JPH0241497Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field This invention is applicable to, for example, thyristors, diodes,
The present invention relates to a heat exchanger used for cooling semiconductor devices such as transistors.

BACKGROUND TECHNOLOGY In a conventional semiconductor device cooling device, a tank section containing a refrigerant and a heat dissipation section equipped with a refrigerant flow pipe and heat dissipation fins are made separately, and these are combined and welded together, and the heat dissipation section is made separately. An air reservoir section was welded to the upper end of the section (see, for example, Japanese Patent Application Laid-open No. 152150/1983).

Although it is not a semiconductor device cooling device, this type of multi-plate heat exchanger conventionally has vertically elongated flat hollow bodies composed of upper and lower plates arranged in parallel.
A heat exchanger is already known in which adjacent flat hollow bodies are connected in communication with each other with a ring interposed at the lower end thereof (see, for example, Japanese Utility Model Application Publication No. 58-52478).

Problems that the invention aims to solve However, in the former type of conventional semiconductor device cooling device, the tank part and the heat dissipation part are made separately, which requires a very large number of man-hours, which makes manufacturing the device time-consuming and costly. was expensive. Furthermore, since a tank section and a heat dissipation section that are separate from each other are combined, there are problems in that the cooling performance is poor and the device becomes large and requires a large installation space.

In addition, in the latter multi-plate heat exchanger, rising walls are provided at the peripheral edges of the upper and lower plates that make up the vertically long flat hollow body, and the rising walls of the upper and lower plates are partially overlapped (overlapping). Because they were joined together, it was difficult to form the upper and lower plates, and sealing was difficult because the rising walls had to be in close contact with each other around the entire circumference of the flat hollow body.
There was a problem that sealing defects were likely to occur.

The purpose of this invention is to solve the problems of the prior art described above, and to develop a semiconductor that is extremely compact, has excellent cooling performance, can be manufactured extremely easily and inexpensively, and is unlikely to cause sealing defects. The present invention aims to provide a heat exchanger for use in device cooling devices and the like.

Means for Solving the Problems In order to achieve the above object, the present invention includes a plurality of vertically long flat hollow bodies, a pair of vertically long side plates having holes at their lower ends, and both left and right pipes. The flat hollow bodies and side plates are arranged in parallel with the side plates on the left and right sides, and all flat hollow bodies and side plates are connected to adjacent flat hollow bodies and flat hollow bodies. The body and the side plate are connected in communication with each other with a ring interposed at the lower end thereof, and above the ring are adjacent flat hollow bodies, and a heat dissipation fin is provided between the flat hollow body and the side plate. In the interposed heat exchanger, a flat hollow body has a hole at the lower end and a pair of vertically long flat plates arranged opposite to each other, and a peripheral edge of both flat plates, or an upper part of the peripheral edge. The flat plate is made of a thin brazing sheet with brazing metal layers on both sides of the core plate, and the side plate is made of a thin brazing sheet with a brazing metal layer on both sides of the core plate. is made of a thick brazing sheet with a brazing metal layer on both sides of the core plate, which is thicker than the core plate of the flat plate, and the peripheral edge of the hole at the lower end of this is made on the outer surface of each side plate. An exterior plate made of a thin plate is placed over the side plate so that the outer edge of the hole at the lower end of the side plate is covered with a part of the brazing metal layer. An insertion part was provided that fit into the hole at the lower end of the plate, and a bulge was provided that bulged outward along the insertion part, so that the insertion part of each pipe was inserted into the hole at the lower end of the side plate. In this state, the heat exchanger is such that the bulging portion of each pipe is joined to the side plate via a brazing material layer at the periphery of the hole.

Function According to the above heat exchanger, the flat hollow body is constituted by a pair of vertically long flat plates having holes at the lower ends, and a connecting wall arranged between the edges of both flat plates. Therefore, the shapes of the plate and the connecting wall are simple, and in particular, the plate only needs to be processed by drilling holes in a flat object, so there is no need for conventional press processing.

