JPH0236221A - Production of curable resin composition - Google Patents
Production of curable resin compositionInfo
- Publication number
- JPH0236221A JPH0236221A JP18467888A JP18467888A JPH0236221A JP H0236221 A JPH0236221 A JP H0236221A JP 18467888 A JP18467888 A JP 18467888A JP 18467888 A JP18467888 A JP 18467888A JP H0236221 A JPH0236221 A JP H0236221A
- Authority
- JP
- Japan
- Prior art keywords
- radically polymerizable
- parts
- meth
- curable resin
- epoxy compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 52
- 239000004593 Epoxy Substances 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 239000010419 fine particle Substances 0.000 claims abstract description 17
- 238000003756 stirring Methods 0.000 claims abstract description 13
- 125000000524 functional group Chemical group 0.000 claims abstract description 8
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 abstract description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 24
- 239000000203 mixture Substances 0.000 abstract description 15
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 abstract description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000015271 coagulation Effects 0.000 abstract 1
- 238000005345 coagulation Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- 238000001723 curing Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- -1 resists Substances 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KATAXDCYPGGJNJ-UHFFFAOYSA-N 1,3-bis(oxiran-2-ylmethoxy)propan-2-ol Chemical compound C1OC1COCC(O)COCC1CO1 KATAXDCYPGGJNJ-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- ZTJBELXDHFJJEU-UHFFFAOYSA-N dimethylboron Chemical compound C[B]C ZTJBELXDHFJJEU-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- DPDXVBIWZBJGSX-XUTVFYLZSA-N isoboonein Chemical compound C1C(=O)OC[C@@H]2[C@@H](C)[C@@H](O)C[C@@H]21 DPDXVBIWZBJGSX-XUTVFYLZSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QNAJAJLBHMMOJB-UHFFFAOYSA-N oxiran-2-ylmethyl propanoate Chemical compound CCC(=O)OCC1CO1 QNAJAJLBHMMOJB-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)発明の目的
〔産業上の利用分野〕
本発明は、架橋した微小エポキシ樹脂粒子を分散させた
ラジカル重合性の硬化性樹脂組成物の新規な製造法に関
する。本発明により得られるラジカル重合性の硬化性樹
脂組成物は、紫外線、電子線、X線及び放射線等の活性
エネルギー線や加熱により硬化するものであり、具体的
な用途として塗料、レジスト、インキ、接着剤、ポツテ
ィング剤及びシーリング材等がある。DETAILED DESCRIPTION OF THE INVENTION (a) Object of the Invention [Field of Industrial Application] The present invention relates to a novel method for producing a radically polymerizable curable resin composition in which crosslinked fine epoxy resin particles are dispersed. The radically polymerizable curable resin composition obtained by the present invention is cured by active energy rays such as ultraviolet rays, electron beams, X-rays, and radiation, or by heating, and specific applications include paints, resists, inks, There are adhesives, potting agents, sealants, etc.
〔従来の技術]
活性エネルギー線の照射或いは加熱により硬化する、ラ
ジカル重合性の硬化性樹脂組成物から得られる硬化物の
引っ張り強度、硬度、密着性、折り曲げ強度及び耐摩耗
性等の物理的性能を向上させる方法として、大きさ数ミ
クロン以下のさまざまな微粒子状樹脂硬化物を分散させ
る方法が知られている(特開昭63−17903、特開
昭62129355、特開昭61−162501、特開
昭51−109942等)。[Prior Art] Physical properties such as tensile strength, hardness, adhesion, bending strength, and abrasion resistance of a cured product obtained from a radically polymerizable curable resin composition that is cured by irradiation with active energy rays or heating. As a method for improving the temperature, there is a known method of dispersing various particulate resin cured products with a size of several microns or less (Japanese Patent Application Laid-Open No. 63-17903, JP-A No. 62129355, JP-A No. 61-162501, JP-A No. 61-162501, JP-A-61-162501, (Sho 51-109942, etc.)
この場合、あらかじめ別工程で製造された微粒子状樹脂
硬化物を、なんらかの方法で硬化性樹脂に分散させるこ
とがa・要であり、分散させるための微粒子を合成、分
離及び乾燥することにより、−旦固体として取り出して
から硬化性樹脂に分散させるというように、多くの工程
を経なければならない。また、別工程で製造された微粒
子の乾燥工程中には、粒子の凝集、粒子の表面状態の変
化等の好ましくない現象が起きる可能性があり、硬化性
樹脂組成物中における微粒子の分散安定性等に悪影Cを
与え、場合によっては分離、沈降することがある。In this case, it is essential to disperse the fine particulate resin cured material, which has been previously produced in a separate process, into the curable resin by some method, and by synthesizing, separating and drying the fine particles for dispersion, - It must go through many steps, such as first taking it out as a solid and then dispersing it in a curable resin. In addition, during the drying process of fine particles manufactured in a separate process, undesirable phenomena such as particle aggregation and changes in the surface state of the particles may occur, which may affect the dispersion stability of the fine particles in the curable resin composition. etc., and may cause separation and precipitation in some cases.
一方、微粒子を硬化性樹脂中に分散させたものを得るた
めに、微粒子を形成する成分であるラジカル重合性の単
量体を、エポキシ化合物中で重合させる方法が知られて
いる(特開昭6O−55023)。しかし、ラジカル重
合性の硬化性樹脂中で、微粒子を形成する成分を重合さ
せる方法は知られていない。On the other hand, in order to obtain fine particles dispersed in a curable resin, a method is known in which a radically polymerizable monomer, which is a component forming the fine particles, is polymerized in an epoxy compound (Japanese Patent Application Laid-open No. 6O-55023). However, there is no known method for polymerizing components that form fine particles in a radically polymerizable curable resin.
[発明が解決しようとする課題]
本発明は、別工程で微粒子を合成、分離及び乾燥した後
、硬化性樹脂に分散させるというような、多くの工程を
経ることなく、微粒子を安定に分散させたラジカル重合
性の硬化性樹脂組成物を製造する方法の提供を課題とす
る。[Problems to be Solved by the Invention] The present invention is capable of stably dispersing fine particles without going through many steps such as synthesizing, separating and drying the fine particles in separate steps, and then dispersing them in a curable resin. An object of the present invention is to provide a method for producing a radically polymerizable curable resin composition.
(ロ)発明の構成
〔課題を解決するための手段]
本発明者等は上記公知方法の問題点を解決すべく種々の
検討を行った結果、多官能エポキシ化合物を、ラジカル
重合性の硬化性樹脂中において重合させても、硬化性樹
脂のラジカル硬化性に悪影響を与えないで、架橋したエ
ポキシ化合物の微粒子を分散させたラジカル重合性の硬
化性樹脂組成物を得ることができるという事実を見出し
、本発明を完成するに至った。(B) Structure of the Invention [Means for Solving the Problems] As a result of various studies conducted by the present inventors in order to solve the problems of the above-mentioned known methods, the present inventors have developed a radically polymerizable curable polyfunctional epoxy compound. Discovered the fact that it is possible to obtain a radically polymerizable curable resin composition in which fine particles of a crosslinked epoxy compound are dispersed without adversely affecting the radical curability of the curable resin even when polymerized in a resin. , we have completed the present invention.
即ち本発明は、分子中に少なくとも1個以−トのラジカ
ル重合性の官能基を有する液状化合物中において、撹拌
下に、一種以上の多官能エポキシ化合物を重合させるこ
とにより、エポキシ化合物重合体を分散させることを特
徴とする硬化性樹脂組成物の製造法に関するものである
。That is, the present invention provides an epoxy compound polymer by polymerizing one or more polyfunctional epoxy compounds under stirring in a liquid compound having at least one radically polymerizable functional group in the molecule. The present invention relates to a method for producing a curable resin composition characterized by dispersion.
以下、本発明の製造方法及び製造された硬化性樹脂組成
物の硬化方法について述べる。Hereinafter, the manufacturing method of the present invention and the curing method of the manufactured curable resin composition will be described.
く分子中に少なくとも1個以上のラジカル重合性の官能
基を有する液状化合物〉
上記化合物は、活性エネルギー線の照射または加熱によ
り重合するものであり、活性エネルギー線の照射により
重合する液状化合物としては、(メタ)アクリロイル基
(アクリロイル基及び/またはメタアクリロイル基、以
下同じ)を−分子中に少なくとも一個含有する単量体、
オリゴマまたはポリマー等の化合物がある。かかる化合
物の具体例としては、β−ヒドロキシエチル(メタ)ア
クリレート 、β−ヒドロキシプロピル(メタ)アクリ
レート、β−ヒドロキシエチル(メタ)アクリロイルホ
スフェート、ジメチルアミノエチル(メタ)アクリレー
ト、ジエチルアミノエチル(メタ)アクリレート、エチ
レングリコールジ(メタ)アクリレート、ジエチレング
リコルジ(メタ)アクリレート、トリエチレングリコー
ルジ(メタ)アクリレート、ポリエチレングリコールジ
(メタ)アクリレート、プロピレングリコールジ(メタ
)アクリレート、ジプロビレングリコールジ(メタ)ア
クリレート、トリブロビレングリコールジ(メタ)アク
リレート、ポリプロピレングリコールジ(メタ)アクリ
レート、トリメチロールプロパンジ(メタ)アクリレー
ト、トリメチロールプロパントリ(メタ)アクリレート
、ペンタエリスリトールテトラ(メタ)アクリレート、
ジペンタエリスリトールテトラ(メタ)アクリレート、
ジペンタエリスリトールペンタ(メタ)アクリレート、
ジペンタエリスリトールヘキサ(メタ)アクリレートも
しくはトリス〔2(メタ)アクリロイルオキシエチル〕
イソシアヌレート、多塩基酸とヒドロキシルアルキル(
メタ)アクリレートとのモノ−、ジー、トリー、または
それ以上のポリエステルまたはウレタン(メタ)アクリ
レート等がある。Liquid compounds having at least one radically polymerizable functional group in the molecule> The above compounds are polymerized by irradiation with active energy rays or heating, and liquid compounds that polymerize by irradiation with active energy rays include: , a monomer containing at least one (meth)acryloyl group (acryloyl group and/or methacryloyl group, hereinafter the same) in the molecule,
Compounds include oligomers or polymers. Specific examples of such compounds include β-hydroxyethyl (meth)acrylate, β-hydroxypropyl (meth)acrylate, β-hydroxyethyl (meth)acryloyl phosphate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate. , ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, Tribrobylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate,
dipentaerythritol tetra(meth)acrylate,
dipentaerythritol penta(meth)acrylate,
Dipentaerythritol hexa(meth)acrylate or tris [2(meth)acryloyloxyethyl]
Isocyanurates, polybasic acids and hydroxyalkyl (
Examples include mono-, di-, tri-, or higher polyesters with meth)acrylates or urethane (meth)acrylates.
