JPS5457957A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5457957A
JPS5457957A JP12548177A JP12548177A JPS5457957A JP S5457957 A JPS5457957 A JP S5457957A JP 12548177 A JP12548177 A JP 12548177A JP 12548177 A JP12548177 A JP 12548177A JP S5457957 A JPS5457957 A JP S5457957A
Authority
JP
Japan
Prior art keywords
layer
substrate
solder
adhere
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12548177A
Other languages
Japanese (ja)
Inventor
Takeshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12548177A priority Critical patent/JPS5457957A/en
Publication of JPS5457957A publication Critical patent/JPS5457957A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To produce good-quality semiconductor devices in mass production by providing a desired-pattern metallic layer and causing a soldering paste layer to adhere to it by printing, and heating and solidifying this layer to form a uniform soler layer.
CONSTITUTION: Soldering paste 5 is caused to adhere only onto layer 3 of Si substrate 1, where metallic layer 3 is provided, by screen printing. Next, the substrate is heated at 100°C for about 50 minutes, and the paste is solidified to form a uniform-thickness film. After that, the substrate is divided into chips, and chips are brought into contact with prescribed metallic electrodes and are heated over a solder melting point and are soldered. The thickness of the solder layer is arbitrarily controlled between 30μ and 100μ by this method, so that semiconductor devices can be produced in mass production without solder fatigue and the increment of power loss
COPYRIGHT: (C)1979,JPO&Japio
JP12548177A 1977-10-18 1977-10-18 Production of semiconductor device Pending JPS5457957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12548177A JPS5457957A (en) 1977-10-18 1977-10-18 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12548177A JPS5457957A (en) 1977-10-18 1977-10-18 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5457957A true JPS5457957A (en) 1979-05-10

Family

ID=14911147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12548177A Pending JPS5457957A (en) 1977-10-18 1977-10-18 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5457957A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device
JPS5966132A (en) * 1982-10-08 1984-04-14 Fujitsu Ltd Manufacture of semiconductor device
JPS62260392A (en) * 1986-05-07 1987-11-12 松下電器産業株式会社 Printed wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102559A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102559A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device
JPS5966132A (en) * 1982-10-08 1984-04-14 Fujitsu Ltd Manufacture of semiconductor device
JPS62260392A (en) * 1986-05-07 1987-11-12 松下電器産業株式会社 Printed wiring board

Similar Documents

Publication Publication Date Title
JPS55111127A (en) Method for forming solder bump
JPS5238885A (en) Method for production of semiconductor device
DE2528000B2 (en) Method for producing a soldering surface of relatively large dimensions
JPS55136562A (en) Ultrasonic pre-soldering method and apparatus thereof
JPS55156339A (en) Forming method of bump electrode
JPS5422162A (en) Manufacture of semiconductor device
JPS5577164A (en) Semiconductor device
JPS54139391A (en) Production of piezo-electric porcelain parts
JPS52152165A (en) Formation of solder bump electrode
JPS54113253A (en) Bonding method of semiconductor pellet
JPS5485155A (en) Forming method for solder layer
JPS5352067A (en) Pellet fitting method to metallic substrate
JPS533066A (en) Electrode formation method
JPS5361973A (en) Production of semiconductor element
JPS559413A (en) Manufacturing method of thin film circuit
JPS52102670A (en) Formation of extruding electrode in semiconductor device
JPS53108279A (en) Manufacture of substrate for mounting electronic parts
JPS52131459A (en) Small piece soldering method
JPS544067A (en) Electrode forming method of semiconductor device
JPS5384678A (en) Electrode forming method of semiconductor device
JPS5414675A (en) Bonding method for semiconductor elements
JPS5419690A (en) Electrode of semiconductor devices
JPS51112268A (en) Semiconductor device and its production method
JPS54113255A (en) Partial plating method of lead frame for semiconductor device
JPS5224467A (en) Mounting method of electric element