JPH02126845U - - Google Patents
Info
- Publication number
- JPH02126845U JPH02126845U JP3709689U JP3709689U JPH02126845U JP H02126845 U JPH02126845 U JP H02126845U JP 3709689 U JP3709689 U JP 3709689U JP 3709689 U JP3709689 U JP 3709689U JP H02126845 U JPH02126845 U JP H02126845U
- Authority
- JP
- Japan
- Prior art keywords
- scanning direction
- main scanning
- drive
- pitch
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図及び第２図はそれぞれ実施例を示す略線
図、第３図及び第４図はそれぞれ従来のサーマル
ヘツドを示す略線図である。
１１，１５……発熱抵抗体、１２，１７ａ，１
７ｂ……共通電極、１３，１６……選択電極、１
４，１８……駆動ＩＣ。
1 and 2 are schematic diagrams showing an embodiment, respectively, and FIGS. 3 and 4 are schematic diagrams showing a conventional thermal head, respectively. 11, 15...Heating resistor, 12, 17a, 1
7b... Common electrode, 13, 16... Selection electrode, 1
4,18...Drive IC.
Claims (1)
されて形成され、前記機能素子密度よりも低密度
に片側配列されたボンデイングパツドをもつ駆動
ＩＣが前記機能素子配列に沿つて配置され、かつ
、その駆動ＩＣは機能素子の主走査方向から傾斜
させられている電子装置。 ２ 駆動ＩＣはそのボンデイングパツドの主走査
方向ピツチが機能素子の主走査方向ピツチ以下に
なるように主走査方向から傾斜させられている請
求項１に記載の電子装置。 ３ 駆動ＩＣはそのボンデイングパツドの主走査
方向ピツチが機能素子の主走査方向ピツチと等し
くなるように主走査方向から傾斜させられており
、前記機能素子の選択電極が駆動ＩＣに向かつて
折れ曲らずに互いに平行に配列されて形成され、
駆動ＩＣのボンデイングパツドと接続されている
請求項２に記載の電子装置。[Claims for Utility Model Registration] 1. A drive IC having functional elements arranged in rows in the main scanning direction on a substrate, and having bonding pads arranged on one side at a lower density than the functional elements; An electronic device that is arranged along a functional element array and whose drive IC is tilted from the main scanning direction of the functional elements. 2. The electronic device according to claim 1, wherein the drive IC is tilted from the main scanning direction so that the pitch of the bonding pad in the main scanning direction is equal to or less than the pitch of the functional element in the main scanning direction. 3. The drive IC is tilted from the main scanning direction so that the pitch of the bonding pad in the main scanning direction is equal to the pitch of the functional element in the main scanning direction, and the selection electrode of the functional element is bent toward the drive IC. formed by being arranged parallel to each other without
3. The electronic device according to claim 2, wherein the electronic device is connected to a bonding pad of a drive IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3709689U JPH02126845U (en) | 1989-03-29 | 1989-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3709689U JPH02126845U (en) | 1989-03-29 | 1989-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02126845U true JPH02126845U (en) | 1990-10-18 |
Family
ID=31543900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3709689U Pending JPH02126845U (en) | 1989-03-29 | 1989-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02126845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009148897A (en) * | 2007-12-18 | 2009-07-09 | Toshiba Hokuto Electronics Corp | Thermal print head and method for production thereof |
-
1989
- 1989-03-29 JP JP3709689U patent/JPH02126845U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009148897A (en) * | 2007-12-18 | 2009-07-09 | Toshiba Hokuto Electronics Corp | Thermal print head and method for production thereof |
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