Furthermore, since the pair of flat plates are made of brazing sheets and the connecting walls are arranged and brazed to their edges, the edges of the flat plates and the connecting walls as a whole are in close contact with each other. Therefore, sealing defects are less likely to occur.

In addition, both the left and right side plates are each made of a brazing sheet, and a part of the brazing metal layer is exposed on the outer surface of the hole periphery at the lower end of these plates. - When inserted into the hole at the bottom end of the plate, the bulging part of each pipe is joined to the hole periphery of the side plate via the brazing material layer, so the flat plate of the heat exchanger, Components consisting of connecting walls, side plates and pipes,
They can be sequentially combined in a stacked state and brazed together, for example, by vacuum brazing, making it possible to manufacture the heat exchanger extremely easily and at low cost.

Of course, for example, since the tank section housing the semiconductor element and the heat radiation section are provided integrally, the heat exchanger is very compact and has excellent cooling performance.

In addition, the outer surface of each side plate made of brazing sheets is covered with a thin outer plate, excluding the periphery of the hole at the lower end of the side plate, so the heat exchanger has a very good appearance. It's beautiful.

Embodiment Next, an embodiment of this invention will be described based on the drawings.

Note that the embodiment shows a case where the heat exchanger according to this invention is applied to a semiconductor device cooling device.

In this specification, up and down, right and left, and front and rear refer to Figure 1, and upper means the upper side of Figure 1, and lower means the lower side of Figure 1. Left means the left side of the same figure, and right means the right side of the same figure. "Front" means the front side of the same drawing sheet, and "back" means the back side of the drawing sheet.

In the drawings, reference numeral 1 denotes a semiconductor device cooling device, which includes a tank section 2 that accommodates a liquid refrigerant 4 and immerses the semiconductor device in the liquid refrigerant, and a heat radiation section 3 that condenses the gaseous refrigerant evaporated from the tank section 2. , and the air reservoir section 10 are integrally formed.

5 is a large number of flat hollow bodies arranged in parallel,
Each flat hollow body 5 consists of a pair of vertically elongated substantially rectangular flat plates 6 arranged to face each other, and a substantially rectangular annular connecting wall 7 arranged between the peripheral edges of both flat plates 6. It is structured accordingly. A slightly vertically elongated substantially rectangular hole 8 is bored at the lower end of each flat plate 6 to form the refrigerant storage tank portion 2, and a horizontally long hole 8 is formed at the upper end of the plate to form an air reservoir portion 10. A substantially rectangular hole 9 is bored. An internal fin 11 having a corrugated horizontal cross section is disposed between the holes 8 and 9 and between the flat plates 6 .

Reference numeral 12 denotes a pair of vertically elongated substantially rectangular side plates, which are arranged on both left and right outer sides of the flat hollow body 5. At the lower end of each side plate 12, there is a circular side plate for forming the tank part 2. A hole 13 is made.

Here, a pair of flat plates 6 of each flat hollow body 5
is made of a thin brazing sheet 16 with a brazing material layer 18 on both sides of a core plate 17, and a pair of left and right side plates 12 are formed on both sides of a core plate 23 which is thicker than the core plate 17 of the flat plate 6. Thick brazing sheet 2 with filler metal layer 24
It is made by 2.

Reference numeral 14 denotes a lower ring interposed between the adjacent flat hollow bodies 5 and the lower end portion between the flat hollow body 5 and the side plate 12 so as to surround the holes 8 and 13, which form the tank part 2. It is for the purpose of 15 is also a flat hollow body 5 comrades,
and an upper ring interposed at the upper end between the flat hollow body 5 and the side plate 12 so as to surround the hole 9, which is for forming an air reservoir 10.

Reference numeral 19 denotes an external heat dissipation fin with a corrugated vertical cross section, which is interposed between the adjacent flat hollow bodies 5 between the lower ring 14 and the upper ring 15 and between the flat hollow bodies 5 and the side plate 12, and 20 denotes both left and right side plates. A pair of pipes are connected to the hole 13 at the lower end of 12, and 21 are on both left and right sides.
This is an exterior plate made of a thin plate that covers the outer surface of the plate 12, and protects the outer surface of the side plate 12 made of the brazing sheet 22.

A thin insertion portion 25 is provided at each inner end portion of both the left and right pipes 20, and a bulge portion 26 is provided along the insertion portion 25. Flanges 27 are attached to the outer ends of both pipes 20, and lids 28 are fitted over them.

The tank part 2 has a pair of left and right parts having inner parts of the lower holes 8 of all the flat hollow bodies 5, a lower ring 14 between the flat hollow bodies 5 and between the flat hollow bodies 5 and the side plate 12, and a lid 28. The space is formed by the pipe 20.

The heat dissipation section 3 includes a gaseous refrigerant condensing section 40 that is connected to the intermediate portion of the upper and lower holes 8 and 9 in all the flat hollow bodies 5, that is, the tank section 2 and the air reservoir section 10, and contains an internal fin 11, and a heat dissipation fin. 19 and a ventilation gap 29.

The air reservoir portion 10 is constituted by a space formed by the inner portions of the upper holes 9 of all the flat hollow bodies 5, the flat hollow bodies 5, and the upper ends of the flat hollow bodies 5 and the side plates 12. has been done.

30 is a semiconductor element such as a transistor immersed in the refrigerant in the tank portion 2, and 31 is a cooling fin, which are alternately stacked in layers and held in a horizontal state by appropriate means (not shown). Reference numeral 32 denotes an electric wire for supplying power to the semiconductor element 30, and both ends of this wire pass through the right lid 28 and are taken out to the outside. 33 is an insulating material filled in the portion of the lid 28 through which the electric wire passes.

34 is the right side plate 12 of the cooling device 1
This is a thin conduit connected to the upper end so as to communicate with the air reservoir 10. The refrigerant 4 is first supplied through this conduit 34, and air, etc. is sucked and removed through the conduit 34 to reduce the pressure inside the cooling device 1. be done. 3
Reference numeral 5 denotes a thick L-shaped tube connected to the upper end of the right side plate 12 so as to communicate with the air reservoir section 10, and the tip of this tube is connected to the upper end of the right side plate 12 to communicate with the air reservoir section 10. A safety device 36 is installed. Reference numeral 37 designates a pair of duct connection members having a U-shaped cross section attached to the front and rear sides of the heat dissipation unit 3 so as to surround the same, and reference numeral 38 designates a pair of left and right mounting legs provided at the lower end of the cooling device 1.

The semiconductor device cooling device 1 is manufactured, for example, as follows.

As shown in FIG.
, upper and lower rings 14, 15 and heat dissipation fins 19
Then, the pair of flat plates 6 to constitute the flat hollow body 5, the connecting wall 7, and the internal fins 11 are combined in order in a laminated manner. Left and right side plates 1
An exterior plate 21 is superimposed on the outer surface of both side plates 12, and the insertion portions 25 of the pipes 20 are inserted into the holes 13 at the lower ends of both side plates 12, respectively. Then, in this assembled state, all the members are simultaneously joined by, for example, vacuum brazing.

Here, the flat plate 6 and the pair of left and right side plates 12 of each flat hollow body 5 are both made of aluminum brazing sheets 16, 22, but all other members are made of aluminum bare material. ing.

The brazing sheet 22 constituting the side plate 12 is made of a thick core plate 23 with a thickness of about 4.5 mm, for example, and a brazing material layer 24 provided on both sides thereof, and therefore has very high strength. On the other hand, the brazing sheet 16 constituting the flat plate 6 of the flat hollow body 5 has a thickness of, for example, 1.0 to 1.2
A brazing filler metal layer 18 is provided on both sides of a core plate 17 that is as thin as about mm.

The cladding ratio of the brazing material layer 24 of the side plate 12, that is, the adhesion ratio of the brazing material of the brazing material layer 24 to the core plate 23, is made smaller than the cladding percentage of the brazing material layer 18 of the flat plate 6.

This is because the core plate 1 of both flat plates 6 and 12
Since the thicknesses of 7 and 23 are extremely different, if the cladding ratio of the brazing metal layer 24 of the side plate 12 is the same as the cladding ratio of the brazing metal layer 18 of the flat plate 6, there will be an excessive amount of brazing metal in the side plate 12. This is because when the brazing material melts during vacuum brazing, the thin heat dissipating fins 19 are melted by the brazing material, resulting in poor bonding.

The cladding ratio of the brazing material layer 24 of the side plate 12 is preferably 50% or less of the cladding percentage of the brazing material layer 18 of the flat plate 6.

In the semiconductor device cooling device 1 having the above configuration, when heat is generated from the semiconductor device 30 immersed in the liquid refrigerant 4 in the tank portion 2, this heat is quickly transferred to the refrigerant 4 through the cooling fins 31, and the refrigerant 4
is evaporated. The vapor of the refrigerant 4 is transferred to the tank section 2.
It rises inside the upper flat hollow body 5 and reaches the heat radiating section 3, where it is exchanged with air via the internal fins 11, the flat plate 6, and the external heat radiating fins 19, and radiates heat. As a result, the refrigerant 4 condenses, and after condensing, it flows down inside the flat hollow body 5 as droplets and returns to the tank section 2 . Then, such action of the coolant 4 is repeated to cool the semiconductor element 30.

In the above embodiment, the air reservoir 10 is integrally provided at the upper end of the flat hollow body 5, but such an air reservoir 10 is provided separately above the flat hollow body 5. You can. In that case, the peripheral edges of the pair of opposing flat plates 6 except for the upper edges are connected to each other via the connecting wall 7, and the upper ends communicate with the air reservoir 10. In some cases, the air reservoir 1
0 may be omitted.

The shapes of the flat plate 6 and the side plates 12 are not limited to the substantially rectangular shape as in the embodiment, but may of course be other shapes.

Although the above embodiment shows a case in which this invention is applied to a semiconductor device cooling device, this invention can be similarly applied to other heat exchangers.

Although the semiconductor device cooling device of the above embodiment is made of aluminum, it may also be made of copper or other metal.

Effects of the invention As mentioned above, this invention includes a plurality of vertically long flat hollow bodies, a pair of vertically long side plates having holes at their lower ends, and left and right pipes. The side plates are arranged in parallel with the side plates on both the left and right sides, and all the flat hollow bodies and side plates are connected to adjacent flat hollow bodies and between the flat hollow bodies and the side plates. A heat exchanger in which flat hollow bodies are connected in communication with each other with a ring interposed at the lower end thereof, and a heat radiation fin is interposed between adjacent flat hollow bodies above the rings, and the flat hollow body and the side plate. , a pair of vertically long flat plates each having a flat hollow body having a hole at the lower end and arranged opposite to each other; Because it is composed of a connecting wall placed between them, the shape of the plate and the connecting wall is simple, and in particular, the plate only needs to be processed by drilling a hole in a flat object, so it can be Press processing becomes unnecessary.

Furthermore, since the pair of flat plates are made of brazing sheets and the connecting walls are arranged and brazed to their edges, the edges of the flat plates and the connecting walls as a whole are in close contact with each other. Therefore, sealing defects are less likely to occur.

Further, the flat plate is made of a thin brazing sheet with a brazing metal layer on both sides of the core plate, and the side plate has a brazing metal layer on both sides of the core plate, which is thicker than the core plate of the flat plate. The outer surface of each side plate is covered with a thin outer plate excluding the periphery of the hole at the lower end of the side plate. A part of the brazing metal layer is exposed on the outer surface of the periphery,
On the other hand, an insertion part that fits into the hole at the lower end of the side plate is provided at the inner end of each of the left and right pipes, and a bulge part that bulges outward along the insertion part is provided. When the insertion portion of the pipe is inserted into the hole at the lower end of the side plate, the bulging portion of each pipe is joined to the side plate via the brazing material layer around the hole. , heat exchanger components consisting of flat plates, connecting walls, side plates and pipes are assembled in a stacked state in order,
For example, the heat exchanger can be brazed all at once using a vacuum brazing method, and therefore the heat exchanger can be manufactured very easily and at low cost.

Of course, in the heat exchanger according to this invention, for example, the tank part that houses the semiconductor elements and the heat radiation part are integrated, so the heat exchanger is very compact, requires only a small installation space, and has excellent cooling performance. is excellent.

In addition, the outer surface of each side plate made of brazing sheets is covered with a thin outer plate, excluding the periphery of the hole at the lower end of the side plate, so the heat exchanger has a very good appearance. It has the effect of being beautiful.

[Brief explanation of the drawing]

The drawings show an embodiment of the invention, in which Fig. 1 is a partially cutaway front view of the product of the invention, Fig. 2 is a side view of the same, Fig. 3 is a sectional view taken along the line of Fig. 1, and Fig. 4
The figure is a sectional view along the line of Figure 1, and Figure 5 is a cross-sectional view along the line of Figure 1.
FIG. 6 is an enlarged sectional view taken along the line of FIG. 6, and FIG. 6 is an exploded perspective view. 1... Semiconductor element cooling device (heat exchanger), 2...
...Tank part, 3... Heat dissipation part, 5... Flat hollow body,
6... Flat plate, 7... Connecting wall, 8... Lower hole, 9... Upper hole, 10... Air reservoir, 11...
...Internal fin, 12...Side plate, 13
... hole, 14 ... ring, 16 ... thin brazing sheet, 17 ... thin core plate, 18 ... brazing metal layer, 19 ... heat radiation fin, 20 ... pipe,
21...exterior board, 22...thick brazing/
Sheet, 23... Thick core plate, 24... Brazing metal layer,
25... Insertion part, 26... Swelling part, 29... Ventilation gap part, 30... Semiconductor element, 40... Gaseous refrigerant condensing part.

Claims (1)

[Scope of utility model registration request] A plurality of vertically elongated flat hollow bodies 5 and a hole 1 at the lower end.
A pair of vertically elongated side plates 12 having 3
and both left and right pipes 20, the flat hollow body 5 and the side plate 12 are arranged in parallel with the side plate 12 on both the left and right outside,
All flat hollow bodies 5 and side plates 1
2 are connected in communication with each other with a ring 14 interposed between the adjacent flat hollow bodies 5 and the lower end between the flat hollow body 5 and the side plate 12, and above the ring 14, the adjacent flat hollow bodies 5 In a heat exchanger in which heat radiation fins 19 are interposed between the hollow bodies 5 and the flat hollow bodies 5 and the side plate 12, the flat hollow bodies 5 have holes 8 at their lower ends and are arranged opposite to each other. a pair of vertically long flat plates 6 and the peripheral edges of both flat plates 6,
Alternatively, the flat plate 6 has a brazing material layer 18 on both sides of the core plate 17.
The side plate 12 is made of a thick brazing sheet 22 having a brazing material layer 24 on both sides of a core plate 23 that is thicker than the core plate 17 of the flat plate 6. A hole 1 is formed on the outer surface of each side plate 12 at the lower end thereof.
Exterior plate 21 made of a thin plate excluding the peripheral edge of No. 3
A part of the brazing material layer 24 is exposed on the outer surface of the peripheral edge of the hole 13 at the lower end of the side plate 12, and the lower end of the side plate 12 is covered at the inner end of the left and right pipes 20, respectively. An insertion portion 25 that fits into the hole 13 is provided, and a bulging portion 26 that bulges outward along the insertion portion 25 is provided.
is provided, and when the insertion portion 25 of each pipe 20 is inserted into the hole 13 at the lower end of the side plate 12, the bulging portion 26 of each pipe 20 is inserted through the brazing material layer 24 at the peripheral edge of the hole 13. a heat exchanger, which is joined to the side plate 12 by means of a heat exchanger;