標とする抵抗値および温度係数になる
ようにこの比率を適宜選定すればよいが、Cu/Ni重
量比率が84/16〜36/64のときに、−55〜+
125°Cの温度範囲で抵抗の温度係数が±200pp
m /”Cという好ましい抵抗体が得られる。
If the ratio of copper to nickel is changed, the resistance value and temperature coefficient will change, so this ratio should be selected appropriately to achieve the target resistance value and temperature coefficient, but if the Cu/Ni weight ratio is 84/16~ -55 to + when 36/64
Temperature coefficient of resistance is ±200pp over a temperature range of 125°C
A preferred resistor of m/"C is obtained.

ガラス粉末は、抵抗膜をセラミック基体に接着するため
と抵抗値の調整のために必要であるが、硼珪酸鉛ガラス
、硼珪酸バリウムガラス、硼珪酸アルミニウムガラスな
ど抵抗塗料に用いられる公知のガラスを用いれば良く、
ガラスの軟化点は550〜700℃、熱膨張率は基体が
アルミナの場合、55〜75 X 10−’/’Cとす
るのが好ましい。抵抗膜がセラミック基体に接着するた
めにはガラスは固形物中に3重量%以上含有されること
が必要で、抵抗値を高くするためにガラスを適宜増量す
ればよい。しかし、67重量%を越えると絶縁体になっ
てしまうので、これ以下にする必要がある。
Glass powder is necessary for adhering the resistive film to the ceramic substrate and for adjusting the resistance value. Just use it,
The softening point of the glass is preferably 550 to 700°C, and the coefficient of thermal expansion is preferably 55 to 75 x 10-'/'C when the base is alumina. In order for the resistive film to adhere to the ceramic substrate, glass must be contained in the solid substance in an amount of 3% by weight or more, and the amount of glass may be increased as appropriate to increase the resistance value. However, if it exceeds 67% by weight, it becomes an insulator, so it is necessary to keep it below this value.

導電性粉末、ガラス粉末などの固体粉末はビヒクルと混
練してペースト状組成物とされる。この組成物は通常1
50〜400メツシユの印刷スクリーンによって基体に
塗布されるので、用いる粉末はこの印刷スクリーンによ
って円滑に通過し得る粒径のものとすればよく、10ミ
クロン以上の粒子がほとんど無い、平均粒径2ミクロン
以下のものが適している。
Solid powders such as conductive powders and glass powders are kneaded with a vehicle to form a paste composition. This composition is usually 1
Since it is applied to the substrate by a printing screen with 50 to 400 meshes, the powder used should have a particle size that can pass smoothly through this printing screen, with an average particle size of 2 microns, with almost no particles larger than 10 microns. The following are suitable:

ビヒクルとしてターピネオール、ブチルカルピトール、
トルエンなどの溶剤にエチルセルロース、メタクリレー
ト樹脂などを溶解したものを使用できる。スクリーン印
刷に好適なペーストとするためには、ビヒクルは固体粉
末100重量部にたいして12〜40重量部とするのが
良い。
terpineol, butylcarpitol as vehicle;
A solution of ethyl cellulose, methacrylate resin, etc. in a solvent such as toluene can be used. To obtain a paste suitable for screen printing, the amount of vehicle should be 12 to 40 parts by weight per 100 parts by weight of solid powder.

〔実施例〕〔Example〕

アルミナ基体の上に銅塗料をスクリーン印刷して窒素雰
囲気900℃で10分間焼成することにより、電極を形
成したテスト基板を用い、下記により調製した種々の抵
抗塗料を評価した。
Various resistance paints prepared as described below were evaluated using a test substrate on which electrodes were formed by screen printing a copper paint on an alumina substrate and baking it at 900° C. for 10 minutes in a nitrogen atmosphere.

抵抗塗料は、平均粒径が1.88mの銅粉末、同0.6
μmのニッケル粉末および硼珪酸バリウムガラス粉末(
軟化点617 ”C1熱膨張係数66×10−’/”C
)を第1表に示す比率で配合し、ビヒクルとともに3本
ロールで混練した。ビヒクルはブチルメタクリレート2
6重量%濃度のターピネオール溶液とし、固体粉末10
0重量部にたいし、32重量部を用いた。各抵抗塗料を
上記テスト基板の銅電極間に1.0ミリ長さ×2.0ミ
リ幅のサイズにスクリーン印刷し、125℃で10分間
乾燥した後窒素雰囲気中900℃で10分間焼成した。
The resistance paint is copper powder with an average particle size of 1.88m and 0.6m in average particle size.
μm nickel powder and barium borosilicate glass powder (
Softening point 617 ``C1 thermal expansion coefficient 66 x 10-'/''C
) were blended in the proportions shown in Table 1 and kneaded together with the vehicle using a three-roll mill. Vehicle is butyl methacrylate 2
A solution of terpineol with a concentration of 6% by weight and a solid powder of 10%
32 parts by weight was used compared to 0 parts by weight. Each resistance paint was screen printed between the copper electrodes of the above test board in a size of 1.0 mm long x 2.0 mm wide, dried at 125° C. for 10 minutes, and then baked at 900° C. for 10 minutes in a nitrogen atmosphere.

