JPS5991742U - 半導体用パツケ−ジ - Google Patents

半導体用パツケ−ジ

Info

Publication number
JPS5991742U
JPS5991742U JP1982188119U JP18811982U JPS5991742U JP S5991742 U JPS5991742 U JP S5991742U JP 1982188119 U JP1982188119 U JP 1982188119U JP 18811982 U JP18811982 U JP 18811982U JP S5991742 U JPS5991742 U JP S5991742U
Authority
JP
Japan
Prior art keywords
package
semiconductors
copper
heat sink
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982188119U
Other languages
English (en)
Other versions
JPS6311737Y2 (ja
Inventor
哲雄 野村
熊沢　光一
Original Assignee
鳴海製陶株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鳴海製陶株式会社 filed Critical 鳴海製陶株式会社
Priority to JP1982188119U priority Critical patent/JPS5991742U/ja
Publication of JPS5991742U publication Critical patent/JPS5991742U/ja
Application granted granted Critical
Publication of JPS6311737Y2 publication Critical patent/JPS6311737Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体パッケージを示す縦断面図、第２
図乃至第４図は本考案の第１実施例を示し、第２図は縦
断面図、第３図は平面図、第４図は一部破断斜視図、第
５図乃至第７図は夫々本考案の第２乃至第４実施例を示
す斜視図、第８及び第９図は本考案の第５実施例を示す
斜視図及び縦断面図である。 図中、１．９，１１．１２及び１４はパッケージ本体、
４はキャビティ、５は放熱板、５ａは溝、６は半導体チ
ップである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外表面に多数の溝を形成した銅−タングステン又は銅−
    モリブデン組成体製の放熱板をパッケージ本体に取着し
    て成ることを特徴とする半導体用パッケージ。
JP1982188119U 1982-12-13 1982-12-13 半導体用パツケ−ジ Granted JPS5991742U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982188119U JPS5991742U (ja) 1982-12-13 1982-12-13 半導体用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982188119U JPS5991742U (ja) 1982-12-13 1982-12-13 半導体用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5991742U true JPS5991742U (ja) 1984-06-21
JPS6311737Y2 JPS6311737Y2 (ja) 1988-04-05

Family

ID=30405905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982188119U Granted JPS5991742U (ja) 1982-12-13 1982-12-13 半導体用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5991742U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107063A (en) * 1980-12-25 1982-07-03 Nec Corp Semiconductor package
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107063A (en) * 1980-12-25 1982-07-03 Nec Corp Semiconductor package
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板

Also Published As

Publication number Publication date
JPS6311737Y2 (ja) 1988-04-05

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