JPH0241796A - Manufacture of solder ball carrier and its apparatus - Google Patents

Abstract

PURPOSE:To uniformly and in a lump form many fine solder bumps on a high density connecting pad part of a semiconductor device by dipping a sheet in molten solder to forcibly feed, shape, cool and solidify the solder into through holes prepared on the sheet. CONSTITUTION:Fine conical through holes 1A are made in the sheet 1 of stainless steel, etc., which does not react on the solder 2 directly, corresponding upon the fine pad part of the semiconductor. This sheet 1 is held by an elevating mechanism 7 going vertically in the molten solder tank 3 and dipped in the solder 2 in the tank 3 through a gap between rotary rolls 5. Just before the sheet 1 is drawn up from the tank 3, the side of the sheet 1 is held by a structure 9 having a sharp shaped solder part at the point and an internal passage for cooling water under a fixed pressure. Under this state, the sheet 1 is drawn up, the solder in the holes 1A is fed forcibly by the rolls 5 rotating in the B- directions and the forcibly fed solder 2A is shaped by the structure 9 to manufacture a solder ball carrier.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method and apparatus for manufacturing a solder ball carrier that can uniformly and collectively form a large number of minute solder bumps on high-density connection pads of a semiconductor device. .

[Conventional technology]

In the conventional manufacturing method of a solder ball carrier, as a method of supplying solder to a semiconductor component, in addition to the generally known methods of solder vapor deposition and solder plating, as shown in FIG. (see publication), substrate 19
A method has been proposed in which a groove is provided in the solder paste 20, the solder paste 20 is filled in the solder paste 20, the solder paste 20 is heated and formed into a ball shape, and then the solder paste 20 is supplied to the mounting portion.

[Problem to be solved by the invention]

In the prior art, when Sn-based solder is deposited on a substrate using a solder deposition method, it takes a long time to obtain a predetermined plate due to the vapor pressure of Sn, that is, the high melting temperature. In addition, since solder plating and solder=3-paste printing methods are a mixture of both, the plating film thickness and solder particle size vary widely, and problems may occur due to insufficient or variable amounts of solder at solder joints in high-density mounting. There have been problems in that uniform connection bump formation significantly reduces connection reliability.

An object of the present invention is to provide a method and apparatus for manufacturing a high-precision solder ball carrier that can collectively form a large number of minute, uniform, and constant amount solder bumps on a semiconductor device having a high-density connection pad portion. It is in.

[Means to solve the problem]

In order to achieve the above object, the method for manufacturing a solder ball carrier according to the present invention includes forming through holes in a sheet that does not melt and react with solder, immersing the sheet in a bath of molten solder, and press-fitting solder into the through holes. , is configured to shape, cool and solidify the press-fit solder.

The solder ball carrier manufacturing equipment consists of a lifting mechanism that lifts and lowers the sheet into a molten solder tank, a plurality of rotary wheels that press-fit solder into the through-holes of the sheet, and a structure that shapes, cools, and solidifies the press-fit solder. The rotary roll is installed in or on the solder bath in the molten solder bath.

In addition, the structure consists of a shaping section that is located adjacent to the rotating roll and that shapes the press-fitted solder that has been press-fitted into the through-hole of the sheet, and a cooling section that cools and solidifies the shaped solder. It is equipped with a control mechanism that interlocks the operations of the rotating roll and the structure.

Furthermore, the rotating roll may be formed of ceramics, and the surface may be coated with a metal material that has a low melting reaction with solder, or this metal material.

The sheet is formed so that the vertical cross-sectional area of one open end of the through-hole is larger than the vertical cross-sectional area of the open end of the other side, and the vertical cross-sectional shape of each open end of the through-hole is asymmetrical with respect to the tangent line touching each other. It may be formed into a trapezoid or a thousand circular shape.

Furthermore, a sheet with through holes is installed on a preheating board, and the solder dripped from one side of the sheet is pressed into the through hole by the movement of a rotating roll, and the press-fit solder is shaped and cooled by following the rotating roll. - A method for manufacturing a solder ball carrier that solidifies may be used, and a preheating plate on which the sheet is installed, a supply jig that moves while dripping solder from the - side of sea 1-, and a supply jig that moves while press-fitting the solder into the sheet. An apparatus for manufacturing a solder ball carrier may be used, which includes at least one rotating roll and a structure that moves following the rotating roll to shape, cool and solidify the press-fit solder.

