JPH0240879A - Integrated circuit socket - Google Patents

Abstract

PURPOSE:To enable a high density mounting by dividing an IC inserting part to blocks every contact pin, and constituting each block so that it is attachable and removable through a connecting line to a board connecting part. CONSTITUTION:An IC inserting part is formed in a block form, and this IC inserting block is provided with an IC inserting block part 2 self-containing an IC pin contact part 1 and block joining projection parts 3 provided on two side surfaces of the IC inserting block part 2. The IC inserting part is further provided with block joining recessed parts 4 provided on the remaining two side surfaces of the IC inserting block part 2, and a connecting line 5 and contact pin 6 connected to the IC pin contact part 1 which extend to the lower side of the IC inserting block part 2. The necessary pin number of the IC inserting block parts 2 are assembled into one block using the block joining projection parts 3 and block joining recessed parts 4, and the blocks are connected to each other using a connection block 16. Hence, various forms of IC can be mounted.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to integrated circuit sockets.

[Conventional technology]

Traditionally, this type of integrated circuit socket has been designed to accommodate various substrates for one shape, such as DIP (denial in-line package) or LCC (leadless chip carrier), and for 20-pin and 22-pin. It had a structure with a connecting bin.

[Problem to be solved by the invention]

However, the conventional integrated circuit socket described above is
Because it only takes one shape, when it is mounted on a board and used, even if it is an integrated circuit (hereinafter referred to as an IC) with the same number of pins, if you want to insert an IC with a different shape, Even if the IC has a different shape, if you want to insert an IC with a different number of pins, you will have to use a completely different board because sockets for different ICs have different shapes of board connection parts. Moreover, there was a drawback that a socket with a different number of pins had to be remounted on the board.

SUMMARY OF THE INVENTION An object of the present invention has been made in view of the above-mentioned drawbacks, and it is an object of the present invention to provide an integrated circuit socket in which ICs of various shapes can be mounted.

[Means to solve the problem]

In order to achieve the above object, the integrated circuit socket according to the present invention divides the IC insertion part into blocks for each contact pin, and each block can be detachably connected to the board connection part via a connection line. It is composed of

[Effect]

As described above, in the integrated circuit socket of the present invention, the IC insertion part is made in the shape of a block, and by preparing blocks corresponding to various IC shapes and making them replaceable, it is possible to adapt the IC insertion part to a certain board. By mounting such a socket, it becomes possible to mount ICs of various shapes.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1A to 1D are a front view, a side view, a top view, and a bottom view showing an embodiment of an integrated circuit socket according to the present invention. The IC insertion part of this integrated circuit socket is made in the shape of a block, and this IC insertion block has an IC insertion part 1017 part 2 with a built-in IC pin contact part 1, and two sides of this IC insertion part 1017 part 2. The provided block coupling convex portion 3, the block coupling recesses 4 provided on the remaining two sides of the IC insertion 1017 portion 2, and the IC insertion 1017 portion 2 connected to the IC pin contact portion 1.
It is composed of a connecting line 5 and a contact pin 6 extending downwardly. In the case of this embodiment, the IC bin contact section 1 is a DIP (Dual 1n-line)
Package) aZ I P (Zigzagi
n-1ine Package) ・PG A (P
This is for inserting tC such as in grid array).

FIGS. 2A to 2D are a front view, a side view, a top view, and a bottom view showing another embodiment of an integrated circuit socket according to the present invention. This integrated circuit socket also has an IC insertion part made in the shape of a block, and this IC insertion block is
An IC insertion 1077 part 8 with a built-in C pin contact part 7, block coupling convex parts 9 (9a, 9b) provided on two sides of this IC insertion 1077 part 8, and an IC insertion 1
It consists of a block coupling recess lO provided on one side of the 072 part 7, and a connection line 11 and contact pin 12 connected to the IC pin contact part 7 and extending below the IC insertion part 7. In addition, among the block coupling convex parts 9, the block coupling convex part 9a provided on the side facing the block coupling recess 10 is largely provided in the center of this side surface, and the remaining block coupling convex parts 9b are provided on the side surface. It is relatively small and provided on the lower side of the orthogonal sides.

In the case of this embodiment, the IC pin contact portion 7 is an S OJ
(Small outline J-Lead p
ackage) ・PLCC(Plastic 1e
(added chip carrier) etc.
-It is for lead type IC.

Note that the contact pins 6.12 are formed in the same shape in both the first and second embodiments.

FIGS. 3(A) to 3(C) are a front view, a side view, and a plan view showing an embodiment of the board connecting portion of the integrated circuit socket according to the present invention. The board connection part of this embodiment includes a board connection part main body 13, a plurality of board connection pins 14 protruding from the bottom of both ends of the board connection part main body 13, and a plurality of board connection pins 14 provided corresponding to the board connection pins 14. It is composed of a plurality of contact pin connecting parts 15. The contact pin connection portion 15 is configured such that the contact pins 6.12 of the first and second embodiments described above can be inserted just in time.

