JPH0239368B2 - - Google Patents
Info
- Publication number
- JPH0239368B2 JPH0239368B2 JP56106768A JP10676881A JPH0239368B2 JP H0239368 B2 JPH0239368 B2 JP H0239368B2 JP 56106768 A JP56106768 A JP 56106768A JP 10676881 A JP10676881 A JP 10676881A JP H0239368 B2 JPH0239368 B2 JP H0239368B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity insert
- cavity
- discharge machining
- groove
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56106768A JPS588608A (ja) | 1981-07-08 | 1981-07-08 | 樹脂封止形半導体装置成形用モ−ルド金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56106768A JPS588608A (ja) | 1981-07-08 | 1981-07-08 | 樹脂封止形半導体装置成形用モ−ルド金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS588608A JPS588608A (ja) | 1983-01-18 |
| JPH0239368B2 true JPH0239368B2 (cs) | 1990-09-05 |
Family
ID=14442079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56106768A Granted JPS588608A (ja) | 1981-07-08 | 1981-07-08 | 樹脂封止形半導体装置成形用モ−ルド金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS588608A (cs) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4560138A (en) * | 1983-11-25 | 1985-12-24 | Depuglia Gaston D | Encapsulation mold |
| JP2526754B2 (ja) * | 1991-09-28 | 1996-08-21 | オムロン株式会社 | 電気機器の端子金具インサ―ト部成型方法 |
| US5316463A (en) * | 1992-11-24 | 1994-05-31 | Neu Dynamics Corporation | Encapsulating molding equipment |
| US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
| US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
| CN108161380A (zh) * | 2017-12-04 | 2018-06-15 | 南通斯迈尔精密设备有限公司 | 一种半导体封装模具的型腔加工工艺 |
| CN108608179A (zh) * | 2018-04-12 | 2018-10-02 | 无锡市迈科密精密机械有限公司 | 一种模具加工工艺 |
-
1981
- 1981-07-08 JP JP56106768A patent/JPS588608A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS588608A (ja) | 1983-01-18 |
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