JPH0325255U - - Google Patents
Info
- Publication number
- JPH0325255U JPH0325255U JP8598589U JP8598589U JPH0325255U JP H0325255 U JPH0325255 U JP H0325255U JP 8598589 U JP8598589 U JP 8598589U JP 8598589 U JP8598589 U JP 8598589U JP H0325255 U JPH0325255 U JP H0325255U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- negative power
- power source
- circuit mounting
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
Description
第１図ａは本考案の一実施例を示す分解斜視図
、ｂは同平面図、第２図は従来の負電源高周波集
積回路の実装構造を示す平面図である。
１……負電源高周波集積回路チツプ、２……負
電源集積回路搭載用台座コンデンサ、３……集積
回路搭載用基板、４……スルーホール、５……チ
ツプコンデンサ、６……マイクロチツプコンデン
サ。
FIG. 1a is an exploded perspective view showing an embodiment of the present invention, FIG. 1b is a plan view thereof, and FIG. 2 is a plan view showing the mounting structure of a conventional negative power source high frequency integrated circuit. 1... Negative power supply high frequency integrated circuit chip, 2... Pedestal capacitor for mounting negative power supply integrated circuit, 3... Board for mounting integrated circuit, 4... Through hole, 5... Chip capacitor, 6... Microchip capacitor.
Claims (1)
体による薄板状平行板構造をもつ負電源集積回路
搭載用台座コンデンサに実装してこれを集積回路
搭載基板上に搭載したことを特徴とする負電源高
周波集積回路実装構造。 A negative power source characterized in that a negative power source high frequency integrated circuit chip is mounted on a negative power source integrated circuit mounting pedestal capacitor having a thin parallel plate structure made of a high dielectric constant dielectric, and this is mounted on an integrated circuit mounting board. High frequency integrated circuit mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085985U JP2501869Y2 (en) | 1989-07-21 | 1989-07-21 | Negative power supply high frequency integrated circuit mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085985U JP2501869Y2 (en) | 1989-07-21 | 1989-07-21 | Negative power supply high frequency integrated circuit mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0325255U true JPH0325255U (en) | 1991-03-15 |
| JP2501869Y2 JP2501869Y2 (en) | 1996-06-19 |
Family
ID=31635389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989085985U Expired - Lifetime JP2501869Y2 (en) | 1989-07-21 | 1989-07-21 | Negative power supply high frequency integrated circuit mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501869Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001015231A1 (en) * | 1999-08-19 | 2001-03-01 | Seiko Epson Corporation | Wiring board, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110052U (en) * | 1987-01-08 | 1988-07-15 |
-
1989
- 1989-07-21 JP JP1989085985U patent/JP2501869Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110052U (en) * | 1987-01-08 | 1988-07-15 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001015231A1 (en) * | 1999-08-19 | 2001-03-01 | Seiko Epson Corporation | Wiring board, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device |
| US6670700B1 (en) | 1999-08-19 | 2003-12-30 | Seiko Epson Corporation | Interconnect substrate and semiconductor device electronic instrument |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501869Y2 (en) | 1996-06-19 |