一方、加熱により硬化し得る液状化合物としては、具体
的には不飽和ポリエステル樹脂、ウレタンアクリレート
樹脂、ポリエステルアクリレート樹脂、スピランアクリ
レート樹脂及びポリエーテルアクリレート樹脂等がある
。On the other hand, specific examples of liquid compounds that can be cured by heating include unsaturated polyester resins, urethane acrylate resins, polyester acrylate resins, spiran acrylate resins, and polyether acrylate resins.
上記のラジカル重合性の官能基を有する液状化合物とし
ては、常温あるいは微粒子の合成温度において固体状の
ものを含まない液状であることが−望ましい。それ自体
が液状のものは、その1種または2種以上を任意に混合
して用いることができ、またそれ自体が液状でないもの
は、これを同種の硬化手段で硬化可能な他の液状化合物
と混合することにより、液状化合物として用いることが
できる。また、上記液状化合物としては、微粒子形成時
の攪拌性を高めるため、25゛Cにおいて300Q c
ps以下の粘度を有するものが好ましい。It is desirable that the above liquid compound having a radically polymerizable functional group be in a liquid state and not contain any solid matter at room temperature or at the fine particle synthesis temperature. If the compound itself is liquid, it can be used alone or in a mixture of two or more, and if it is not liquid itself, it can be combined with another liquid compound that can be cured by the same type of curing means. By mixing, it can be used as a liquid compound. In addition, the above-mentioned liquid compound is 300Q c
Those having a viscosity of less than ps are preferred.
〈多官能エポキシ化合物〉
本発明で用いられる多官能エポキシ化合物は、触媒また
は硬化剤を用いて硬化できるエポキシ基を2個以上含存
する液状エポキシ化合物である。<Polyfunctional epoxy compound> The polyfunctional epoxy compound used in the present invention is a liquid epoxy compound containing two or more epoxy groups that can be cured using a catalyst or a curing agent.
これらの多官能エポキシ化合物は、ラジカル重合性の液
状化合物の硬化性に悪影響を与えないものが好ましく、
このような化合物としては、分枝または直鎮脂肪族、脂
環式、芳香族または複素環式〔Oおよび(または)Nヘ
テロ原子を有する〕等の種々の化合物を用いることがで
きる。その具体的な例としては、ビニルシクロヘキセン
ジオキシド、ビスフェノールへのジグリシジルエーテル
、ビス(3,4−エポキシ−6−メチルシクロヘキシル
メチル)アジペート、ジペンテンオキシド、14−ブタ
ンジオールジグリシジルエーテル、フェノールホルムア
ルデヒドレゾールまたはノボランク樹脂のポリグリシジ
ルエーテル、レゾルシノールジグリシジルエーテル、1
.3−ビス(23−エポキシプロビル−5,5−ジメチ
ル−2゜4−イミダシリンジオン)等がある。These polyfunctional epoxy compounds are preferably those that do not adversely affect the curability of the radically polymerizable liquid compound.
As such compounds, various compounds can be used, such as branched or straight aliphatic, cycloaliphatic, aromatic or heterocyclic [containing O and/or N heteroatoms]. Specific examples include vinyl cyclohexene dioxide, diglycidyl ether to bisphenol, bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, dipentene oxide, 14-butanediol diglycidyl ether, and phenol formaldehyde resol. or polyglycidyl ether of Novolanc resin, resorcinol diglycidyl ether, 1
.. Examples include 3-bis(23-epoxypropyl-5,5-dimethyl-2°4-imidasyringedione).
〈単官能エポキシ化合物〉
エポキシ化合物の重合体から成る微粒子を形成させるた
めの成分として、上記多官能エポキシ化合物の他に、分
子中にエポキシ基を1個有する単官能エポキシ化合物を
併用することができ、具体的には、プロピレンオキシド
、スチレンオキシド、グリシドール、ブタジェンオキシ
ド及びグリシジルプロピオネート等を使用することがで
きる。<Monofunctional epoxy compound> In addition to the above-mentioned polyfunctional epoxy compound, a monofunctional epoxy compound having one epoxy group in the molecule can be used in combination as a component for forming fine particles made of a polymer of an epoxy compound. Specifically, propylene oxide, styrene oxide, glycidol, butadiene oxide, glycidyl propionate, etc. can be used.
