JPH0241446U - - Google Patents

Info

Publication number
JPH0241446U
JPH0241446U JP1988120506U JP12050688U JPH0241446U JP H0241446 U JPH0241446 U JP H0241446U JP 1988120506 U JP1988120506 U JP 1988120506U JP 12050688 U JP12050688 U JP 12050688U JP H0241446 U JPH0241446 U JP H0241446U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed
lead frame
frame assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988120506U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988120506U priority Critical patent/JPH0241446U/ja
Publication of JPH0241446U publication Critical patent/JPH0241446U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案の樹脂封止型半導体装置の製
造工程を説明するための断面図、第１図ｂは本考
案の樹脂封止型半導体装置の平面図、第２図は本
考案の他の変形例を示し、同図ａは、その断面図
、同図ｂは、その平面図、第３図ａ，ｂは本考案
のさらに他の変形例をそれぞれ示す部分断面図、
第４図は、従来の樹脂封止型半導体装置に製造工
程を説明するための断面図である。 １…リード、２…チツプ載置部、３…半導体チ
ツプ、４…金属細線、５…立上り部、６…水平支
持部、７…取付穴、８…リードフレーム、９…樹
脂封止用金型、１０…上金型、１１…下金型、１
２，１６，１７…樹脂封止部、１３…取付穴、１
４…取付穴用凸部、１５ａ，１５ｂ…凸部、１６
…キヤビテイ、１９，２０，２２，２３…凹部、
２１…切欠部。 FIG. 1a is a cross-sectional view for explaining the manufacturing process of the resin-sealed semiconductor device of the present invention, FIG. 1b is a plan view of the resin-sealed semiconductor device of the present invention, and FIG. 3A is a sectional view thereof, FIG. 3B is a plan view thereof, and FIGS. 3A and 3B are partial sectional views each showing still another modification of the present invention,
FIG. 4 is a cross-sectional view for explaining the manufacturing process of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1...Lead, 2...Chip placement part, 3...Semiconductor chip, 4...Metal thin wire, 5...Rising part, 6...Horizontal support part, 7...Mounting hole, 8...Lead frame, 9...Mold for resin sealing , 10...upper mold, 11...lower mold, 1
2, 16, 17...Resin sealing part, 13...Mounting hole, 1
4...Protrusion for mounting hole, 15a, 15b...Protrusion, 16
...Cavity, 19, 20, 22, 23...Recess,
21...Notch.

Claims (1)

【実用新案登録請求の範囲】 １ 半導体チツプ載置部を有し、このチツプ載置
部から一方の側へ外部リードが延在し、他方の側
へは前記チツプ載置部から上方への立上り部が形
成され、この立上り部からさらに前記チツプ載置
部に平行に延びる水平支持部を備えたリードフレ
ーム組立体と、このリードフレーム組立体を樹脂
封止用金型のキヤビテイ内に水平かつ空間的に支
持するために、前記リードフレーム組立体の水平
支持部の両面に当接させる前記金型に設けた凸部
によつて形成された凹部を有するとを備えたこと
を特徴とする樹脂封止型半導体装置。 ２ 前記樹脂封止部に形成された凹部は、一対の
小孔であることを特徴とする第１請求項に記載の
樹脂封止型半導体装置。 ３ 前記樹脂封止部に形成された凹部は、表面か
ら内部に向つて縮径する円錐形状であることを特
徴とする第２請求項に記載の樹脂封止型半導体装
置。 ４ 前記樹脂封止部に形成された凹部は、底面が
半球状であることを特徴とする第２請求項に記載
の樹脂封止型半導体装置。 ５ 前記樹脂封止部に形成された凹部は、一方が
小孔であり、他方が前記樹脂封止部の角に形成さ
れた切欠部であることを特徴とする第１請求項に
記載の樹脂封止型半導体装置。[Claims for Utility Model Registration] 1. A device having a semiconductor chip mounting portion, with external leads extending from the chip mounting portion to one side, and external leads extending upward from the chip mounting portion to the other side. A lead frame assembly is provided with a horizontal support portion formed with a horizontal supporting portion extending parallel to the chip mounting portion from the rising portion, and the lead frame assembly is placed horizontally and in a space within a cavity of a mold for resin sealing. and a recess formed by a projection provided in the mold that is brought into contact with both sides of the horizontal support portion of the lead frame assembly to support the lead frame assembly. Stop type semiconductor device. 2. The resin-sealed semiconductor device according to claim 1, wherein the recess formed in the resin-sealed portion is a pair of small holes. 3. The resin-sealed semiconductor device according to claim 2, wherein the recess formed in the resin-sealed portion has a conical shape whose diameter decreases from the surface toward the inside. 4. The resin-sealed semiconductor device according to claim 2, wherein the recess formed in the resin-sealed portion has a hemispherical bottom surface. 5. The resin according to claim 1, wherein one of the recesses formed in the resin sealing part is a small hole and the other is a notch formed at a corner of the resin sealing part. Sealed semiconductor device.
JP1988120506U 1988-09-14 1988-09-14 Pending JPH0241446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988120506U JPH0241446U (en) 1988-09-14 1988-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988120506U JPH0241446U (en) 1988-09-14 1988-09-14

Publications (1)

Publication Number Publication Date
JPH0241446U true JPH0241446U (en) 1990-03-22

Family

ID=31366677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988120506U Pending JPH0241446U (en) 1988-09-14 1988-09-14

Country Status (1)

Country Link
JP (1) JPH0241446U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162550A (en) * 1990-10-26 1992-06-08 Nec Corp Resin-sealed semiconductor device and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132434A (en) * 1984-07-24 1986-02-15 Sanken Electric Co Ltd Manufacture of resin molded semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132434A (en) * 1984-07-24 1986-02-15 Sanken Electric Co Ltd Manufacture of resin molded semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162550A (en) * 1990-10-26 1992-06-08 Nec Corp Resin-sealed semiconductor device and manufacture thereof

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