JPH0236268U - - Google Patents
Info
- Publication number
- JPH0236268U JPH0236268U JP11487088U JP11487088U JPH0236268U JP H0236268 U JPH0236268 U JP H0236268U JP 11487088 U JP11487088 U JP 11487088U JP 11487088 U JP11487088 U JP 11487088U JP H0236268 U JPH0236268 U JP H0236268U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- bare chip
- coil
- sandwiched
- output filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第３図は本考案の一実施例を示した
ものであり、第１図はＲＦモジユレータの分解斜
視図、第２図は同組立斜視図、第３図はセラミツ
ク基板の正面図である。第４図は従来型のＲＦモ
ジユレータの平面図である。
９ａ，９ｂ……出力フイルタ用コイル、１６…
…セラミツク基板、２１……ベアチツプＩＣ、２
３ａ，２３ｂ……発振用コイル。
Figures 1 to 3 show an embodiment of the present invention, in which Figure 1 is an exploded perspective view of the RF modulator, Figure 2 is an assembled perspective view of the same, and Figure 3 is a front view of the ceramic substrate. It is. FIG. 4 is a plan view of a conventional RF modulator. 9a, 9b... Output filter coil, 16...
... Ceramic substrate, 21 ... Bare chip IC, 2
3a, 23b...Oscillation coil.
Claims (1)
チツプＩＣをボンデイングし、発振用コイルと出
力フイルタ用コイルとを前記ベアチツプＩＣを挾
んで互いに反対側に位置せしめて前記セラミツク
基板上に夫々固設し、且つ、該セラミツク基板上
へ他の部品を配設したことを特徴とするＲＦモジ
ユレータ。 A bare chip IC is bonded onto a ceramic substrate provided with a wiring pattern, an oscillation coil and an output filter coil are positioned opposite to each other with the bare chip IC sandwiched between them, and are respectively fixed on the ceramic substrate, and An RF modulator characterized in that other parts are arranged on the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11487088U JPH0236268U (en) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11487088U JPH0236268U (en) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236268U true JPH0236268U (en) | 1990-03-08 |
Family
ID=31356009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11487088U Pending JPH0236268U (en) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236268U (en) |
-
1988
- 1988-08-31 JP JP11487088U patent/JPH0236268U/ja active Pending
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