〈分散安定剤〉
上記エポキシ化合物を、ラジカル重合性の液状化合物中
にて撹拌下に重合させ、微粒子状の樹脂を得る際、所望
により、微粒子状の樹脂の分散安定剤となる成分を存在
させてもよい。好適な分散安定剤は、その構造中に、微
粒子状の樹脂を生成するエポキシ化合物に反応性の部分
と、ラジカル重合性の液状化合物に可溶性の部分とを合
わせ持ったものであり、具体的には、幹にエポキシ基を
持ち、枝成分がラジカル重合性液状化合物に可溶性なグ
ラフトポリマーとか、末端がエポキシ基であり、ラジカ
ル重合性液状化合物に可溶な成分を有するマクロモノマ
ー等が挙げられる。<Dispersion stabilizer> When the above-mentioned epoxy compound is polymerized in a radically polymerizable liquid compound with stirring to obtain a particulate resin, a component that serves as a dispersion stabilizer for the particulate resin may be present if desired. It's okay. A suitable dispersion stabilizer has in its structure a part that is reactive with the epoxy compound that forms particulate resin and a part that is soluble in a radically polymerizable liquid compound. Examples include a graft polymer having an epoxy group in the trunk and a branch component soluble in a radically polymerizable liquid compound, and a macromonomer having an epoxy group at the end and a component soluble in a radically polymerizable liquid compound.
〈微粒子の合成方法〉
具体的な好ましい合成条件は以下のとおりである。即ち
、ラジカル重合性の液状化合物100重量部(以下、部
とあるのは重量部とする)に対し、一種以上の多官能エ
ポキシ化合物1〜50部及び単官能エポキシ化合物0〜
70部を、エポキシ化合物の合計量として90部以下、
場合により分散安定剤を1〜70部、さらに場合により
適当量のラジカル重合禁止剤および適当量のカチオン重
合触媒を一括しであるいは滴下により混合する。<Method for synthesizing fine particles> Specific preferable synthesis conditions are as follows. That is, 1 to 50 parts of one or more polyfunctional epoxy compounds and 0 to 50 parts of a monofunctional epoxy compound are added to 100 parts by weight of a radically polymerizable liquid compound (hereinafter "parts" refer to parts by weight).
70 parts, 90 parts or less as the total amount of the epoxy compound,
Optionally, 1 to 70 parts of a dispersion stabilizer, and optionally an appropriate amount of a radical polymerization inhibitor and an appropriate amount of a cationic polymerization catalyst are mixed all at once or by dropwise addition.
括混合後あるいは滴下混合中は、該混合物を0〜100
“Cの反応温度で攪拌しながら数時間〜数日間保持し、
この間は所望により空気の吹き込みを行ってもよい。上
記の攪拌操作は、均一な微粒子を形成するために行うも
ので、最適な攪拌条件は実験的に容易に定めることがで
き、例えば、300m1の4つロフラスコ内で回転半径
1.5〜2cmの攪拌羽根を用いて攪拌する場合、20
0〜800rρmの回転速度で攪拌すると効果的である
。このような重合操作により、架橋した微小エポキシ樹
脂粒子を分散させたラジカル重合性の硬化性樹脂組成物
を得ることができる。After bulk mixing or during dropwise mixing, the mixture is
“Hold at a reaction temperature of C for several hours to several days while stirring,
During this time, air may be blown in if desired. The above stirring operation is performed to form uniform fine particles, and the optimal stirring conditions can be easily determined experimentally. When stirring using a stirring blade, 20
Stirring at a rotational speed of 0 to 800 rpm is effective. By such a polymerization operation, a radically polymerizable curable resin composition in which crosslinked fine epoxy resin particles are dispersed can be obtained.
また所望により、微小エポキシ樹脂粒子の表面に、二重
結合等の様々な官能基を導入することも可能である0例
えば、二重結合を導入する方法としては、グリシジル(
メタ)アクリレートを他のエポキシ化合物と同時に仕込
んでエポキシ樹脂粒子とするか、より好ましくは、ある
程度粒子が生成した時点で、上記グリシジル(メタ)ア
クリレートを添加する方法がある。このように、エポキ
シ樹脂粒子表面に導入された二重結合を有する官能基は
、マトリックスのラジカル重合性化合物の硬化時に同時
に重合するため、粒子とマトリックスとの界面での結合
を強固にすることができる。If desired, it is also possible to introduce various functional groups such as double bonds onto the surface of the micro epoxy resin particles. For example, as a method for introducing double bonds, glycidyl (
There is a method in which meth)acrylate is simultaneously charged with other epoxy compounds to form epoxy resin particles, or more preferably, the glycidyl (meth)acrylate is added once particles have been formed to a certain extent. In this way, the functional group having a double bond introduced into the surface of the epoxy resin particles polymerizes at the same time as the radically polymerizable compound of the matrix is cured, making it possible to strengthen the bond at the interface between the particles and the matrix. can.
本発明によって製造される微小エポキシ樹脂粒子を分散
させたラジカル重合性の硬化性樹脂組成物は、常法によ
って活性エネルギー線または熱により硬化させることが
でき、その際所望により、適当な開始剤および/または
増感剤を適当量添加しうる。The radically polymerizable curable resin composition in which minute epoxy resin particles are dispersed can be cured using active energy rays or heat in a conventional manner, and if desired, a suitable initiator and /Or a suitable amount of sensitizer may be added.
