JPH0238457Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a stem for a circuit component, and more specifically, a hole is formed for positioning and adhesion on the adhesive surface of the stem for a circuit component, and for forming an insulating material stand. This is an attempt to simplify the work involved in positioning and bonding circuit components using optical sensors and the like.

Conventionally, a stem for a circuit component has a stem body 1 having an arbitrary shape such as a disc shape or a rectangular shape, as shown in FIG.
A nail pin insertion hole for inserting the nail pin 2 is provided in the nail pin insertion hole 3, the nail pin 2 is inserted into the nail pin insertion hole 3, and the nail pin 2 is sealed with an insulating material 4 such as glass. Hole 6
is provided, and the ground wire 5 is fixed to the stem body 1 through the ground sealing hole 6 by a conductor 8. Furthermore, a circuit component 9 such as a surface acoustic wave element is bonded to a predetermined position of the stem body 1.

A cap 10 is attached to a stem for such a circuit component.
(FIG. 2), and the circuit component 9 is hermetically sealed by crimping at the crimping flange 11 provided at the peripheral edge of the stem body 1.

The airtightly packaged circuit components as described above are connected to the circuit board 12, but in this case, as shown in FIG. is formed on the stem body 1. That is, this is to prevent the stem body 1 that is in electrical contact with the ground wire 5 from electrically contacting the substrate 12.

Such a glass stand 13 has a stem body 1
It is formed by drilling a stand mounting hole 14 in the stand mounting hole 14 and embedding glass in the stand mounting hole 14 so as to protrude toward the back side, while the top surface of the glass (the top surface of the glass stand 13) is the same as the surface of the stem body 1. It forms a plane (see Figure 3).

By providing such a glass stand 13, the stem body 1 and the substrate 12 can be mounted apart from each other, and the stem body 1 and the substrate 12 can be prevented from electrically contacting each other.

In the conventional stem for a circuit component as described above, the surface of the stem body 1 to which the circuit component 9 is to be bonded is smooth, and no positioning marks are formed thereon. When doing so, it was difficult to know the exact position of the adhesive. Furthermore, the circuit component 9 is attached to the stem body 1 with an adhesive, and as mentioned above, since the circuit component adhesive surface is smooth, the solvent of the adhesive may spread around the circuit component 9 during attachment. There were times when it overflowed. Such overflow of the solvent may impair the durability of the circuit component stem and, by extension, the circuit component, and may also adversely affect the characteristics of the circuit component 5.

On the other hand, it is extremely difficult to control the amount of adhesive applied so that the solvent does not overflow from the circuit component 9.

In addition, in the above-mentioned stem for circuit components, the stand mounting hole 14 is bored adjacent to the nail pin insertion hole 3 and the ground wire sealing hole 6 to ensure a sufficient distance between the stand mounting hole 14 and the board 12. In order to secure the stand height h required for
0 is formed, but such a base part 130
were prone to cracking, which caused damage to the airtightness of the airtight package.

This invention was made in view of the above points,
The purpose of this stem is to enable easy positioning when gluing circuit components to the stem body, and to prevent the adhesive from overflowing around the circuit components. Positioning the circuit component on the component adhesive surface,
Furthermore, two or more stand mounting holes for forming an insulating material stand are bored, and an insulating material is buried in the stand mounting holes so as to form a hole in the surface of the stem body.

An embodiment of the present invention will be described based on the drawings.

FIG. 4 is a perspective view of one embodiment of the present invention, and FIG. 5 is a sectional view taken along line A-A' in FIG. Symbols indicate the same thing.

As is clear from this drawing, the stem for a circuit component according to an embodiment of the present invention is provided with a crimping flange 11 on the peripheral edge of a rectangular stem body 1, and a nail pin for inserting a nail pin 2 therethrough. An insertion hole 3 is formed at a corner of the stem body 1, and the nail pin 2 is sealed into the insertion hole 3 with an insulating material 4.

Similar to the nail pin insertion hole 3, a ground sealing hole 6 is also provided at the corner, and the ground wire 5 is sealed to the stem body 1 by a conductor 7.

This nail pin insertion hole 3 and earth sealing hole 6
A circuit component adhesive portion 15 for pasting the circuit component 9 is provided at a position surrounded by , and a stand mounting hole 14 for forming an insulating material stand 13 is bored in this circuit component adhesive portion 15. has been done.

As is clear from FIG. 5, an insulating material such as glass is embedded in the stand mounting hole 14, and an insulating material stand 13 is formed that protrudes toward the back side of the stem body 1, that is, toward the substrate 12. . The upper surface of the insulating material stand 13 is below the surface of the stem body 1, and a hole 16 is formed in the surface of the stem body 1.

Further, in the embodiment shown in FIG. 6, the upper surface of the insulating material stand 13 is configured to have a concave radius.

In any case, the smell of the present invention is present on the surface of the stem body 1, that is, on the circuit component adhesive surface 1.
The stand 13 is provided in the stand mounting hole 14 such that a hole 16 is formed in the stand 5 .

Since such holes 16 serve as marks for determining the attachment position of the circuit component 9 using an optical sensor or the like, at least two or more holes are required, and preferably they are formed regularly at the corners of the stem body 1. It is better to set it in

Further, the insulating material stand 16 can have a diameter larger than the nail pin insertion hole 3 and the ground wire sealing hole 6 (see FIGS. 5b and 6b). By forming such a large-sized insulating material stand 16, there is an advantage that a sufficient stand h can be secured without forming the base portion 130 as shown in FIGS. 5a and 6a. be. That is, since this stand height h is determined by the diameter of the stand 13 and the surface tension of the insulating material, the stand height h is determined by the diameter of the stand 13 and the surface tension of the insulating material. If the hole is 14,
In order to ensure a sufficient stand height h, it was necessary to increase the diameter of the stand 13 by extending beyond the diameter of the mounting hole 14. Moreover, since the stand mounting hole 14 was conventionally provided adjacent to the nail pin insertion hole 3 and the ground wire sealing hole 6,
It has been impossible to increase the size of the mounting hole 14 because this would reduce the strength of the stem body 1.
In the present invention, the stand mounting hole 14 is formed in the circuit component adhesive surface 15, and since the circuit component adhesive surface 15 is formed in the center of the stem body 1, the mounting hole 14 is formed in the circuit component adhesive surface 15. Even if the diameter dimension is sufficient to secure the required stand height h, the strength of the stem body 1 will not be affected in any way.

Next, the operation of the present invention will be described.

According to the circuit component stem according to the present invention, when attaching the circuit component 9 to the circuit component adhesive surface 15 of the circuit component stem body 1, first, the circuit component is adhered accurately on the circuit component adhesive surface 15. After the position is determined by an optical sensor or the like using the hole 16, the hole 16 is filled with an adhesive 17, and the circuit component 9 is adhered to the circuit component adhesive surface 15 of the circuit component stem. Therefore, the adhesive 17 will not overflow onto the surface of the stem body 1.

As explained above, according to the stem for circuit components of the present invention, since two or more holes are formed on the surface of the stem body, it is possible to not only easily and accurately determine the bonding position of circuit components. Since the hole can be used to fill the hole with adhesive and adhere the circuit component, there is an advantage that the adhesive does not overflow onto the stem surface.

Moreover, since this hole also serves as a stand mounting hole, holes for positioning and adhesive are not purposely provided, so no additional processes are required when manufacturing stems for circuit components. It also has the advantage that it is not required.

Further, as shown in FIGS. 5b and 6b, if the stand mounting hole 14 is made sufficiently large, the insulating material stand 13 can be provided without forming the base part 130, and The durability of the stem can be improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional stem for circuit components;
Fig. 2 is a side view of the circuit component stem connected to the circuit board, Fig. 3 is a sectional view of the vicinity of a conventional glass stand, and Fig. 4 is a perspective view of an embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along the line A-A' in FIG. 4, and FIG. 6 is a cross-sectional view of another embodiment of the stem for circuit components of the present invention. 1... Stem body, 2... Nail pin, 3...
Nail pin insertion hole, 4... Insulating material, 5... Earth wire, 6... Earth sealing hole, 9... Circuit component, 12
...Circuit board, 13...Insulating material stand, 14...
...Stand mounting hole, 15...Circuit component adhesive surface, 1
6...Hole part.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) A nail pin insertion hole and a ground sealing hole are provided in the stem body, which has a circuit component adhesive surface to which a circuit component is attached, and a nail pin is inserted into the nail pin insertion hole, and a nail pin is inserted into the ground sealing hole. Inserting a ground wire into the stem body and sealing them with an insulating material and a conductive material, and drilling an insulating material stand mounting hole in the stem body,
In the circuit component stem in which an insulating material stand is formed that protrudes from the back side of the stem body, two or more are provided on the circuit component adhesion surface of the stem body for positioning the circuit component and further forming an insulating material stand. A stem for a circuit component, characterized in that a stand mounting hole is bored and an insulating material is buried in the stand mounting hole so as to form a hole on the surface of the stem body to form an insulating material stand. (2) The stem for a circuit component according to claim 1, wherein the stand mounting hole has a sufficient diameter to ensure a sufficient height of the stand.