JPH0240940A - Package of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To improve the reliability of glass sealing by interposing a thermal diffusion die plate between a heat sink, and a printed wiring board and a chip. CONSTITUTION:On a heat sink 90, a thermal diffusion die plate 10 is bonded, on which a printed wiring board 82 and a semiconductor chip 81 are individually bonded. A lead pin 92 is inserted through a pin hole 821 of the wiring board 82, a pin hole 11 of the plate 10 and a pin hole 9 of the sink 90. The pin 92 and the wiring board 82 are bonded with solder 31. The pin 92 and the sink 90 are sealed with glass 20, by injecting melted glass in the hole 91 and hardening it. There is no glass sealing 20 between the pin 92 and the pin hole 11 of the plate 10, and some glass permeating part 21 is formed above the pin hole 91 of the sink 90. After the above formation, the upper part of the sink 90 is coverd with a cap 85, and the lower end-edge 851 of the cap 85 and the sink 90 are bonded. By this constitution, the damage of the waring board 82 and the chip 81 caused by the heat of melted glass can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit package with excellent heat dissipation and glass sealing properties.

[Prior art]

In a hybrid integrated circuit package, a heat sink such as an aluminum plate or an iron plate is generally used to improve heat dissipation, and the hybrid integrated circuit package is bonded onto the heat sink.

Furthermore, in order to improve the heat dissipation, a hybrid integrated circuit package having the configuration shown in FIG. 5 has been proposed ("Nikkei Micro Devices J June 1988 issue, No.
page). This package is.

This is called a metal PGA (pin grid array), and is made by die-bonding an LSI chip 81 to an iron plate 90 serving as a heat sink using a hard bonding material 93 and bonding a printed wiring board 82 to it. Further, the back surface of the iron plate 90 is coated with an electrically insulating coat 94.

A lead pin 92 is disposed passing through the pin hole 91 of the iron plate 90 through the pin 6 821 of the printed wiring board 82, and the inside of the pin hole 91 is sealed with a glass seal 98. Also, between the copper wiring 83 on the printed wiring board 82 and the LSI chip 81.

AI! , are connected by a wire 84. and.

On the upper surface of the iron plate 90. The circuits such as the LSI chip 81 are covered with a cap 85 made of iron.

The cap 85 and the iron plate 90 are tightly joined.

[Problem to be solved]

However, in the above-described hybrid integrated circuit pancase, the glass of the glass seal 98 penetrates into the pin 6 821 of the printed wiring board 82 to form an intrusion portion 981, as shown in FIG. This is because the printed wiring board 82 is bonded directly onto the iron plate 90.

If the glass penetrates into the pin six 821 of the printed wiring board 82 in this way, there is a risk that the printed wiring board 82 will be defective due to the heat of the molten glass during glass sealing. Furthermore, if the amount of glass is reduced in order to suppress the molten glass intrusion 981, the sealing performance of the hybrid integrated circuit package becomes insufficient and the moisture resistance decreases.

In view of these conventional problems, the present invention seeks to provide a hybrid integrated circuit package with excellent glass sealing reliability and heat dissipation.

[Means for solving problems]

The present invention involves bonding a heat diffusion die plate onto a heat sink, bonding a printed wiring board and a chip onto the heat diffusion die plate, and penetrating the heat diffusion die plate and the heat sink from the printed wiring board side. A lead pin is provided, and a portion of the bottle is sealed with glass between it and a heat sink.

The hybrid integrated circuit package is characterized in that a cap is disposed on the heat sink to cover the printed wiring board, the chip, etc., and the cap and the heat sink are closely bonded.

In the present invention, a metal plate with good heat conductivity, such as copper, aluminum, iron, or nickel, is used as the heat diffusion die plate. The heat diffusion die plate is.

Usually, it is fixed onto a heat sink via an electrically insulating film.

Then, a printed wiring board and a chip are bonded onto the heat diffusion die plate. In addition, the upper part of these printed wiring boards, etc. is covered with a cap.

The camp is in intimate contact with the heat sink to maintain hermeticity within the hybrid integrated circuit package.

[Action and effect]

In the present invention, a heat diffusion die plate is interposed between the heat sink and the printed wiring board and chip. Therefore, when performing glass sealing between the heat sink and the lead pins, the glass only adheres to the lower side wall of the heat dissipation die plate and does not penetrate into the printed wiring board. Even if the molten glass intrudes toward the printed wiring board during sealing, the molten glass contacts the heat diffusion die plate, absorbs heat and solidifies, and does not intrude further toward the printed wiring board. It is. Moreover, for this reason, sufficient molten glass can be injected to glass-seal the lead pins and the heat sink, and the reliability of the glass-sealing is improved.

In addition, in the present invention, a heat diffusion die plate is used and this is further bonded to a heat sink, so the heat generated from the printed wiring board and chip on the heat diffusion die plate can be efficiently released (dissipated to the heat sink). , excellent heat dissipation.

Therefore, according to the present invention, it is possible to provide a hybrid integrated circuit package that has excellent glass sealing reliability and excellent heat dissipation.

Furthermore, in the present invention, since the upper surface of the heat diffusion die plate can be machined to any desired height and shape, the height of the chip mounting portion can be machined in accordance with the height of the printed wiring board. Therefore.

The top surface positions of the printed wiring board and the chip can be made almost at the same height, and bonding of wires such as 1 and 1 for connecting the two becomes easy.

〔Example〕

A hybrid integrated circuit package according to an embodiment of the present invention will be explained using FIGS. 1 to 4.

The package in this example is made of aluminum heat sink 9.
A heat diffusion die plate 10 made of 0 and 2w4.

It consists of a printed wiring board 82 and a semiconductor chip 81.

A heat diffusion die plate 1O is then bonded onto the heat sink 90 via an electrically insulating epoxy resin film 33. A printed wiring board 82 and a semiconductor chip 81 are similarly bonded onto the heat diffusion die plate 10 via the epoxy resin film 33, respectively.

Further, as shown in an enlarged view in FIG. 2, the lead pin 92 is connected to the pin hole 11 of the heat diffusion die plate 10 through the pin 6 821 of the printed wiring board 82. Pin hole 9 of heat sink 90
1 and insert it. Then, the lead pins 92 and the printed wiring board 82 are joined by solder 31. Further, the lead pins 92 and the heat sink 90 are sealed with glass 20 by injecting molten glass into the bottle holes 91 and solidifying them.

Lead pin 92 and pin hole 11 of heat diffusion die plate 10
There is no glass seal 20 between the heat sink 90 and the heat sink 90, and a slight glass intrusion portion 21 is formed above the pin hole 91 of the heat sink 90.

However, after configuring as described above, the heat sink 90
An aluminum camp 85 is placed above, and the lower edge 851 of the cap 85 and the heat sink 90 are bonded with resin to seal the hybrid integrated circuit.

Moreover, in the heat diffusion die plate 10.

As shown in FIG. 3, a convex portion 15 is provided to make the height of the semiconductor chip 81 almost the same as the height of the printed wiring board 82.

As mentioned above, this example package includes a heat sink 90, a printed wiring board 82. Since the heat diffusion die plate 10 is provided between the semiconductor chip 81 and the heat sink 90, the glass of the glass seal 20 provided between the lead pins 92 and the heat sink 90 does not penetrate into the printed wiring board 82.
Therefore, due to the heat of the molten glass during glass sealing, the printed wiring board 82. The semiconductor chip 81 is not damaged.

Also, as mentioned above, there is no glass intrusion.

Sufficient molten glass can be injected for glass sealing between the lead pins 92 and the heat sink 90, and the reliability of the glass sealing is improved.

Further, since the package of this example uses the heat diffusion die plate 10, the heat generated from the printed wiring board and the semiconductor chip can be efficiently released to the heat sink 90.

In addition, since the heat diffusion die plate 10 is provided on the heat sink 90, its upper surface can be arbitrarily processed into any shape, and the height of the semiconductor chip mounting portion can be adjusted to adjust the height with respect to the printed wiring board. You can also set it to a high value in advance.

Note that on the upper side, the convex portion 15 was provided on the heat diffusion die plate 10 (third time), but when the height of the semiconductor chip 81 is almost the same as the printed wiring board 82 as shown in FIG. , there is no particular need to provide the above-mentioned convex portion.

[Brief explanation of the drawing]

Figures 1 to 4 show a hybrid integrated circuit package according to an embodiment. Figure 1 is a front cross-sectional view of the whole, Figure 2 is an enlarged view of the glass sealing part, and Figures 3 and 4 are mounted with semiconductor chips. FIGS. 5 and 6 show a conventional example, FIG. 5 is a partial front sectional view thereof, and FIG. 6 is an enlarged view of the glass sealing portion. 11 ・ 20 ・ 33 ・ 81 ・ 82 ・ 90 ・ 91 ・ 92 ・ Pin hole. Glass sealed. Epoxy resin membrane. semiconductor chip. Printed wiring board heat sink. pin hole. lead pin.

Claims (1)

[Claims] A heat diffusion die plate is bonded onto the heat sink, a printed wiring board and a chip are bonded onto the heat diffusion die plate, and lead pins are provided by penetrating the heat diffusion die plate and the heat sink from the printed wiring board side. death,
Further, the lead pin is sealed with glass between the heat sink, and a cap is disposed on the heat sink to cover the printed wiring board, the chip, etc., and the cap and the heat sink are closely bonded. Hybrid integrated circuit package.