微小エポキシ樹脂粒子を分散させたラジカル重合性の硬
化性樹脂組成物の具体的な用途としては、塗料、レジス
ト、インキ、接着剤、ポツティング等がある。特に、本
発明によるラジカル重合性の硬化性樹脂組成物は、架橋
した微小エポキシ樹脂粒子が分散され、いわゆる「海島
構造」を形成しているので、それらが分散されていない
組成物に比べ種々の好ましい物性を有する。たとえば、
引っ張り強度、硬度、密着性、折り曲げ強度及び耐摩耗
性等の機械的物性が向上する等の点に加え、活性エネル
ギー線や熱による硬化時の収縮を小さくすることができ
、無機フィラーの場合に比べ透明性が良好なため深部硬
化性に優れ、不均一分散系であるため粘度上昇が少ない
等の利点があげられる。Specific uses of radically polymerizable curable resin compositions in which minute epoxy resin particles are dispersed include paints, resists, inks, adhesives, pottings, and the like. In particular, the radically polymerizable curable resin composition of the present invention has cross-linked micro epoxy resin particles dispersed therein, forming a so-called "sea-island structure", so that it has a variety of properties compared to a composition in which they are not dispersed. It has favorable physical properties. for example,
In addition to improving mechanical properties such as tensile strength, hardness, adhesion, bending strength, and abrasion resistance, shrinkage during curing due to active energy rays and heat can be reduced, and in the case of inorganic fillers, In comparison, it has advantages such as good transparency, excellent deep curability, and less viscosity increase because it is a non-uniformly dispersed system.
以下実施例により本発明の詳細な説明する。なお、実施
例中の「部」および「%」は重量基準による。The present invention will be explained in detail below with reference to Examples. Note that "parts" and "%" in the examples are based on weight.
実施例1
攪拌機、温度計をセットした4ツロフラスコ(300m
l)に、東亜合成化学工業■製品アロニ7クスM−30
9()リメチロールプロパントリアクリレート)100
部と、ハイドロキノンモノメチルエーテル(禁止剤)0
.05部とを仕込んだ。Example 1 4 flasks (300m) equipped with a stirrer and thermometer
l) Toagosei Chemical Industry ■Product Aronics 7x M-30
9 () Limethylolpropane triacrylate) 100
and hydroquinone monomethyl ether (inhibitor) 0
.. I prepared 05 parts.
フラスコ内容物を攪拌しながらその中へ、ナガセ化成工
業側製品デナコールEX−192(ドデカニルグリシジ
ルエーテルとトリデカニルグリシジルエーテルの混合物
)20部、ナガセ化成工業■製品デナコールEX−51
2(ポリグリセロルポリグリシジルエーテル)2部及び
上述のアロニックスM−309の40部よりなる滴下液
と、三フッ化ホウ素ジエチルエーテラート2部及びアロ
ニンクスM−309の20部よりなる滴下液とを、それ
ぞれ室温において30分にわたり同時に滴下した。滴下
開始後フラスコ内温は約5°C上昇し、滴下終了後体々
に低下した。滴下終了後も撹拌を継続し、滴下開始後3
0時間で合成を完了した。While stirring the contents of the flask, add 20 parts of Nagase Chemical Industries' product Denacol EX-192 (a mixture of dodecanyl glycidyl ether and tridecanyl glycidyl ether), and Nagase Chemicals' product Denacol EX-51.
2 (polyglycerol polyglycidyl ether) and 40 parts of the above-mentioned Aronix M-309, and a dropping solution consisting of 2 parts of boron trifluoride diethyl etherate and 20 parts of Aronix M-309. , respectively, were added dropwise simultaneously over 30 minutes at room temperature. After the dropwise addition started, the flask internal temperature rose by about 5°C, and after the dropwise addition was finished, the flask internal temperature gradually decreased. Continue stirring even after dropping, and after starting dropping
The synthesis was completed in 0 hours.
生成物は薄肉色の液状で、粘度は25°Cにおいて12
5cpsであり、またこの生成物中にはTHE(テトラ
ヒドロフラン、以下同じ)、アセトン及びトルエンに不
溶な成分が存在した。粒度分布測定装置(揚場製作所、
遠心式CAPA−500)を用いた測定によると、平均
粒径0.15μmの微小樹脂粒子が存在した。The product is a pale liquid with a viscosity of 12 at 25°C.
5 cps, and this product contained components insoluble in THE (tetrahydrofuran, hereinafter the same), acetone, and toluene. Particle size distribution measuring device (Ageba Seisakusho,
According to measurement using a centrifugal CAPA-500), fine resin particles with an average particle size of 0.15 μm were present.
この微粒子状樹脂を分散させた硬化性樹脂組成物の収縮
率を以下の方法により測定した。まず、この組成物の脱
泡をペルジャー中にて真空ポンプにより数回行った後、
2ccの比重びんを用いJIS K−6833(6,
1,2)に準じて硬化前の比重を測定したところ、1.
10であった。これとは別に、この組成物へ日本チバガ
イギー味製品イルガキュアー651(光開始剤)2%を
添加し上記と同様に脱泡を数回繰り返した。この組成物
を厚さ1mmのゴム枠をはりつけたポリエステルフィル
ム上に気泡が入らないように流し込み、その上からポリ
エステルフィルムで覆い、更に上下から透明ガラスで挟
んで固定しサンプルを作成した。The shrinkage rate of the curable resin composition in which this particulate resin was dispersed was measured by the following method. First, this composition was degassed several times in a Pelger using a vacuum pump, and then
JIS K-6833 (6,
When the specific gravity before curing was measured according to 1 and 2), 1.
It was 10. Separately, 2% of Irgacure 651 (photoinitiator), a Japanese Ciba Geigy flavor product, was added to this composition, and defoaming was repeated several times in the same manner as above. A sample was prepared by pouring this composition onto a polyester film with a 1 mm thick rubber frame attached thereto so as not to create air bubbles, covering it with a polyester film, and fixing it by sandwiching it between transparent glasses from above and below.
このサンプルを5部w/cmの出力の高圧水銀灯(ウシ
オ電機■製、オゾンレス千行光型)の下25cmの距離
で表裏各々3分間紫外線を照射した。This sample was irradiated with ultraviolet rays for 3 minutes on each of the front and back surfaces at a distance of 25 cm under a high-pressure mercury lamp (manufactured by Ushio Inc., ozone-less thousand-light type) with an output of 5 parts w/cm.
次いでガラス板、ポリエステルフィルムを取り外し、水
銀灯を20cmに下げて更に表裏各々3分間照射して硬
化操作を終え、1mmX30mmlmmX3Oの硬化物
を作成した。硬化物の透明性は良好であった。この硬化
物を利用してJIS K−6911(5,28)に従
い硬化後の比重を測定したところ、1.19であった。Next, the glass plate and polyester film were removed, the mercury lamp was lowered to 20 cm, and the front and back sides were further irradiated for 3 minutes each to complete the curing operation, and a cured product of 1 mm x 30 mm l mm x 3 O was created. The cured product had good transparency. Using this cured product, the specific gravity after curing was measured according to JIS K-6911 (5, 28) and found to be 1.19.
硬化前後の比重より次式に従い硬化収縮率を計算したと
ころ7.98%であった。The curing shrinkage rate was calculated from the specific gravity before and after curing according to the following formula, and was found to be 7.98%.
収縮率(%)= (D−D、)X100/DD0 :硬
化前の比重
D ;硬化後の比重
一方、微粒子状樹脂が分散されていないM−309のみ
の収縮率は12.0%であった。Shrinkage rate (%) = (DD,) Ta.
実施例2
東亜合成化学工業■製品アロニックスM−5400〔フ
タル酸モノ(アクリロイルオキジ)エチルエステル14
0部と東亜合成化学工業■製品アロニノクスM−101
(α−アクリロイル−ωフェノキシーポリオキシエチレ
ン)60部及びハイドロキノンモノメチルエーテル(禁
止剤)0゜05部を、実施例1と同様の4ツロフラスコ
に仕込んだ。Example 2 Toagosei Chemical Industry Product Aronix M-5400 [Phthalic acid mono(acryloyl oxy)ethyl ester 14
Part 0 and Toagosei Chemical Industry ■Product Aroninox M-101
60 parts of (α-acryloyl-ω phenoxypolyoxyethylene) and 0.05 parts of hydroquinone monomethyl ether (inhibitor) were charged into a 4-tube flask similar to that in Example 1.
その中へ、ナガセ化成工業■製品デナコールEX−14
1(フェニルグリシジルエーテル)15部、油化ンエル
エポキシ■製品エピコートE−828(エピクロールヒ
ドリンとジフェニロールプロパンとの重縮合物)7部、
グリシジルメタアクリレート2部、上述のM5400が
40%でMlolが60%である混合物20部よりなる
滴下液と、三フン化ホウ素ジエチルエーテラート2部、
上述のM−5400とM−101との4部6混合物20
部よりなる滴下液とを、実施例1と同様にして室温にて
30分で滴下し、滴下開始後35時間で合成を終了した
。Among them, Nagase Chemical Industry ■Product Denacol EX-14
1 (phenyl glycidyl ether) 15 parts, 7 parts of Yuka Epoxy Product Epicoat E-828 (polycondensate of epichlorohydrin and diphenylolpropane),
A dropping solution consisting of 2 parts of glycidyl methacrylate, 20 parts of the above-mentioned mixture of 40% M5400 and 60% Mlol, and 2 parts of boron trifluoride diethyl etherate,
4 parts 6 mixture 20 of the above M-5400 and M-101
A dropwise addition solution consisting of 50% was added dropwise at room temperature over 30 minutes in the same manner as in Example 1, and the synthesis was completed 35 hours after the start of the dropwise addition.
生成物は1黄白色の液状で25°Cにおいて粘度190
cpsであり、THF、アセトン、トルエンに不溶の成
分が存在した。この内部架橋した微小樹脂粒子の平均粒
径は0.2μmであった。The product is a yellow-white liquid with a viscosity of 190 at 25°C.
cps, and components insoluble in THF, acetone, and toluene were present. The average particle size of the internally crosslinked fine resin particles was 0.2 μm.
実施例1と同様に硬化収縮率を測定したところ、8.3
%であった。微粒子状樹脂の分散していないM−540
0が40%でM−101が60%である混合物の硬化収
縮率は13.5%であった。When the curing shrinkage rate was measured in the same manner as in Example 1, it was 8.3.
