JPH0237698B2 - - Google Patents

Info

Publication number
JPH0237698B2
JPH0237698B2 JP58075334A JP7533483A JPH0237698B2 JP H0237698 B2 JPH0237698 B2 JP H0237698B2 JP 58075334 A JP58075334 A JP 58075334A JP 7533483 A JP7533483 A JP 7533483A JP H0237698 B2 JPH0237698 B2 JP H0237698B2
Authority
JP
Japan
Prior art keywords
wire
thin
bonding
hardness
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58075334A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59201454A (ja
Inventor
Naoyuki Hosoda
Masayuki Tanaka
Tamotsu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP58075334A priority Critical patent/JPS59201454A/ja
Publication of JPS59201454A publication Critical patent/JPS59201454A/ja
Publication of JPH0237698B2 publication Critical patent/JPH0237698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
JP58075334A 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線 Granted JPS59201454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58075334A JPS59201454A (ja) 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58075334A JPS59201454A (ja) 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Publications (2)

Publication Number Publication Date
JPS59201454A JPS59201454A (ja) 1984-11-15
JPH0237698B2 true JPH0237698B2 (cs) 1990-08-27

Family

ID=13573249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58075334A Granted JPS59201454A (ja) 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Country Status (1)

Country Link
JP (1) JPS59201454A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2873770B2 (ja) * 1993-03-19 1999-03-24 新日本製鐵株式会社 半導体素子のワイヤボンディング用パラジウム細線
CN113241303A (zh) * 2021-05-19 2021-08-10 合肥矽格玛应用材料有限公司 封装键合铂金丝及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169342A (en) * 1980-05-31 1981-12-26 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element

Also Published As

Publication number Publication date
JPS59201454A (ja) 1984-11-15

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