[Effect]

According to the present invention, in the method and apparatus for manufacturing a solder ball carrier, the rotation roll installed in or on the molten solder bath is released from rotating in the normal direction when the lifting mechanism lowers the sheet held by it. When the sheet is raised by 1, the left and right rotating rolls rotate so as to apply load pressure to the sheet.

Furthermore, when the elevating mechanism descends, the structures that perform shaping, cooling, and solidification are left and right away from the sheet, and sandwich the sheet under constant pressure just before the sheet is raised via the rotating rolls. Next, the sheet is raised and the solder press-fitted into the through holes is cooled and solidified in the cooling section while a portion of the solder that is more than the thickness of the sheet is removed in the shaping section.

In accordance with the operation of the elevating mechanism that holds the sheet, the operations of the shaping, cooling and solidifying structure and the rotating rolls are interlocked with each other.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 to 9.

As shown in FIGS. 1 to 4, the method for manufacturing a solder ball carrier includes forming through holes IA in a sheet 1 that does not melt and react with solder 2, and dipping the sheet 1 in a molten solder bath 3. Press fit solder 2 into through hole IA,
It is configured to shape, cool and solidify the press-fit solder 2A.

The ball carrier manufacturing apparatus includes an elevating mechanism 7 that raises and lowers the sheet 1 into the molten solder bath 3, a plurality of rotating rolls 5 that press-fits the solder 2 into the through-hole IA of the sheet 1, and shapes the press-fit solder 2A. and the structure 9 to be cooled and solidified.
The rotary roll 5 is provided in or on the bath surface of the solder 2 in the molten solder bath 3.

Further, the structure 9 is provided adjacent to the rotating roll 5, and includes a shaping section 9A for shaping the press-fit solder 2A press-fitted into the through-hole LA of the sheet 1, and a shaping section 9A for cooling and shaping the press-fit solder 2A after shaping.
It consists of a cooling part 9B that solidifies, and is equipped with a control mechanism 12 that interlocks the operations of the rotating roll 5 and the structure 9 based on the operation signal of the lifting mechanism 7.

Furthermore, the rotating roll 5 is formed of ceramics, and the solder 2
It may also be formed by coating the surface with a metal material that has a small melting reaction or by coating the surface with this metal material.

As shown in FIGS. 12 and 13, the sheet 1 is formed so that the vertical cross-sectional area of one open end of the through-hole IA is larger than that of the other open end, and each of the through-holes IA is The vertical cross-sectional shape of the open end may be formed into a trapezoidal or semicircular shape that is asymmetrical with respect to tangent lines that touch each other.

Further, as shown in FIG. 14, a sheet 1 having through-holes IA is placed on a preheating plate 3A, and solder 2 dripped from one side of the sheet 1 is press-fitted into the through-holes IA by moving the rotating roll 5. , a method for manufacturing a solder ball carrier in which the press-fit solder 2A is shaped, cooled and solidified by following the rotating roll 5, and a preheating plate 3A on which the sheet 1 is installed, and the solder 2 is dripped from one side of the sheet 1. The supply jig 13 moves while press-fitting the solder 2 into the sheet 1, and at least one rotating roll 5 moves while press-fitting the solder 2 into the sheet 1. An apparatus for manufacturing a solder ball carrier comprising a structure 9 that solidifies may also be used.

Next, the operation of this embodiment will be explained.

A minute conical through hole I is formed in the sheet 1 (for example, stainless steel or ceramic thin plate) that does not directly melt and react with the solder 2, corresponding to the minute pad portion of the semiconductor.
The solder ball carrier is manufactured by drilling a hole A and press-fitting the press-fitting solder 2A into the through-hole IA. In this case, the amount of solder must be controlled with high precision in order to form minute solder bumps on the minute pad portions of the semiconductor. 2A of press-fit solder was press-fitted for that purpose.
needs to be shaped to be equal to the thickness of sheet 1.

As shown in FIG. 4, the solder 2 heated and melted by the heating element 4 of the molten solder bath 3, for example, Sn40wt%pb (
Two heat-resistant rotating rolls 5 are placed facing each other on the surface of a solder bath having a melting point of 183° C. for solid phase and 190° C. for liquid phase. In this case, the solder 2 is heated and maintained at about 200°C.

