JPH0231863B2 - - Google Patents

Info

Publication number
JPH0231863B2
JPH0231863B2 JP57131026A JP13102682A JPH0231863B2 JP H0231863 B2 JPH0231863 B2 JP H0231863B2 JP 57131026 A JP57131026 A JP 57131026A JP 13102682 A JP13102682 A JP 13102682A JP H0231863 B2 JPH0231863 B2 JP H0231863B2
Authority
JP
Japan
Prior art keywords
substrate
thermal expansion
sintered body
alloy
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57131026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5921032A (ja
Inventor
Mitsuo Osada
Yoshinari Amano
Nobuo Ogasa
Akira Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15048269&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0231863(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to JP57131026A priority Critical patent/JPS5921032A/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to DE8383304301T priority patent/DE3379297D1/de
Priority to EP83304301A priority patent/EP0100232B2/en
Publication of JPS5921032A publication Critical patent/JPS5921032A/ja
Priority to US07/297,935 priority patent/US5099310A/en
Priority to US07/382,056 priority patent/US5086333A/en
Publication of JPH0231863B2 publication Critical patent/JPH0231863B2/ja
Priority to US08/284,277 priority patent/US5409864A/en
Priority to US08/368,636 priority patent/US5563101A/en
Priority to US08368657 priority patent/US5525428B1/en
Priority to US08/635,651 priority patent/US5708959A/en
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y10T428/12056—Entirely inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Powder Metallurgy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP57131026A 1982-07-26 1982-07-26 半導体装置用基板 Granted JPS5921032A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP57131026A JPS5921032A (ja) 1982-07-26 1982-07-26 半導体装置用基板
DE8383304301T DE3379297D1 (en) 1982-07-26 1983-07-25 Substrate for semiconductor apparatus
EP83304301A EP0100232B2 (en) 1982-07-26 1983-07-25 Substrate for semiconductor apparatus
US07/297,935 US5099310A (en) 1982-07-26 1989-01-17 Substrate for semiconductor apparatus
US07/382,056 US5086333A (en) 1982-07-26 1989-07-13 Substrate for semiconductor apparatus having a composite material
US08/284,277 US5409864A (en) 1982-07-26 1994-08-02 Substrate for semiconductor apparatus
US08368657 US5525428B1 (en) 1982-07-26 1995-01-04 Substrate for semiconductor apparatus
US08/368,636 US5563101A (en) 1982-07-26 1995-01-04 Substrate for semiconductor apparatus
US08/635,651 US5708959A (en) 1982-07-26 1996-04-22 Substrate for semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57131026A JPS5921032A (ja) 1982-07-26 1982-07-26 半導体装置用基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4325582A Division JPH07105464B2 (ja) 1992-12-04 1992-12-04 半導体素子搭載用半導体装置

Publications (2)

Publication Number Publication Date
JPS5921032A JPS5921032A (ja) 1984-02-02
JPH0231863B2 true JPH0231863B2 (2) 1990-07-17

Family

ID=15048269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57131026A Granted JPS5921032A (ja) 1982-07-26 1982-07-26 半導体装置用基板

Country Status (4)

Country Link
US (6) US5099310A (2)
EP (1) EP0100232B2 (2)
JP (1) JPS5921032A (2)
DE (1) DE3379297D1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014502059A (ja) * 2011-01-05 2014-01-23 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング サーマルマネージメントを向上させた電子アセンブリ

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JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ
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JPS59114845A (ja) * 1982-12-21 1984-07-03 Nec Corp 諸特性の改善された容器を用いた半導体装置
EP0113088B1 (en) * 1982-12-22 1989-05-24 Sumitomo Electric Industries Limited Substrate for mounting semiconductor element
JPS60239033A (ja) * 1984-05-11 1985-11-27 Tokyo Tungsten Co Ltd 複合電極材料
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JPH065683B2 (ja) * 1985-02-25 1994-01-19 住友電気工業株式会社 半導体素子搭載用基板
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JPH0671941B2 (ja) * 1987-11-18 1994-09-14 日本電気株式会社 紙葉類の給紙装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014502059A (ja) * 2011-01-05 2014-01-23 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング サーマルマネージメントを向上させた電子アセンブリ

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US5563101A (en) 1996-10-08
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