%Met. M-540 with no particulate resin dispersed
The curing shrinkage of a mixture containing 40% M-0 and 60% M-101 was 13.5%.
実施例3
東亜合成化学工業■製品アロ二ノクスM−220(ポリ
プロピレングリコールジアクリレート)100部、ハイ
ドロキノンモノメチルエーテル〔禁止剤)0.05部を
実施例1と同様の4ツロフラスコに計りとった。その中
へ、ナガセ化成工業■製品デナコールEX−121(2
−エチルへキジルーグリシジルエーテル)48部、ナガ
セ化成工業■製品デナコールEχ−321()リメチロ
ールプロパンーポリグリンジルエーテル)5部、グリシ
ジルメタクリレート5部、上述のアロニノクスM−22
0の45部よりなる滴下液と、三フッ化ホウ素ジメチル
エーテラート5部、アロニノクスM−220の30部よ
りなる滴下液とを、実施例1と同様にして室温にて30
分で滴下し、滴下開始後45時間で合成を終了した。生
成物は1黄白色の液状で25°Cにおける粘度は40c
psであり、TF(F、アセトン、トルエンに不溶の成
分が存在した。この内部架橋した微粒子状樹脂の平均粒
径は0.35μmであった。実施例1と同様に硬化収縮
率を測定したところ、6.5%であった。微粒子状樹脂
の分散していないM−220のみの硬化収縮率は11.
5%であっ、た。Example 3 100 parts of Aroninox M-220 (polypropylene glycol diacrylate) manufactured by Toagosei Chemical Industry Co., Ltd. and 0.05 part of hydroquinone monomethyl ether (inhibitor) were weighed into a 4-tube flask similar to that used in Example 1. Among them, Nagase Chemical Industries ■ product Denacol EX-121 (2
- Ethylhexylglycidyl ether) 48 parts, Nagase Kasei Kogyo Product Denacol Eχ-321 (limethylolpropane-polyglycidyl ether) 5 parts, glycidyl methacrylate 5 parts, Aroninox M-22 mentioned above
0, 5 parts of boron trifluoride dimethyl etherate, and 30 parts of Aroninox M-220 were mixed at room temperature for 30 parts in the same manner as in Example 1.
The mixture was added dropwise within minutes, and the synthesis was completed 45 hours after the start of dropping. The product is a yellowish white liquid with a viscosity of 40c at 25°C.
ps, and there were components insoluble in TF (F, acetone, and toluene). The average particle size of this internally crosslinked particulate resin was 0.35 μm. The curing shrinkage rate was measured in the same manner as in Example 1. The curing shrinkage rate of M-220 alone, in which no particulate resin was dispersed, was 11.5%.
It was 5%.
この内部架橋した微粒子状樹脂を分散させたラジカル重
合性の硬化性樹脂(アロニンクスM−220)Mi成物
の硬化物について、以下の方法により引っ張り強度の測
定を行った。まずこの組成物にメルク社製品ダルキュア
ー1173(光開始剤)を2%添加し、実施例1と同様
の硬化方法により硬化させ、全長100mm、平行部分
幅10mmの引っ張り試験用の硬化試験片を作成した。The tensile strength of the cured product of the radically polymerizable curable resin (Aroninx M-220) Mi product in which this internally crosslinked particulate resin was dispersed was measured by the following method. First, 2% of Merck's Dalcure 1173 (photoinitiator) was added to this composition and cured using the same curing method as in Example 1 to create a cured test piece for tensile testing with a total length of 100 mm and a parallel portion width of 10 mm. did.
この試験片を用いテンシロン引っ張り試験機(東洋θす
■製UTM−4L型)にて、JIS K−7113に
従い引っ張り速度10mm/minで測定した。Using this test piece, measurement was performed using a Tensilon tensile tester (model UTM-4L manufactured by Toyo θS) at a tensile speed of 10 mm/min in accordance with JIS K-7113.
その結果、引っ張り強度320 kg/cfflであっ
た。As a result, the tensile strength was 320 kg/cffl.
一方、微粒子状樹脂が分散されていないM−220のみ
の引っ張り強度は240 kg/ciであった。On the other hand, the tensile strength of M-220 alone, in which no particulate resin was dispersed, was 240 kg/ci.
実施例4
東亜合成化学工業@製品アロニックスM−6300(ジ
エチレングリコール、フタル酸、メタクリル酸の重縮合
物)100部を実施例1と同様の4ツロフラスコに計り
とった。その中へ、ナガセ化成工業■製品デナコール已
χ−111(アリルグリシジルエーテル)30部、ナガ
セ化成工業■製品デナコールEX−313(グリセロー
ルポリグリシジルエーテル)2部よりなる滴下液と、三
フッ化ホウ素ジメチルエーテラート3部、上述のアロニ
ンクスM−6300の20部よりなる滴下液とを、実施
例1と同様にして室温にて30分で滴下し、滴下開始後
35時間で合成を終了した。Example 4 100 parts of Aronix M-6300 (a polycondensate of diethylene glycol, phthalic acid, and methacrylic acid) manufactured by Toagosei Chemical Industry Co., Ltd. was weighed into the same 4-tube flask as in Example 1. Into it, a dropping solution consisting of 30 parts of Nagase Chemical Industries ■ product Denacol χ-111 (allyl glycidyl ether), 2 parts of Nagase Chemical Industries ■ product Denacol EX-313 (glycerol polyglycidyl ether), and dimethyl boron trifluoride. A dropwise solution consisting of 3 parts of etherate and 20 parts of the above-mentioned Aroninx M-6300 was added dropwise at room temperature over 30 minutes in the same manner as in Example 1, and the synthesis was completed 35 hours after the start of the dropwise addition.
生成物は1白色の液状で、25°Cにおける粘度は23
Qcpsであり、THF、アセトン、トルエンに不溶の
成分が存在した。この内部架橋した微粒子状樹脂の平均
粒径は0.25μmであった。The product is a white liquid with a viscosity of 23 at 25°C.
Qcps, and components insoluble in THF, acetone, and toluene were present. The average particle size of this internally crosslinked particulate resin was 0.25 μm.
この組成物へ光開始剤の代わりに過酸化ヘンジイル(開
始剤)3%を添加する点と、紫外線照射装置の代わりに
熱風オーブンにて100°Cで60分の加熱を行い硬化
物を作成する以外は、実施例1と同様にして硬化収縮率
を測定したところ、79%であった。一方、微粒子状樹
脂の分散していないM−6300の硬化収縮率は12.
2%であった。A cured product is created by adding 3% hendyl peroxide (initiator) instead of a photoinitiator to this composition, and heating it in a hot air oven for 60 minutes at 100°C instead of using an ultraviolet irradiation device. The curing shrinkage rate was measured in the same manner as in Example 1 except for this, and was found to be 79%. On the other hand, the curing shrinkage rate of M-6300 in which fine particulate resin is not dispersed is 12.
It was 2%.
(ハ)発明の効果
本発明の製造法は、ラジカル重合性の液状化合物中にお
いてイオン重合性のエポキシ化合物をイオン重合するこ
とにより、架橋した微小エポキシ樹脂粒子を分散させた
ラジカル重合性の硬化性樹脂組成物を得る方法であり、
従来の方法とは全く異なる新規な製造法である。(c) Effects of the invention The production method of the present invention is a radically polymerizable curable compound in which crosslinked micro epoxy resin particles are dispersed by ionic polymerization of an ionic polymerizable epoxy compound in a radically polymerizable liquid compound. A method for obtaining a resin composition,
This is a new manufacturing method that is completely different from conventional methods.
この製造法によれば、別途製造された微小樹脂粒子をラ
ジカル重合性樹脂に配合、分散させるという工程が不要
になるだけでなく、微粒子状樹脂の分離、乾燥工程にお
ける粒子の凝集、表面状態の変化といった好ましくない
現象をも防ぐことができる。This manufacturing method not only eliminates the step of blending and dispersing separately produced microscopic resin particles into a radically polymerizable resin, but also eliminates the separation of microscopic resin particles, agglomeration of particles during the drying process, and improvement of surface conditions. Undesirable phenomena such as changes can also be prevented.
また本発明の製造法により製造されたラジカル硬化性樹
脂組成物は、透明性が良好で深部透過性に優れており、
粘度上昇が少ない他、硬化後の収縮が小さくてかつ、種
々の機械的物性が向上した硬化物を形成する一般的効果
に加え、上記のように粒子の凝集や表面状態の変化がな
く、微粒子状樹脂の分散状態は安定である。In addition, the radical curable resin composition produced by the production method of the present invention has good transparency and excellent deep permeability,
In addition to the general effect of forming a cured product with little increase in viscosity, small shrinkage after curing, and improved various mechanical properties, as mentioned above, there is no aggregation of particles or changes in surface condition, and fine particles are formed. The dispersion state of the resin is stable.
Claims (1)
能基を有する液状化合物中において、撹拌下に一種以上
の多官能エポキシ化合物を重合させることにより、エポ
キシ化合物重合体の微粒子を分散させることを特徴とす
る硬化性樹脂組成物の製造法。1. Dispersing fine particles of an epoxy compound polymer by polymerizing one or more polyfunctional epoxy compounds under stirring in a liquid compound having at least one radically polymerizable functional group in the molecule. A method for producing a characteristic curable resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18467888A JPH0236221A (en) | 1988-07-26 | 1988-07-26 | Production of curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18467888A JPH0236221A (en) | 1988-07-26 | 1988-07-26 | Production of curable resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236221A true JPH0236221A (en) | 1990-02-06 |
Family
ID=16157449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18467888A Pending JPH0236221A (en) | 1988-07-26 | 1988-07-26 | Production of curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236221A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013091676A (en) * | 2011-10-24 | 2013-05-16 | Panasonic Corp | Novel uv-curable resin composition |
| CN115605527A (en) * | 2020-05-15 | 2023-01-13 | 株式会社大赛璐(Jp) | Novel epoxy resins and epoxy resin compositions |
-
1988
- 1988-07-26 JP JP18467888A patent/JPH0236221A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013091676A (en) * | 2011-10-24 | 2013-05-16 | Panasonic Corp | Novel uv-curable resin composition |
| CN115605527A (en) * | 2020-05-15 | 2023-01-13 | 株式会社大赛璐(Jp) | Novel epoxy resins and epoxy resin compositions |
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