Next, an application of this embodiment will be explained. Conventionally, the DIP shape was the mainstream for IC packages, so
The mainstream of printed circuit boards and the like on which ICs are mounted is compatible with this DIP. In recent years, IC puff cages have progressed, and packages for high-density mounting, such as packages for surface mounting, have come to be provided. By using printed circuit boards that take advantage of these packages, high-density packaging becomes possible.

However, conventional DIP compatible printed circuit boards do not have this D.
It is not possible to use tCs other than IP.

In addition, when measuring ICs with a tester, etc., the conventional DIP measurement jig cannot measure ICs for high-density mounting, even if the functions are the same but the package shape is different. Even for ICs, the jig had to be remade.

Here, it will be explained that these problems can be solved by the embodiments of the present invention. FIGS. 4(A) to 4(C) are a front view, a side view, and a plan view showing a first application example of the present invention. This application example includes the IC insertion section 1077 2 of the first embodiment shown in FIG. 1, the board connection section main body 13 of FIG.
7 and a connecting block 16 interposed between the parts 2. Assemble the IC insertion 1077 part 2 into one block using the block coupling protrusion 3 and the block coupling recess 4 for the required number of pins, and use the connecting block 16 having similar unevenness between these blocks. Once the blocks are connected, this creates an integrated circuit socket for the DIP. Here, if it becomes necessary to mount a ZIP IC, it can be realized by using the second application example shown in FIG.

FIGS. 5A to 5C are a front view, a side view, and a plan view of the second application example. This application example also uses the IC of the first embodiment.
It is composed of an insertion part 1077 2, a board connection part main body 13, and a connection jig 17 for ZIP. In this application example, as in the first application example, after assembling the blocks of the IC insertion part 1077 2 for the required number of pins, a plurality of these blocks are connected using the connection jig 17 for ZIP. It is used as an integrated circuit socket for ZIP. Now Z
It becomes possible to implement an IP IC.

Moreover, a socket for SOJ can also be implemented.

That is, FIGS. 6(A) to 6(C) are a front view, a side view, and a plan view showing a third application example of the present invention. This third
An example of application is the IC insertion 10 of the second embodiment shown in FIG.
77 part 8, the board connection part main body 13 shown in FIG. 3, and the IC
It is composed of an SOJ connection block 18 interposed between the insertion part 1077 and the SOJ connection block 18. In this application example, as in the first and second application examples, first the IC insertion 1077
After assembling blocks 8 for the required number of pins, the blocks are connected by this SOJ connecting block 18, thereby forming an integrated circuit socket for SOJ.

In this way, by using the integrated circuit socket of the present invention and freely attaching one board connection part main body 13, it is possible to install ICs in various packages by simply rearranging the blocks in the IC insertion part or replacing them with different blocks. It becomes possible to measure.

Furthermore, if the board connecting portion main body 13 is provided with a margin, even ICs with different numbers of pins can be measured.

In addition, in the embodiment shown in FIG. 3 described above, the board connection pin 14
Although the explanation has been made with the shape of DIP, it is not limited to this, and even if it is in the shape of ZIP, it can also be
Of course, it may be a J shape or other types of shapes.

〔Effect of the invention〕

As explained above, the integrated circuit socket according to the present invention has a structure in which the IC insertion part is divided into blocks for each contact pin and can be detachably connected to the board connection part via the connection wire of the IC insertion part. , It has become possible to connect various types of IC packages to boards and tester jigs that were previously compatible with one type of IC package. This eliminates the need to create substrates and measurement jigs for each puff cage, and reduces the number of
Not only can management and the like be reduced, but by mounting such a socket on a certain board, it is possible to mount ICs of various shapes, which is an excellent effect.

[Brief explanation of the drawing]

1A to 1D are front, side, top, and bottom views showing an embodiment of an integrated circuit socket according to the present invention, and FIGS. 2A to 2D are diagrams showing an embodiment of an integrated circuit socket according to the present invention. A front view, a side view, a top view, and a bottom view showing other embodiments of the integrated circuit socket, and FIGS. 3(A) to 3(C) show an embodiment of the board connection part of the integrated circuit socket according to the present invention. 4(A) to (C) are a front view, a side view, and a plan view showing a first application example of the present invention, and FIG.
A) to (C) are front views, side views, and plan views showing the second application example of the present invention, and FIGS. 6A to 6C are front views showing the third application example of the present invention. They are a side view and a top view. 2.8...IC insertion block section, 3.9...
...Block coupling convex portion, 4.10...Block coupling concave portion, 5.11...Connection line, 6.12...Contact pin, 13...・
・Board connection part main body, 14...Board connection pin, 15...Contact pin connection part, 16.18.
... Connection block. Applicant Attorney: NEC Co., Ltd.

Claims (1)

[Claims] Divide the IC insertion section into blocks for each contact pin,
An integrated circuit socket characterized in that each block is configured to be detachably connected to a board connection part via a connection line.