On the other hand, above this molten solder bath 3, a sheet 1 having minute through holes (through holes), for example, a thin plate made of stainless steel or ceramics, is held by an elevating mechanism 7 having an elevating function as indicated by an elevating arrow A. The solder is immersed in the molten solder 2 through the rotating rolls 5 of the solder. In this case, the rotating roll is allowed to freely rotate left and right while the movement in the rotational direction arrow B, that is, the rotational movement in the normal direction is stopped. Immediately before pulling up the sheet 1 from the molten solder bath 3, a structure 9 equipped with a cooling section 9B having a solder shaping section 9A with an acute angle at the tip and a cooling water flow path 11 inside is used to cover the side surface of the sheet 1-1. is sandwiched with a constant pressure so that the excess solder other than the sheet thickness can be shaped. When pulling up the sheet from the molten solder bath 3 in this state,
The rotating roll 5 rotates in a normal rotation direction arrow B. By pulling up the sheet 1 in this way, the solder ball carrier can be easily manufactured. It's under control.

5 to 9 show the movements of each part in the same series when manufacturing a solder ball carrier.

As shown in FIG. 5, when the elevating mechanism 7 holding the sheet 1 descends, the structure 9 equipped with a sharp shaping section and a cooling section is spaced apart from the left and right sides of the sheet 1. The rotating roll 5 for press-fitting the solder into the through-hole moves freely in the reverse rotation direction C at the time of press-fitting and guides the sheet 1 into the molten solder 2.

FIG. 6 shows a state in which the through holes, which are the main parts of the sheet 1, have entered the molten solder bath, and in this state, the molten solder has not yet completely entered the through holes.

Figure 7 shows the sheet starting to be pulled up from the molten solder bath, and the rotating roll moves the molten solder 2B onto the sheet.
Raise it up and rotate B while press-fitting. Immediately before that, a structure 9 including a sharp shaping section and a cooling section slides horizontally D.
and press each side of the sheet with constant pressure. In this state, by lifting the sheet with the elevating mechanism 7, the excess press-fit solder on the sheet surface is removed while being cooled and solidified in the cooling section, and is formed into the through-hole of the sheet through the process shown in FIGS. 8 and 9. The press-fit solder 2A is filled and shaped to complete a solder ball carrier.

The operation of another embodiment of the present invention will be explained with reference to FIG.

As shown in FIG. 10, the solder 2 in the molten solder bath 3
A high-temperature rotating roll 5, for example, a ceramic material, a metal material that has little melting reaction with the solder 2, or a ceramic coated with a metal that has little melting reaction is placed on the bath surface. A sheet 1 having through-holes is inserted between each rotating roll, and when the sheet 1 is pulled up, molten solder 2 is press-fitted by the rotating roll, and the sheet 1 is pulled up and the press-fitted solder is cooled and solidified in a cooling atmosphere, thereby achieving mass production. This is a device that can manufacture solder ball carriers. In order to reliably press fit the solder into the through-holes of the sheet with this device, it is highly effective to install a rotating roll 5A in the molten solder bath.

The operation of another embodiment of the present invention will be explained with reference to FIG.

Right above the solder bath surface of the molten solder tank 3, a structure 9 that is symmetrical in left and right directions is installed. Each structure 9 has a structure in which the tip part can shape the solder 2 to the thickness of the sheet 1, and has a water flow path inside to cool and solidify the solder. Further, an ultrasonic oscillation horn is placed in the molten solder bath so as to face the through-hole surface of the sheet 1.

A sheet 1 having through holes is placed in a molten solder bath,
The ultrasonic horn 2
The vibration wave of No. 1 propagates through the molten solder, eliminates the air in the through hole, and allows the solder to enter. Next, the seat 1 is pulled up in the direction of the lifting arrow A. In this case, by holding the sheet 1 between the structures 9 and bowing it while applying constant pressure, the solder 2 that has entered the through hole of the sheet 1 is shaped at the tip of the structure 9 and cooled inside.・This is a device that can solidify solder ball carriers.

1-4 show another embodiment of the invention and explain its operation.

The sheet 1 having through-holes is coated with solder to an extent that the solder does not melt, such as 5N-40% PB solder (melting point: 183~
190°C), place the sheet 1 on the preheating plate 3A preheated to 170°C or less, and drop molten solder 2 into the through hole from the end side of the sheet 1 using the supply jig 13. It is supplied to the entire area by moving it while moving. Following the movement of the molten solder supply jig 13, the molten solder 2 is moved while being press-fitted into the through hole using a high-temperature rotating roll 5. Furthermore, in order to prevent the press-fitted solder of the press-fitted through-hole from popping out by following the roll 5, and to remove the solder in areas other than the through-hole, the tip has a shaping function part and the water flow inside. A structure 9 having a channel 11 for cooling and solidifying the solder 2
This is a manufacturing method and apparatus that can manufacture a solder ball carrier by moving a solder ball carrier.

