JPH0241591B2 - - Google Patents

Info

Publication number
JPH0241591B2
JPH0241591B2 JP57055120A JP5512082A JPH0241591B2 JP H0241591 B2 JPH0241591 B2 JP H0241591B2 JP 57055120 A JP57055120 A JP 57055120A JP 5512082 A JP5512082 A JP 5512082A JP H0241591 B2 JPH0241591 B2 JP H0241591B2
Authority
JP
Japan
Prior art keywords
alloy
layer
plating
wire
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57055120A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58181888A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57055120A priority Critical patent/JPS58181888A/ja
Publication of JPS58181888A publication Critical patent/JPS58181888A/ja
Publication of JPH0241591B2 publication Critical patent/JPH0241591B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57055120A 1982-04-02 1982-04-02 銀被覆材料とその製造方法 Granted JPS58181888A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57055120A JPS58181888A (ja) 1982-04-02 1982-04-02 銀被覆材料とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57055120A JPS58181888A (ja) 1982-04-02 1982-04-02 銀被覆材料とその製造方法

Publications (2)

Publication Number Publication Date
JPS58181888A JPS58181888A (ja) 1983-10-24
JPH0241591B2 true JPH0241591B2 (it) 1990-09-18

Family

ID=12989891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57055120A Granted JPS58181888A (ja) 1982-04-02 1982-04-02 銀被覆材料とその製造方法

Country Status (1)

Country Link
JP (1) JPS58181888A (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062341A1 (en) * 1999-04-08 2000-10-19 Shinko Electric Industries Co., Ltd. Lead frame for semiconductor device
CN115210409A (zh) * 2020-03-09 2022-10-18 同和金属技术有限公司 镀银材料及其制造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601853A (ja) * 1983-06-17 1985-01-08 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JPS60201651A (ja) * 1984-03-26 1985-10-12 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JP2009079250A (ja) * 2007-09-26 2009-04-16 Dowa Metaltech Kk 最表層として銀合金層が形成された銅または銅合金部材およびその製造方法
JP5879093B2 (ja) * 2011-10-26 2016-03-08 株式会社フジクラ コネクタの製造方法及び銀のめっき方法
JP5767662B2 (ja) * 2013-02-24 2015-08-19 古河電気工業株式会社 端子材とその製造方法およびそれを用いる端子の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062341A1 (en) * 1999-04-08 2000-10-19 Shinko Electric Industries Co., Ltd. Lead frame for semiconductor device
CN115210409A (zh) * 2020-03-09 2022-10-18 同和金属技术有限公司 镀银材料及其制造方法

Also Published As

Publication number Publication date
JPS58181888A (ja) 1983-10-24

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