JPH0234251U - - Google Patents
Info
- Publication number
- JPH0234251U JPH0234251U JP11172088U JP11172088U JPH0234251U JP H0234251 U JPH0234251 U JP H0234251U JP 11172088 U JP11172088 U JP 11172088U JP 11172088 U JP11172088 U JP 11172088U JP H0234251 U JPH0234251 U JP H0234251U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- heating
- thermal head
- connection pad
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツドの一実施例を
示す一部の平面図、第２図は本考案の他の実施例
を示す一部の平面図、第３図は従来のサーマルヘ
ツドを示す一部の平面図、第４図は従来の他のサ
ーマルヘツドを示す平面図である。
１…基板、２…発熱体、３…駆動素子、４…第
１配線用接続パツド、５…第２配線用接続パツド
、６…第１個別給電配線、７…第２個別給電配線
、８…共通給電体。
FIG. 1 is a partial plan view showing one embodiment of the thermal head of the present invention, FIG. 2 is a partial plan view showing another embodiment of the present invention, and FIG. 3 is a conventional thermal head. A partial plan view, FIG. 4 is a plan view showing another conventional thermal head. DESCRIPTION OF SYMBOLS 1... Board, 2... Heating element, 3... Drive element, 4... Connection pad for first wiring, 5... Connection pad for second wiring, 6... First individual power supply wiring, 7... Second individual power supply wiring, 8... Common power feeder.
Claims (1)
発熱体を連続して配列するとともに、前記基板の
前記発熱体の一側に、前記各発熱体に対応した駆
動素子をそれぞれ配設し、前記発熱体と前記駆動
素子の前記発熱体側端縁に形成された第１配線用
接続パツドとを接続して第１個別給電配線を形成
してなるサーマルヘツドにおいて、前記駆動素子
を、前記発熱体に対して前記発熱体の各発熱素子
の配列ピツチと、前記駆動素子の第１配線用接続
パツドの前記発熱素子方向への投影配列ピツチと
がほぼ等しくなるように傾斜して配置したことを
特徴とするサーマルヘツド。 A plurality of heating elements each having a plurality of heating elements arranged in parallel are arranged in succession on a substrate, and a drive element corresponding to each heating element is disposed on one side of the heating element of the substrate, In a thermal head in which a first individual power supply wiring is formed by connecting the heating element and a first wiring connection pad formed on an edge of the driving element on the side of the heating element, the driving element is connected to the heating element. The heating element is arranged at an angle so that the arrangement pitch of each heating element of the heating element and the projected arrangement pitch of the first wiring connection pad of the drive element in the direction of the heating element are approximately equal to each other. thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11172088U JPH0234251U (en) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11172088U JPH0234251U (en) | 1988-08-26 | 1988-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0234251U true JPH0234251U (en) | 1990-03-05 |
Family
ID=31350019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11172088U Pending JPH0234251U (en) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0234251U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009148897A (en) * | 2007-12-18 | 2009-07-09 | Toshiba Hokuto Electronics Corp | Thermal print head and method for production thereof |
-
1988
- 1988-08-26 JP JP11172088U patent/JPH0234251U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009148897A (en) * | 2007-12-18 | 2009-07-09 | Toshiba Hokuto Electronics Corp | Thermal print head and method for production thereof |
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