Other embodiments of the present invention will be supplementarily explained with reference to FIGS. 12 and 13.

Fig. 12 shows the longitudinal cross-sectional shape of a through hole in which solder 2A is press-fitted into the through hole of sheet 1 and cooled and solidified. [vertical length of the open end]5 The cross-sectional area is larger than 16 to make it easier to press-fit the solder 2A.

In Fig. 13, the vertical cross-sectional shape of the through-hole in sheet 1 consists of asymmetrical trapezoids (17 and 18), and the press-fitted solder 2A is remelted to form a solder ball and supplied to other parts. In this case, the solder is moved in one direction, that is, to the larger volume by the surface tension of the molten metal, and the solder ball is positioned as high as possible above the seam I surface to facilitate supply. .

〔Effect of the invention〕

According to the present invention, in the method and apparatus for manufacturing a solder ball carrier, the solder ball is press-fitted into the through hole of the sheet, then shaped, cooled and solidified, thereby producing an inexpensive solder ball that can supply a minute amount of solder with high precision. The carrier can be obtained in mass production, and therefore, by supplying it to the semiconductor component, it is possible to obtain a semiconductor device having an inexpensive and highly reliable solder joint.

[Brief Description of the Drawings] Fig. 1 is a perspective view showing an embodiment of the seal l- of the present invention, Fig. 2 is a sectional view taken along the line ■ and ■ in Fig. 1, and Fig. 3 is the same as Fig. 2. 4 is a longitudinal sectional view of a manufacturing apparatus showing an embodiment of the present invention; FIGS. 5 to 9 are diagrams illustrating the manufacturing process of an embodiment of the present invention; FIG. , FIGS. 10 to 14 are cross-sectional views showing other embodiments of the present invention, and FIG. 15 is a cross-sectional view showing a conventional technique. 1... Sheet, IA... Through hole, 2... Solder, 2A... Press-fit solder, 3... Molten solder bath, 5...
... Rotating roll, 7. Lifting mechanism, 9... Structure.

Claims (11)

[Claims] 1. The method is characterized in that a through hole is formed in a sheet that does not melt and react with the solder, the sheet is immersed in a molten solder bath, the solder is press-fitted into the through-hole, and the press-fitted solder is shaped and cooled and solidified. Method of manufacturing solder ball carriers. 2. It is characterized by comprising an elevating mechanism for elevating and lowering the sheet into a molten solder tank, a plurality of rotating rolls for press-fitting solder into the through-holes of the sheet, and a structure for shaping, cooling and solidifying the press-fit solder. Solder ball carrier manufacturing equipment. 3. 3. The apparatus for manufacturing a solder ball carrier according to claim 2, wherein the rotating roll is provided in or on the bath surface of the solder in the molten solder bath. 4. The structure is characterized by comprising a shaping section that is provided adjacent to the rotating roll and that shapes the press-fit solder press-fitted into the through-hole of the sheet, and a cooling section that cools and solidifies the press-fit solder after the shaping. 3. The solder ball carrier manufacturing apparatus according to claim 2. 5. 5. The solder ball carrier manufacturing apparatus according to claim 2, further comprising a control mechanism that interlocks the operations of the rotating roll and the structure based on an operation signal of the lifting mechanism. 6. 4. The solder ball carrier manufacturing apparatus according to claim 2, wherein the rotating roll is made of ceramic. 7. 4. The apparatus for manufacturing a solder ball carrier according to claim 2, wherein the rotating roll is formed of a metal material that has a small melting reaction with the solder, or whose surface is coated with the metal material. 8. 1. A sheet for a solder ball carrier manufacturing device, characterized in that the vertical cross-sectional area of one open end of a through-hole is larger than the vertical cross-sectional area of the other open end. 9. 9. The sheet for a solder ball carrier manufacturing apparatus according to claim 8, wherein the vertical cross-sectional shape of each open end of the through hole is formed into a trapezoidal or semicircular shape asymmetrical with respect to tangent lines that touch each other. 10. Place the sheet with through holes on the preheating board,
The solder ball carrier is characterized in that the solder dripped from one side of the sheet is press-fitted into the through hole by the movement of a rotating roll, and the press-fitted solder is shaped, cooled and solidified by following the rotating roll. Production method. 11. a preheating plate on which the sheet is placed; a supply jig that moves while dropping solder from one side of the sheet; and at least one supply jig that moves while press-fitting the solder onto the sheet.
1. An apparatus for manufacturing a solder ball carrier, comprising a rotating roll and a structure that moves following the rotating roll to shape, cool and solidify press-fit solder.