得られた抵抗膜について、面積抵抗値、温度係数、抵抗
膜とアルミナ基板の接着強度を測定した。
Regarding the obtained resistive film, the sheet resistance value, temperature coefficient, and adhesive strength between the resistive film and the alumina substrate were measured.

結果を第1表に示す。The results are shown in Table 1.

温度係数は、+25℃を基準にして一55℃まで、また
は+125°Cまでの間の抵抗値の変化率を示したもの
である。
The temperature coefficient indicates the rate of change in resistance value from +25°C to -55°C or +125°C.

接着強度は、抵抗膜をピンセットで強くこすり、抵抗膜
がアルミナ基体から剥がれないものを合格と判断した。
For adhesion strength, the resistance film was strongly rubbed with tweezers, and the resistance film was determined to pass if it did not peel off from the alumina substrate.

第1表の結果から温度係数が±200ppm /’Cと
なる条件は、導電性粉末が固形分中に33〜97重量%
で且つCu/Ni重量比が84/16〜36/64であ
ることが分る。
From the results in Table 1, the conditions for the temperature coefficient to be ±200 ppm/'C are that the conductive powder is 33 to 97% by weight in the solid content.
And it can be seen that the Cu/Ni weight ratio is 84/16 to 36/64.

C発明の効果〕 本発明にかかる抵抗塗料は、・不活性雰囲気中で焼成可
能な新規の抵抗塗料である。この塗料によれば基板との
接着強度および銅電極との接続も問題無く、実用性の高
い抵抗体を形成できる。
C Effects of the Invention The resistance paint according to the present invention is: - A new resistance paint that can be fired in an inert atmosphere. With this paint, there is no problem in the adhesive strength with the substrate and the connection with the copper electrode, and it is possible to form a highly practical resistor.

Claims (1)

【特許請求の範囲】[Claims] (1)銅およびニッケルの混合粉末、合金粉末および/
またはこれらの混合物からなる導電性粉末33〜97重
量%とガラス粉末67〜3重量%とからなり且つ銅とニ
ッケルの重量比率がCu/Ni=84/16〜36/6
4である固体粉末をビヒクルに分散せしめてなる抵抗塗
料。
(1) Copper and nickel mixed powder, alloy powder and/or
or a conductive powder consisting of a mixture of these in an amount of 33 to 97% by weight and a glass powder of 67 to 3% by weight, and the weight ratio of copper and nickel is Cu/Ni=84/16 to 36/6.
A resistance paint made by dispersing solid powder No. 4 in a vehicle.
JP1128963A 1989-05-24 1989-05-24 Resistive coating Pending JPH02308501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1128963A JPH02308501A (en) 1989-05-24 1989-05-24 Resistive coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1128963A JPH02308501A (en) 1989-05-24 1989-05-24 Resistive coating

Publications (1)

Publication Number Publication Date
JPH02308501A true JPH02308501A (en) 1990-12-21

Family

ID=14997747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1128963A Pending JPH02308501A (en) 1989-05-24 1989-05-24 Resistive coating

Country Status (1)

Country Link
JP (1) JPH02308501A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111205A (en) * 1993-10-13 1995-04-25 Miyoshi Denshi Kk Composition for thick film resistor and thick film resistor
JP2015173258A (en) * 2014-02-24 2015-10-01 三ツ星ベルト株式会社 Resistor paste and method of manufacturing the same, and resistor and use application for the same
JP2021011417A (en) * 2019-07-09 2021-02-04 住友金属鉱山株式会社 Compositions for thick film resistors, pastes for thick film resistors, and thick film resistors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942631A (en) * 1972-08-28 1974-04-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942631A (en) * 1972-08-28 1974-04-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111205A (en) * 1993-10-13 1995-04-25 Miyoshi Denshi Kk Composition for thick film resistor and thick film resistor
JP2015173258A (en) * 2014-02-24 2015-10-01 三ツ星ベルト株式会社 Resistor paste and method of manufacturing the same, and resistor and use application for the same
JP2021011417A (en) * 2019-07-09 2021-02-04 住友金属鉱山株式会社 Compositions for thick film resistors, pastes for thick film resistors, and thick film resistors

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