JPH0241364Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a component fixing device for fixing components using what is called an outsert molding, in which a synthetic resin is directly molded onto a metal substrate.

[Technical background of the invention and its problems]

Conventionally, there has been a component fixing device of this type using an outsert molding as shown in FIG. In the figure, 1a is a hole formed in the metal substrate, 1 is a metal substrate, and 2 is a component fixing device formed directly on the periphery of the hole 1a of the metal substrate 1, which holds the metal substrate 1. A fixing part 3 for fixing the device main body 2, a rising part 4 formed on the fixing part 3, a claw part 5 formed at the tip of the rising part 4, and a claw part 5 formed at the center of the fixing part 3. It consists of an opening 6.

To manufacture this component fixing device, first, a predetermined hole 1a is formed in the metal substrate 1. Next, molds are set on the upper and lower surfaces of the metal substrate 1 in order to form the fixing device 2 on the same edge of the predetermined hole 1a. A synthetic resin is injected into this mold and molded into the shape of a predetermined component device.

Next, the operation of this component fixing device will be explained.

A plate-shaped component 7 is lowered from above the component fixing device 2 formed on the metal substrate 1 and brought into contact with the claw portion 5. At this time, the claw part 5 escapes in the direction of arrow A due to the elasticity of the rising part 4, and when the plate-shaped part 7 is further pushed in, the engagement between the plate-shaped part 7 and the claw part 5 is released.
The claw portion 5 returns to its initial state due to the falling of the rising portion 4. By this operation, the plate-shaped component 7 is interposed between the fixing part 3 and the claw part 5, and is clamped and fixed by the fixing part 3 and the claw part 5.

However, in the conventional component fixing device, since the elasticity of the rising portion was used to provide relief for the claw portion, the length of the rising portion was required to be longer than a certain certain value.

That is, when the length of the rising portion is short, sufficient clearance of the claw portion cannot be obtained, and a load is applied to the joint between the rising portion and the fixing portion, which may cause damage to the rising portion.

Furthermore, as electronic devices tend to become thinner and smaller, component fixing devices having rising portions that require a certain length are not suitable.

Furthermore, since the elasticity of the rising portion was utilized, it was not suitable for fixing heavy parts.

[Purpose of invention]

The present invention was developed to eliminate the drawbacks of the conventional devices as described above, and the device is made smaller by sliding the component fixing device itself and letting the claws escape without using the elasticity of the rising portion. The purpose of the present invention is to provide a component fixing device that can be made thinner.

[Summary of the idea]

In the present invention, a component fixing device is formed in a hole of a metal substrate by outsert molding so as to be slidable along the hole, and the component can be fixed by the sliding operation of the component fixing device itself.

[Example of idea]

An embodiment of the present invention will be described based on FIGS. 1 to 4. FIG. 1 is a diagram showing a state in which a component is fixed by a component fixing device according to an embodiment of the present invention, FIG. 2 is a diagram showing a state in which the component is molded on a metal substrate, and FIG. 2 is a sectional view taken along line A-A in FIG. 2, and FIG. 4 is a sectional view of the completed component fixing device.

Note that the same members as in FIG. 5 are indicated by the same symbols.

In order to form the component fixing device 2, molds are placed on the upper and lower surfaces of the hole 1a of the metal substrate 1, and synthetic resin is injected and molded.

Immediately after being formed into the metal substrate 1, the state is as shown in FIG. A component fixing device 2 and a slide forming portion 8 are formed in the hole 1a of the metal substrate 1.
The component fixing device 2 includes collar portions 3a and 3b formed to clamp the upper and lower surfaces of the periphery of the hole 14.
, a rising portion 4, a claw portion 5 for preventing the component from coming off upward, and a protrusion 1 for fixing the fixing device 2 in a predetermined position when the fixing device 2 is slid.
It is composed of 1.

Further, the slide forming portion 8 is formed with a thin wall portion 9 connected to the component fixing device 2, and a pin 10 located at the center of the slide forming portion 8 and protruding upward. Note that the slide forming portion 8 is not formed with the collar portions 3a and 3b. Further, a stopper 12 is formed on the metal substrate 1 so that the component fixing device 2 can be stopped at a predetermined position when it slides. The stopper 12 includes a stopper fixing portion 12a and a protrusion 11 of the component fixing device 2.
and an engaging portion 12b that engages with the engaging portion 12b.

Next, a procedure for creating a slidable component fixing device of the present invention from a component fixing device, a slide forming part, and a stopper molded by such a mold, fixing a component with the completed component fixing device, and A series of operations in which the component fixing device is fixed at a predetermined position by the stopper will be explained.

First, in order to create a slidable component fixing device, the pin 10 of the slide forming part 8 shown in FIG. 3 is pushed downward (in the direction of arrow B). At this time, since the slide forming portion 8 does not have a collar portion formed therein, the slide forming portion 8 bends downward with the thin wall portion 9 as the center of rotation. If it is bent further downward, the thin part 9
The slide forming part 8 and component fixing device 2 are separated, and as shown in FIG.
can be slid along the periphery of the

In order to fix the plate-shaped component 7 to the slidable component fixing device 2 in this way, the component fixing device 2 is placed on standby at the rear position, and the component 7 is placed at a predetermined position.
Thereafter, the component fixing device 2 is slid forward and fixed. At this time, the component fixing device 2 itself is
and the engaging portion 12b of the stopper 12, thereby fixing the plate-shaped component in the state shown in FIG.

[Effect of idea]

As described above, according to the present invention, since the component fixing device itself is formed to be slidable, the component fixing device itself can be made smaller and thinner.

Furthermore, if a fixing means such as a screw is used as the stopper means, heavy parts can also be fixed.

[Brief explanation of the drawing]

Fig. 1 shows an embodiment of the present invention; Fig. 2;
3 and 4 are diagrams showing the production procedure of an embodiment of the present invention, and FIG. 5 is a diagram showing a conventional example. 1...Metal plate, 2...Component fixing device, 1a...
Hole, 3...Fixing part, 3a, 3b...Brim part, 4...
...Rise part, 5...Claw part, 12...Stopper.

Claims (1)

[Scope of utility model registration request] A component fixing device molded from synthetic resin into a hole formed in a metal substrate, which includes a collar portion that clamps the periphery of the hole, and a fixing member that is slidable by the collar portion. a rising portion protruding from the upper surface of the fixing portion; a claw portion formed at the tip of the rising portion for locking a component to be fixed; and a stopper means for stopping the fixing portion at a predetermined position. A component fixing device characterized by comprising: